|
English
|
正體中文
|
简体中文
|
总笔数 :0
|
|
造访人次 :
52849753
在线人数 :
684
教育部委托研究计画 计画执行:国立台湾大学图书馆
|
|
|
显示项目 886486-886495 / 2348793 (共234880页) << < 88644 88645 88646 88647 88648 88649 88650 88651 88652 88653 > >> 每页显示[10|25|50]项目
| 臺大學術典藏 |
2019-12-27T07:49:41Z |
Transmission electron microscopy characterization of HfO 2/GaAs(001) heterostructures grown by molecular beam epitaxy
|
Liou, S.C.; Chu, M.-W.; Chen, C.H.; Lee, Y.J.; Chang, P.; Lee, W.C.; Hong, M.; Kwo, J.; MINGHWEI HONG |
| 臺大學術典藏 |
2018-09-10T07:01:20Z |
Transmission electron microscopy characterization of HfO2/GaAs (001) heterostructures grown by molecular beam epitaxy
|
Liou, SC; Chu, M-W; Chen, CH; Lee, YJ; Chang, P; Lee, WC; Hong, M; Kwo, J; MINGHWEI HONG |
| 國立臺灣大學 |
2008-06 |
Transmission electron microscopy characterization of HfO2/GaAs(001) heterostructures grown by molecular beam epitaxy
|
Liou, SC; Chu, MW; Chen, CH |
| 國立臺灣大學 |
2010 |
Transmission Electron Microscopy Characterization of Ni(V) Metallization Stressed Under High Current Density in Flip Chip Solder Joints
|
Tsai, M.Y.; Lin, Y.L.; Lin, Y.W.; Ke, J.H.; Kao, C.R. |
| 臺大學術典藏 |
2019-11-27T02:02:48Z |
Transmission electron microscopy characterization of the porous structure induced by high current density in the flip-chip solder joints
|
C. ROBERT KAO;Kao C.R.;Lin Y.-L.;Tsai M.-Y.; Tsai M.-Y.; Lin Y.-L.; Kao C.R.; C. ROBERT KAO |
| 國立中山大學 |
1990 |
Transmission Electron Microscopy Observations of Fatigue Deformation in Fe-19Cr-4Ni-2Al Alloy
|
N.J. Ho;S.C. Tjong;Y.C. Chang |
| 國立交通大學 |
2014-12-08T15:15:56Z |
Transmission electron microscopy studies of GaAs nanostructures in InGaAs/InP matrix grown by molecular beam epitaxy
|
Lin, S. D.; Lin, Z. C.; Lee, C. P. |
| 臺大學術典藏 |
2018-09-10T06:22:02Z |
Transmission electron microscopy studies of the martensitic transformation in a Ti50Ni45Au5 alloy
|
SHYI-KAAN WU;Wayman, C.M.;Wu, S.K.;SHYI-KAAN WU; Wu, S.K.; Wayman, C.M.; SHYI-KAAN WU |
| 國立臺灣科技大學 |
1993 |
Transmission Electron Microscopy Study of Domain Boundaries in PbTiO3
|
C. C. Chou;L.C. Yang ;C. M. Wayman |
| 臺大學術典藏 |
2020-05-12T02:52:45Z |
Transmission electron microscopy study of infrared brazed titanium alloy using clad Ti-25Cu-15Ni filler
|
Wu, Z.Y.; Shiue, R.K.; Chang, C.S.; REN-KAE SHIUE |
显示项目 886486-886495 / 2348793 (共234880页) << < 88644 88645 88646 88647 88648 88649 88650 88651 88652 88653 > >> 每页显示[10|25|50]项目
|