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显示项目 918071-918080 / 2348406 (共234841页)
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| 中原大學 |
2002-03-26 |
Wafer rinse tank for metal etching and method for using
|
陳志吉;鍾子揚;王思堯;潘昇良 |
| 國立交通大學 |
2017-04-21T06:56:39Z |
Wafer Scale Phase-Engineered 1T-and 2H-MoSe2/Mo Core-Shell 3D-Hierarchical Nanostructures toward Efficient Electrocatalytic Hydrogen Evolution Reaction
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Qu, Yindong; Medina, Henry; Wang, Sheng-Wen; Wang, Yi-Chung; Chen, Chia-Wei; Su, Teng-Yu; Manikandan, Arumugam; Wang, Kuangye; Shih, Yu-Chuan; Chang, Je-Wei; Kuo, Hao-Chung; Lee, Chi-Yung; Lu, Shih-Yuan; Shen, Guozhen; Wang, Zhiming M.; Chueh, Yu-Lun |
| 國立交通大學 |
2018-08-21T05:56:49Z |
WAFER SIZE MOS2 WITH FEW MONOLAYER SYNTHESIZED BY H2S SULFURIZATION
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Ho, Yen-Teng; Chu, Yung-Ching; Wei, Lin-Lung; Luong, Tien-Tung; Lin, Chih-Chien; Cheng, Chun-Hung; Hsu, Hung-Ru; Tu, Yung-Yi; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:47:47Z |
Wafer Sort Bitmap Data Analysis Using the PCA-Based Approach for Yield Analysis and Optimization
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Hsieh, Yeou-lang; Tzeng, Gwo-hshiung; Lin, T. R.; Yu, Hsiao-cheng |
| 國立彰化師範大學 |
2000-04 |
Wafer-Bonded AlGaInP/Au/AuBe/SiO2/Si Light-Emitting Diodes
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Horng, Ray-Hua; Wuu, Dong-Sing; Wei, Sun-Chin; Tseng, Chung-Yang; Huang, Man-Fang; Chang, Kuo-Hsiung; Liu, Pin-Hui; Lin, Kun-Chuan |
| 國立彰化師範大學 |
1999 |
Wafer-bonded InGaAlP/AuBe/glass Light-emitting Diodes
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Horng, R. H. ; Wuu, D. S. ; Tseng, H. W. ; Wei, S. C. ; Huang, Man-Fang; Chang, K. H. ; Liu, P. H. ; Lin, K. C. |
| 國立交通大學 |
2014-12-08T15:20:30Z |
WAFER-LEVEL CHIP SCALE FLEXIBLE WIRELESS MICROSYSTEM FABRICATION
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Chao, Tzu-Yuan; Cheng, Y. T. |
| 國立交通大學 |
2014-12-08T15:21:23Z |
Wafer-level Cu-Cu bonding technology
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Tang, Ya-Sheng; Chang, Yao-Jen; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:49:09Z |
Wafer-Level MOSFET with Submicron Photolysis Polymer Temporary Bonding Technology Using Ultra-Fast Laser Ablation for 3DIC Application
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Cheng, Chuan-An; Huang, Yu-Hsiang; Lin, Chicn-Hung; Lee, Chia-Lin; Yang, Shan-Chun; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:38:24Z |
Wafer-Level Self-Aligned Nano Tubular Structures and Templates for Device Applications
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Chen, K. N.; Arnold, J. C. |
显示项目 918071-918080 / 2348406 (共234841页)
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