| 臺北醫學大學 |
2005 |
Bond strength of light-cured composite resin using various light sources
|
黃豪銘; Hwang SD; Tsai CM; Teng NC; Huang HM; Lee SY; Wang WN |
| 臺北醫學大學 |
2010 |
Bond strength of orthodontic light-cured resin-modified glass ionomer cement
|
CY, Chen;CH, Chen;CL, Li;HH, Tsai;TH, Chou;WN, Wang |
| 臺北醫學大學 |
2011 |
Bond strength of orthodontic light-cured resin-modified glass ionomer cement
|
CY, Chen;CH, Chen;CL, Li;HH, Tsai;TH, Chou;WN, Wang |
| 臺北醫學大學 |
2011 |
Bond strength of orthodontic light-cured resin-modified glass ionomer cement
|
Chen, CY;Chen, CH;Li, CL;Tsai, HH;Chou, TH;Wang, WN |
| 臺北醫學大學 |
2010 |
Bond strength of orthodontic light-cured resin-modified glass ionomer cement
|
Chen, CY;Chen, CH;Li, CL;Tsai, HH;Chou, TH;Wang, WN |
| 大葉大學 |
2013-01 |
Bond strength of Ti-5Cr based alloys to dental porcelain with Mo addition.
|
HO, WEN-FU;Wu, Shih-Ching;Hsu, Shih-Kuang;Fang, Lih-Sheng;Hsu, Hsueh-Chuan |
| 臺北醫學大學 |
2004 |
Bond strength of various bracket base designs
|
林利香; 林哲堂; Wei Nan Wang; Chung Hsing Li; Ta Hsiung Chou; Dennis Ding Hwa Wang; Li Hsiang Lin; Che Tong Lin |
| 臺北醫學大學 |
2004 |
Bond strength of various bracket base designs
|
王蔚南; 林哲堂; Wang WNLi CHChou THWang DDHLin LHLin CT |
| 大葉大學 |
2013-10-19 |
Bond strengths between Ti-25Nb-xSn alloys and low-fusing porcelain.
|
Hsu, Hsueh-Chuan;Lin, Yi-Hsin;HO, WEN-FU;Wu, Shih-Ching;Hsu, Shih-Kuang |
| 國立臺灣大學 |
2003-10 |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee, BS; Hsieh, TT; Lee, YL; Lan, WH; Hsu, YJ; Wen, PH; Lin, CP |
| 臺大學術典藏 |
2018-09-10T04:25:44Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; CHUN-PIN LIN |
| 臺大學術典藏 |
2018-09-10T04:25:46Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; BOR-SHIUNN LEE |
| 臺大學術典藏 |
2018-09-10T04:25:50Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; YUAN-LING LEE |
| 臺大學術典藏 |
2021-07-05T07:35:52Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee B.-S.; Hsieh T.-T.; YUAN-LING LEE; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; Lin C.-P. |
| 臺大學術典藏 |
2021-07-26T06:53:20Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee B.-S.; Hsieh T.-T.; Lee Y.-L.; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; CHUN-PIN LIN |
| 臺大學術典藏 |
2021-07-05T03:41:30Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
BOR-SHIUNN LEE; Hsieh T.-T.; Lee Y.-L.; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; Lin C.-P. |
| 國立成功大學 |
2008-03 |
Bond structure in porous SiOCH low-k film fabricated by ultraviolet irradiation
|
Huang, Chun-Hsien; Huang, Hui-Ling; Hung, Chen I.; Wang, Na-Fu; Wang, Yeong-Her; Houng, Mau-Phon |
| 國立成功大學 |
2001-01-05 |
Bond types of molecular orbitals and the photoelectron spectrum
|
Lee, Hsing-Yi; Wang, Shao-Pin; Chang, Tse-Chiang |
| 國立成功大學 |
2020 |
Bond-breaking induced lifshitz transition in robust dirac semimetal VAI3
|
Liu, Y.;Liu, Y.-F.;Gui, X.;Xiang, C.;Zhou, H.-B.;Hsu, C.-H.;Lin, H.;Chang, T.-R.;Xie, W.;Jia, S. |
| 國立成功大學 |
2016-01 |
Bond-Pad Charging Protection Design for Charging-Free Reference Transistor Test Structures
|
Lin, Wallace |
| 國立臺灣科技大學 |
2017 |
Bond-slip responses of stainless reinforcing bars in grouted ducts
|
Zhou, Y;Ou, Y.-C;Lee, G.C. |
| 臺大學術典藏 |
2018-09-10T06:25:23Z |
Bond-specific chemical cleavages of peptides and proteins with perfluoric acid vapors: Novel peptide bond cleavages of glycyl-threonine, the amino side of serine residues and the carboxyl side of aspartic acid residues
|
Kawakami, T. and Kamo, M. and Takamoto, K. and Miyazaki, K. and Chow, L.-P. and Ueno, Y. and Tsugita, A.; LU-PING CHOW |
| 臺大學術典藏 |
2020-01-22T04:48:05Z |
Bond-specific chemical cleavages of peptides and proteins with perfluoric acid vapors: Novel peptide bond cleavages of glycyl-threonine, the amino side of serine residues and the carboxyl side of aspartic acid residues
|
Kawakami T.; Kamo M.; Takamoto K.; Miyazaki K.; LU-PING CHOW; Ueno Y.; Tsugita A. |
| 國立交通大學 |
2014-12-08T15:03:31Z |
BOND-STRUCTURE CHANGES OF LIQUID-PHASE DEPOSITED OXIDE (SIO2-XFX) ON N2 ANNEALING
|
YEH, CF; CHEN, CL; LUR, W; YEN, PW |
| 義守大學 |
2007-10 |
Bondability Study and Correlation of Capillary Enhanced Profile with NiPdAu Pre-Plating Frame
|
Hsiang-Chen Hsu;Jerry HS Cheng;Chun-Da Lee;Wen-Lo Shieh |
