| 臺大學術典藏 |
2019-11-27T02:02:19Z |
Bonding of copper pillars using electroless Au plating
|
C. ROBERT KAO;Kao C.R.;Chen Y.H.;Yang S.;Hung H.T.;Weng I.A.; Weng I.A.; Hung H.T.; Yang S.; Chen Y.H.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:13Z |
Bonding of Copper Pillars Using Electroless Cu Plating
|
C. ROBERT KAO;Kao C.R.;Chen Y.H.;Hung H.T.;Kao L.Y.; Kao L.Y.; Hung H.T.; Chen Y.H.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:24Z |
Bonding of copper pillars using electroless Ni plating
|
C. ROBERT KAO;Kao C.R.;Chen Y.B.;Hung H.T.;Yang S.; Yang S.; Hung H.T.; Chen Y.B.; Kao C.R.; C. ROBERT KAO |
| 國立臺灣大學 |
1992-05 |
Bonding of Structural Plywood with PMF System
|
蔡金木; Tsai, Ching-Mu |
| 中國文化大學 |
2012-11 |
Bonding properties and isomeric conversion pathways from exohedral to endohedral BeGe8 clusters
|
Hung, YM (Hung, Yu-Ming); Ho, GM (Ho, Gong-Ming); Zhang, ZF (Zhang, Zhen-Feng) |
| 中國文化大學 |
2012-09-19 |
Bonding Properties and Isomeric Conversion Pathways from Exohedral to Endohedral BeGe8 Clusters
|
Hung, Yu-Ming; Ho, Gong-Ming; Zhang, Zhen-Feng |
| 中國文化大學 |
2012 |
Bonding properties and isomeric conversion pathways from exohedral to endohedral BeGe8 clusters
|
洪祐明等著 |
| 中國文化大學 |
2012 |
Bonding properties and isomeric conversion pathways from exohedral to endohedral BeGe8 clusters
|
洪祐明 |
| 中國文化大學 |
2013-03-15 |
Bonding properties and isomeric conversion pathways of singlet BeSi4 clusters
|
Hung, YM (Hung, Yu-Ming); Chen, SS (Chen, Shih-Sun); Huang, YC (Huang, Yen-Chang) |
| 淡江大學 |
2005-04-18 |
Bonding properties and their relation to residual stress and refractive index of amorphous Ta(N,O) films investigated by x-ray absorption spectroscopy
|
Jan, J. C.; Babu, P. D.; Tsai, H. M.; Pao, C. W.; Chiou, J. W.; Ray, S. C.; Krishna Kumar, K. P.; 彭維鋒; Pong, W. F.; Tsai, M. H.; Jong, C. A.; Chin, T. S. |
| 淡江大學 |
2005-04 |
Bonding properties and their relation to residual stress and refractive index of amorphous Ta(N,O) films investigated by x-ray absorption spectroscopy
|
Jan, J. C.; Babu, P. D.; Tsai, H. M.; Pao, C. W.; Chiou, J. W.; Ray, S. C.; Krishna Kumar, K. P.; Pong, W. F.; Tsai, M.-H.; Jong, C. A.; Chin, T. S. |
| 國立中山大學 |
2005 |
Bonding properties and their relation to residual stress and refractive index of amorphous Ta(N,O) films investigated by x-ray absorption spectroscopy
|
J.C. Jan;P.D. Babu;H.M. Tsai;C.W. Pao;J.W. Chiou;S.C. Ray;K.P. Krishna Kumar;W.F. Pong;M.H. Tsai;C.A. Jong;T.S. Chin |
| 高雄醫學大學 |
1998 |
Bonding properties of permanent soft lining materials
|
洪純正 |
| 國立政治大學 |
2004-05 |
Bonding Shirking and Adverse Selection
|
林忠正 |
| 大葉大學 |
2008-02 |
Bonding Strength of Dental Ti-Zr Alloys to Dental Porcelain
|
HO, WEN-FU;Hsu, H.C.;Chen, W.K.;Wu, S.C. |
| 元智大學 |
2010-10 |
Bonding strength of pressurized microchannels fabricated by polydimethylsiloxane and silicon
|
Guan-Wei Wu; Wen-Pin Shih; Chung-Yuen Hui; Sih-Li Chen; Chi-Yuan Lee |
| 國立臺灣大學 |
2010 |
Bonding strength of pressurized microchannels fabricated by polydimethylsiloxane and silicon
|
Wu, Guan-Wei; Shih, Wen-Pin; Hui, Chung-Yuen; Chen, Sih-Li; Lee, Chi-Yuan |
| 臺大學術典藏 |
2018-09-10T08:11:13Z |
Bonding strength of pressurized microchannels fabricated by polydimethylsiloxane and silicon
|
Lee, Chi-Yuan;Chen, Sih-Li;Hui, Chung-Yuen;Shih, Wen-Pin;Wu, Guan-Wei;WEN-PIN SHIH;Lee, C.-Y.;Chen, S.-L.;Hui, C.-Y.;Shih, W.-P.;Wu, G.-W.;Lee, Chi-Yuan;Chen, Sih-Li;Hui, Chung-Yuen;Shih, Wen-Pin;Wu, Guan-Wei;Lee, Chi-Yuan;Chen, Sih-Li;Hui, Chung-Yuen;Shih, Wen-Pin;Wu, Guan-Wei;WEN-PIN SHIH; Wu, Guan-Wei; Shih, Wen-Pin; Hui, Chung-Yuen; Chen, Sih-Li; Lee, Chi-Yuan; Wu, G.-W.; Shih, W.-P.; Hui, C.-Y.; Chen, S.-L.; Lee, C.-Y.; WEN-PIN SHIH; Wu, Guan-Wei; Shih, Wen-Pin; Hui, Chung-Yuen; Chen, Sih-Li; Lee, Chi-Yuan |
| 大葉大學 |
2009-02 |
Bonding strength of Ti-20Cr and Ti-10Zr alloys to dental porcelain.
|
Wu, S.C.;HO, WEN-FU;Lin, H.C.;Kikuchi, H.;Hsu, H.C. |
| 國立成功大學 |
2011-12-01 |
Bonding Structure, Dehydrogenation, and Dimerization of 1,3-C(6)H(4) from Decomposition of 1,3-C(6)H(4)I(2) on Cu(100)
|
Liao, Yung-Hsuan; Lin, Yi-Shiue; Wu, Tz-Shiuan; Lin, Shu-Kuan; Lin, Jong-Liang; Fan, Liang-Jen; Yang, Yaw-Wen; Lin, Jiing-Chyuan |
| 元智大學 |
2010-12 |
Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate
|
Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang |
| 元智大學 |
2010-12 |
Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate
|
Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang |
| 元智大學 |
2010-12 |
Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate
|
Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang |
| 國立交通大學 |
2014-12-08T15:28:24Z |
Bonding Temperature Optimization and Property Evolution of SU-8 Material in Metal/Adhesive Hybrid Wafer Bonding
|
Chen, K. N.; Cheng, C. A.; Huang, W. C.; Ko, C. T. |
| 淡江大學 |
2019-04 |
Bonding ties, bridging ties, and firm performance: the moderating role of dynamic capabilities
|
Chang, Y. S. |
