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機構 日期 題名 作者
中國文化大學 2013-03-15 Bonding properties and isomeric conversion pathways of singlet BeSi4 clusters Hung, YM (Hung, Yu-Ming); Chen, SS (Chen, Shih-Sun); Huang, YC (Huang, Yen-Chang)
淡江大學 2005-04-18 Bonding properties and their relation to residual stress and refractive index of amorphous Ta(N,O) films investigated by x-ray absorption spectroscopy Jan, J. C.; Babu, P. D.; Tsai, H. M.; Pao, C. W.; Chiou, J. W.; Ray, S. C.; Krishna Kumar, K. P.; 彭維鋒; Pong, W. F.; Tsai, M. H.; Jong, C. A.; Chin, T. S.
淡江大學 2005-04 Bonding properties and their relation to residual stress and refractive index of amorphous Ta(N,O) films investigated by x-ray absorption spectroscopy Jan, J. C.; Babu, P. D.; Tsai, H. M.; Pao, C. W.; Chiou, J. W.; Ray, S. C.; Krishna Kumar, K. P.; Pong, W. F.; Tsai, M.-H.; Jong, C. A.; Chin, T. S.
國立中山大學 2005 Bonding properties and their relation to residual stress and refractive index of amorphous Ta(N,O) films investigated by x-ray absorption spectroscopy J.C. Jan;P.D. Babu;H.M. Tsai;C.W. Pao;J.W. Chiou;S.C. Ray;K.P. Krishna Kumar;W.F. Pong;M.H. Tsai;C.A. Jong;T.S. Chin
高雄醫學大學 1998 Bonding properties of permanent soft lining materials  洪純正 
國立政治大學 2004-05 Bonding Shirking and Adverse Selection 林忠正
大葉大學 2008-02 Bonding Strength of Dental Ti-Zr Alloys to Dental Porcelain HO, WEN-FU;Hsu, H.C.;Chen, W.K.;Wu, S.C.
元智大學 2010-10 Bonding strength of pressurized microchannels fabricated by polydimethylsiloxane and silicon Guan-Wei Wu; Wen-Pin Shih; Chung-Yuen Hui; Sih-Li Chen; Chi-Yuan Lee
國立臺灣大學 2010 Bonding strength of pressurized microchannels fabricated by polydimethylsiloxane and silicon Wu, Guan-Wei; Shih, Wen-Pin; Hui, Chung-Yuen; Chen, Sih-Li; Lee, Chi-Yuan
臺大學術典藏 2018-09-10T08:11:13Z Bonding strength of pressurized microchannels fabricated by polydimethylsiloxane and silicon Lee, Chi-Yuan;Chen, Sih-Li;Hui, Chung-Yuen;Shih, Wen-Pin;Wu, Guan-Wei;WEN-PIN SHIH;Lee, C.-Y.;Chen, S.-L.;Hui, C.-Y.;Shih, W.-P.;Wu, G.-W.;Lee, Chi-Yuan;Chen, Sih-Li;Hui, Chung-Yuen;Shih, Wen-Pin;Wu, Guan-Wei;Lee, Chi-Yuan;Chen, Sih-Li;Hui, Chung-Yuen;Shih, Wen-Pin;Wu, Guan-Wei;WEN-PIN SHIH; Wu, Guan-Wei; Shih, Wen-Pin; Hui, Chung-Yuen; Chen, Sih-Li; Lee, Chi-Yuan; Wu, G.-W.; Shih, W.-P.; Hui, C.-Y.; Chen, S.-L.; Lee, C.-Y.; WEN-PIN SHIH; Wu, Guan-Wei; Shih, Wen-Pin; Hui, Chung-Yuen; Chen, Sih-Li; Lee, Chi-Yuan
大葉大學 2009-02 Bonding strength of Ti-20Cr and Ti-10Zr alloys to dental porcelain. Wu, S.C.;HO, WEN-FU;Lin, H.C.;Kikuchi, H.;Hsu, H.C.
國立成功大學 2011-12-01 Bonding Structure, Dehydrogenation, and Dimerization of 1,3-C(6)H(4) from Decomposition of 1,3-C(6)H(4)I(2) on Cu(100) Liao, Yung-Hsuan; Lin, Yi-Shiue; Wu, Tz-Shiuan; Lin, Shu-Kuan; Lin, Jong-Liang; Fan, Liang-Jen; Yang, Yaw-Wen; Lin, Jiing-Chyuan
元智大學 2010-12 Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang
元智大學 2010-12 Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang
元智大學 2010-12 Bonding Temperature Effect on the Performance of Flip Chip Assembled 150nm mHEMT Device on Organic Substrate Chien-I Kuo; Wee-Chin Lim; Heng-Tung Hsu; Chin-Te Wang; Li-Han Hsu; Faiz Aizad; Guo-Wei Huang; Yasuyuki Miyamoto; Edward Yi Chang
國立交通大學 2014-12-08T15:28:24Z Bonding Temperature Optimization and Property Evolution of SU-8 Material in Metal/Adhesive Hybrid Wafer Bonding Chen, K. N.; Cheng, C. A.; Huang, W. C.; Ko, C. T.
淡江大學 2019-04 Bonding ties, bridging ties, and firm performance: the moderating role of dynamic capabilities Chang, Y. S.
國立成功大學 2018 Bonding Within Crystal Structures Fang;Tsang-Tse
臺大學術典藏 2003 BondingPlus: A Real-Time LAN Transmission Model using Regular Switching Hub Lin, Hsin-Hung; Hsueh, Chih-Wen; Huang, Guo-Chiuan; Lin, Hsin-hung; Hsueh, Chih-wen; Huang, Guo-Chiuan
國立臺灣大學 2003 BondingPlus: A Real-Time LAN Transmission Model using Regular Switching Hub Lin, Hsin-hung; Hsueh, Chih-wen; Huang, Guo-Chiuan
國立政治大學 2002 Bonds Valuation and Agency Problems--A Contingent Claims Approach under Optimal Capital Structure 廖四郎;G. C. Lyu;H. H. Huang; 呂桔誠;廖四郎;黃星華
嘉南藥理大學 2009 Bone Elsevier SDOL
亞洲大學 2015/04 BONE 姚俊旭;Yao, Chun-Hsu
國立臺灣大學 1999 Bone Alkaline Phosphatase Isoenzyme and Carboxy-Terminal Propeptide of Type-I Procollagen in Healthy 蔡克嵩; 徐慧貞; 鄭文誠; 張美惠; TSAI, KEH-SUNG; HSU, SANDY HUEY-JEN; CHENG, WERN-CHERNG; CHANG, MEI-HWEI
臺大學術典藏 2021-05-05T06:12:10Z Bone alkaline phosphatase isoenzyme and carboxy-terminal propeptide of type-I procollagen in healthy Chinese girls and boys Tsai K.-S.; Jang M.-H.; Hsu S.H.-J.; WERN-CHERNG CHENG; Chang M.-H.

顯示項目 227746-227770 / 2311512 (共92461頁)
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