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顯示項目 298351-298375 / 2347237 (共93890頁)
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機構 日期 題名 作者
臺大學術典藏 2018-09-10T04:47:31Z Curing and Pyrolysis of Cresol Novolac Epoxy Resins Containing [2-(6-oxido-6H-dibenz(c,e) (1,2)oxaphosphorin-6-yl)-1,4-naphthalenediol] Rwei, S.-P.; Liu, A.-Y.; Liou, G.-S.; Cheng, K.-C.; Guo, W.; GUEY-SHENG LIOU
國立暨南國際大學 2004 Curing and pyrolysis of cresol novolac epoxy resins containing [2-(6-oxido-6H-dibenz(c,e) (1,2)oxaphosphorin-6-yl)-1,4-naphthalenediol]? 劉貴生; Liou, GS
國立暨南國際大學 2003 Curing and pyrolysis of epoxy resins containing 2-(6-oxido-6H-dibenz(c,e)(1,2)oxaphosphorin-6-yl)-1,4-naphthalenediol or bisphenol S? 劉貴生; Liou, GS
臺大學術典藏 2018-09-10T04:27:54Z Curing and pyrolysis of epoxy resins containing 2-(6-oxido-6H-dibenz(c,e)oxaphosphorin-6-yl)-1,4-naphthalenediol or bisphenol S Rwei, S.-P.; Kao, S.-C.; Liou, G.-S.; Cheng, K.-C.; Guo, W.; GUEY-SHENG LIOU
臺大學術典藏 2018-09-10T03:32:26Z Curing behavior and thermal properties of cyanate ester cured rigid rod epoxy resins WEI-FANG SU;Chuang, C.-M.;Su, W.-F.;WEI-FANG SU; Su, W.-F.; Chuang, C.-M.; WEI-FANG SU
國立臺灣大學 2000 Curing Behavior and Thermal Properties of Cyanate Ester Cured Rigid Rod Epoxy Resins Su, W-F; Chuang, C-M
國立臺灣科技大學 2007 Curing behavior of anionic poly(urethane urea) dispersions crosslinked with partially methylated melamine formaldehyde Chiu, H.-T.;Huang, Y.-C.;Chiang, C.-H.
國立交通大學 2014-12-08T15:03:05Z CURING BEHAVIOR OF FULLY AND SEMIINTERPENETRATING POLYMER NETWORKS BASED ON EPOXY AND ACRYLICS LIN, MS; LEE, ST
國立臺灣大學 1996-01 Curing Behavior, Compatibility and Fracture Toughness of Bismaleimide/Tetrafunctional Epoxy Resin Blends Lin, K.F.; Chen, J.C.
國立臺灣科技大學 2006 Curing behavior, mechanical properties, intermolecular interaction, and morphology of silicone/polypyrrole/polymer electrolyte composites Chiu, H.-T.;Wu, J.-H.
國立交通大學 2014-12-08T15:01:16Z Curing behaviour of compatible interpenetrating polymer networks based on epoxy and methacrylated epoxy Wang, MW; Lee, CT; Lin, MS
國立臺灣科技大學 2001 Curing characteristics of photopolymer used in the Solid Laser-diode Plotter RP System Jeng, J.Y.; Wong, Y.S.; Ho, C.T.
國立成功大學 2009-12 Curing conditions of polyarylacetylene prepolymers to obtain thermally resistant materials Tseng, Wei-Chieh; Chen, Yun; Chang, Geng-Wen
國立成功大學 2005-01 Curing kinetics and reaction-induced homogeneity in networks of poly(4-vinyl phenol) and diglycidylether epoxide cured with amine Su, Chean-Cheng; Woo, Eamor M.; Huang, Yin-Ping
國立交通大學 2014-12-08T15:44:49Z Curing kinetics and viscosity change of a two-part epoxy resin during mold filling in resin-transfer molding process Lee, CL; Wei, KH
國立中山大學 1995 Curing Kinetics of Cyanated Poly(ether sulfone)s of Different Molecular Weight J.Y. Chang;J.L. Hong
國立臺灣大學 1993 Curing Kinetics of Epoxy Resins Based on Bisphenol-S and Its Derivatives 廖德章; Shen, W. C.; Liaw, Der-Jang; Shen, W. C.
朝陽科技大學 2024-02-20 Curing kinetics study of chemically modified pineapple leaf fiber/epoxy composite 石燕鳳; 歐汀原; 陳政廷; 劉銘銳; Shih, Yeng-Fong; Ou, Ting-Yuan; Chen, Zheng-Ting; Chang, Chun-Wei; Lau, Edwin M.
國立臺灣大學 1994 Curing of Acrylated Epoxy Resin Based on Bisphenol-S 廖德章; Shen, W. C.; Liaw, Der-Jang; Shen, W. C.
國立交通大學 2014-12-08T15:43:06Z Curing of polyimide and the effect of the TEOS SiO2 barrier layer on the electromigration of sputtered Cu with polyimide passivation Hung, HY; Chiou, BS
國立中山大學 1992 Curing of Unsaturated Polyester Resin: Effect of Surface Treatment of Particulates J.J. Shieh;T.J. Hsu
國立臺灣大學 1993 Curing Process-Dynamic Viscoelasticity Relationship for Polyurethane-Modified Epoxy Resin 邱文英; Cheng, K. C.; Chiu, Wen-Yen; Cheng, K. C.
淡江大學 2008-10 Curing reaction of amino-terminated aqueous-based polyurethane dispersions with triglycidyl-containing compound Wang, Shih-chieh; Chen, Po-cheng; Yeh, Jen-taut Yeh; Chen, Kan-nan
南亞技術學院 2008-10-15 Curing reaction of amino-terminated aqueous-based polyurethane dispersions with triglycidyl-containing compound Wang, Shih-Chieh;Chen, Po-Cheng;Yeh, Jen-Taut;Chen, Kan-Nan
淡江大學 1996-06 Curing Reaction of Anionic Aqueous-based PU with Ionic Cross-Linkers 黃光正; 陳幹男

顯示項目 298351-298375 / 2347237 (共93890頁)
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