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機構 日期 題名 作者
國立臺灣科技大學 2006 Curing behavior, mechanical properties, intermolecular interaction, and morphology of silicone/polypyrrole/polymer electrolyte composites Chiu, H.-T.;Wu, J.-H.
國立交通大學 2014-12-08T15:01:16Z Curing behaviour of compatible interpenetrating polymer networks based on epoxy and methacrylated epoxy Wang, MW; Lee, CT; Lin, MS
國立臺灣科技大學 2001 Curing characteristics of photopolymer used in the Solid Laser-diode Plotter RP System Jeng, J.Y.; Wong, Y.S.; Ho, C.T.
國立成功大學 2009-12 Curing conditions of polyarylacetylene prepolymers to obtain thermally resistant materials Tseng, Wei-Chieh; Chen, Yun; Chang, Geng-Wen
國立成功大學 2005-01 Curing kinetics and reaction-induced homogeneity in networks of poly(4-vinyl phenol) and diglycidylether epoxide cured with amine Su, Chean-Cheng; Woo, Eamor M.; Huang, Yin-Ping
國立交通大學 2014-12-08T15:44:49Z Curing kinetics and viscosity change of a two-part epoxy resin during mold filling in resin-transfer molding process Lee, CL; Wei, KH
國立中山大學 1995 Curing Kinetics of Cyanated Poly(ether sulfone)s of Different Molecular Weight J.Y. Chang;J.L. Hong
國立臺灣大學 1993 Curing Kinetics of Epoxy Resins Based on Bisphenol-S and Its Derivatives 廖德章; Shen, W. C.; Liaw, Der-Jang; Shen, W. C.
朝陽科技大學 2024-02-20 Curing kinetics study of chemically modified pineapple leaf fiber/epoxy composite 石燕鳳; 歐汀原; 陳政廷; 劉銘銳; Shih, Yeng-Fong; Ou, Ting-Yuan; Chen, Zheng-Ting; Chang, Chun-Wei; Lau, Edwin M.
國立臺灣大學 1994 Curing of Acrylated Epoxy Resin Based on Bisphenol-S 廖德章; Shen, W. C.; Liaw, Der-Jang; Shen, W. C.

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