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機構 日期 題名 作者
國立高雄第一科技大學 2008.06 Failure analysis of a silane gas cylinder valve: A case study Peng, Deng-Jr;Chang, Yo-Yu;Wu, Hong-Chun;Tsaur, Charng-Cheng;Chen, Jenq-Renn
義守大學 2002-12 Failure analysis of BGA package by a TDR approach Ming-Kun Chen;Cheng-Chi Tai;Yu-Jung Huang;I-Chih Wu
義守大學 2012-10 Failure analysis of Cu electroplating process with Polyimide substrate fabricated for flexible packaging Ying-Chih Wu;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin;Shen-Li Fu
義守大學 2014-02 Failure analysis of EOS-induced damage at final electrical testing Ming-Kun Chen;Yu-Jung Huang;Chi-Chan Cheng;Yi-Lung Lin;Shen-Li Fu
國立交通大學 2014-12-08T15:26:28Z Failure analysis of ESD damage in a high-voltage driver IC and the effective ESD protection solution Ker, MD; Peng, JJ; Jiang, HC
國立成功大學 2015-12-15 Failure analysis of fiber-reinforced composite laminates subjected to biaxial loads Hu, Hsuan-Teh; Lin, Wen-Pin; Tu, Fang-Tai
國立交通大學 2017-04-21T06:48:54Z Failure Analysis of Gate-all-around Nanowire Field Effect Transistor Under TLP Test Zhang, Guoyan; Dong, Aihua; Liu, Nie; Tian, Rui; Yang, Xuejiao; Liu, Zhiwei; Lee, Kohui; Lin, Horng-Chih; Liou, Juin J.; Wang Yuxin
國立成功大學 2012-03 Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test Chang, Hung-Jen; Zhan, Chau-Jie; Chang, Tao-Chih; Chou, Jung-Hua
國立高雄應用科技大學 2008 Failure analysis of pad-height effects in the fine-pitch interconnection of the anisotropic conductive films Lin, Chao-Ming; Lin, Tzu-Chao; Fang, Te-Hua; Chao, Kuo-Sheng
亞洲大學 2012-09 Failure Analysis of Power MOSFETs based on Multi-finger Configuration under Unclamped Inductive Switching (UIS) Stress Condition 楊紹明;Yang, Shao-Ming;蔡宗叡;Tsai, Jung-Ruey;許健;Sheu, Gene

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