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顯示項目 454841-454850 / 2348674 (共234868頁)
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| 臺大學術典藏 |
2018-09-10T09:43:33Z |
Gold Nanosponges: Green Synthesis, Characterization, and Cytotoxicity
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Lin, Yang-Wei; Chen, Yi-Cheng; Wang, Chia-Wei; Chen, Wen-Tsen; Liu, Chao-Ming; Chen, Chung-Yu; Chang, Huan-Tsung; Lin, Yang-Wei; Chen, Yi-Cheng; Wang, Chia-Wei; Chen, Wen-Tsen; Liu, Chao-Ming; Chen, Chung-Yu; Chang, Huan-Tsung; HUAN-TSUNG CHANG |
| 國立臺灣科技大學 |
2020 |
Gold nanostars-diagnosis, bioimaging and biomedical applications
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Mousavi, S.M.;Zarei, M.;Hashemi, S.A.;Ramakrishna, S.;Chiang, W.-H.;Lai, C.W.;Gholami, A. |
| 國立交通大學 |
2014-12-08T15:28:13Z |
Gold Nanostructures on Flexible Substrates as Electrochemical Dopamine Sensors
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Hsu, Ming-Sheng; Chen, Yu-Liang; Lee, Chi-Young; Chiu, Hsin-Tien |
| 國立成功大學 |
2015 |
Gold Nanotheranostics: Photothermal Therapy and Imaging of Mucin 7 Conjugated Antibody Nanoparticles for Urothelial Cancer
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Chen, Chieh Hsiao; Wu, Yi-Jhen; Chen, Jia-Jin |
| 國立成功大學 |
2015-12-01 |
Gold over Branched Palladium Nano structures for Photothermal Cancer Therapy
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McGrath, Andrew J.; Chien, Yi-Hsin; Cheong, Soshan; Herman, David A. J.; Watt, John; Henning, Anna M.; Gloag, Lucy; Yeh, Chen-Sheng; Tilley, Richard D. |
| 臺大學術典藏 |
2022-02-21T23:30:45Z |
Gold recovery from waste printed circuit boards of mobile phones by using microwave pyrolysis and hydrometallurgical methods
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Huang, Yu Fong; Chou, Szu Ling; SHANG-LIEN LO |
| 臺大學術典藏 |
2022-03-22T08:28:11Z |
Gold recovery from waste printed circuit boards of mobile phones by using microwave pyrolysis and hydrometallurgical methods
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Huang Y.-F;Chou S.-L;Lo S.-L.; Huang Y.-F; Chou S.-L; Lo S.-L.; SHANG-LIEN LO |
| 臺大學術典藏 |
2022-03-22T08:31:11Z |
Gold recovery from waste printed circuit boards of mobile phones by using microwave pyrolysis and hydrometallurgical methods
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Huang Y.-F;Chou S.-L;Lo S.-L.; Huang Y.-F; Chou S.-L; Lo S.-L.; SHANG-LIEN LO |
| 臺大學術典藏 |
2022-03-22T08:31:13Z |
Gold recovery from waste printed circuit boards of mobile phones by using microwave pyrolysis and hydrometallurgical methods
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Huang Y.-F;Chou S.-L;Lo S.-L.; Huang Y.-F; Chou S.-L; Lo S.-L.; SHANG-LIEN LO |
| 國立中山大學 |
2009 |
Gold stud bumps for high performance flip chip packages
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W. Chen;K. Shen;A. Wang;Y.S. Lai;B. Appelt;A. Tseng |
顯示項目 454841-454850 / 2348674 (共234868頁)
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