English  |  正體中文  |  简体中文  |  總筆數 :0  
造訪人次 :  52707473    線上人數 :  635
教育部委託研究計畫      計畫執行:國立臺灣大學圖書館
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
關於TAIR

瀏覽

消息

著作權

相關連結

跳至: [ 中文 ] [ 數字0-9 ] [ A B C D E F G H I J K L M N O P Q R S T U V W X Y Z ]
請輸入前幾個字:   

顯示項目 528126-528135 / 2348638 (共234864頁)
<< < 52808 52809 52810 52811 52812 52813 52814 52815 52816 52817 > >>
每頁顯示[10|25|50]項目

機構 日期 題名 作者
國立交通大學 2014-12-08T15:34:36Z Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications Wang, Chin-Te; Hsu, Li-Han; Wu, Wei-Cheng; Hsu, Heng-Tung; Chang, Edward Yi; Hu, Yin-Chu; Lee, Ching-Ting; Tsai, Szu-Ping
元智大學 2014-1-1 Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications Chin-Te Wang; Li-Han Hsu; Wei-Cheng Wu; H. T. Hsu; E. Y. Chang; Yin-Chu Hu; Ching-Ting Lee; Szu-Ping Tsai
元智大學 2014-1-1 Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications Chin-Te Wang; Li-Han Hsu; Wei-Cheng Wu; H. T. Hsu; E. Y. Chang; Yin-Chu Hu; Ching-Ting Lee; Szu-Ping Tsai
國立成功大學 2023-08 Investigation of the flow patterns and mixing efficiency in a stirred tank through particle image velocimetry Ciou;Zih-Yen;Wu;Chih-Yung
國立臺灣科技大學 2010 Investigation of the formability of flanged parts of magnesium alloy under hot forging process Ho H.-L.; Hsiang S.-H.; Huang Z.-Y.
國立交通大學 2019-12-13T01:12:20Z Investigation of the forming process under UV illumination in HfO2-based resistance random access memory with a transparent electrode Huang, Wei-Chen; Huang, Shin-Ping; Chen, Po-Hsun; Chen, Min-Chen; Chang, Ting-Chang; Shih, Chih-Cheng; Tseng, Yi-Ting; Zheng, Hao-Xuan; Tan, Yung-Fang; Wu, Chung-Wei; Yeh, Yuh-Suan; Ma, Xiao-Hua; Hao, Yue; Sze, Simon M.
國立交通大學 2014-12-08T15:01:13Z Investigation of the four-bar linkage in a rear derailleur system with experimental verification Wu, PT; Hsu, WS
國立勤益科技大學 2010-06 Investigation of the fracture characteristics of the interfacial bond between bone and cement: experimental and finite element approaches 洪瑞斌
中國文化大學 2014 Investigation of the fracture mechanism of Cu-Al gradient structure Lee, Wen-Jay; Chen, Hui-Lung; Hsieh, Jin-Yuan; Ju, Shin-Pon; Wang, Jyun-Hao; Lin, Jenn-Sen
國立交通大學 2014-12-08T15:40:10Z Investigation of the friction effect at pin joints for the five-point double-toggle clamping mechanisms of injection molding machines Lin, WY; Hsiao, KM

顯示項目 528126-528135 / 2348638 (共234864頁)
<< < 52808 52809 52810 52811 52812 52813 52814 52815 52816 52817 > >>
每頁顯示[10|25|50]項目