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顯示項目 773396-773405 / 2348719 (共234872頁)
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每頁顯示[10|25|50]項目
| 臺大學術典藏 |
2019-12-10T03:23:24Z |
Special issue on infrastructures in a changing environment
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Doll, C.; Chu, J.; Ramjerdi, F.; Kuhn, K.; CHIH-YUAN CHU |
| 臺大學術典藏 |
2019-12-10T03:23:29Z |
Special Issue on Infrastructures in a Changing Environment Introduction
|
Doll, Claus; Chu, James; Ramjerdi, Farideh; Kuhn, Kenneth; CHIH-YUAN CHU |
| 國立臺灣師範大學 |
2014-12-02T06:41:53Z |
Special issue on innovative green technology to make changes in human daily life
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Huang, K. S.; Chang, C. Y. |
| 臺大學術典藏 |
2020-01-06T03:05:55Z |
Special issue on International Conference on Industrial Bioprocesses, IFIB-2012: October 7-10, 2012, Taipei, Taiwan
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Lee, D.-J.; Dussap, C.-G.; Hallenbeck, P.C.; Huang, C.-C.; DUU-JONG LEE |
| 臺大學術典藏 |
2020-01-06T03:06:07Z |
Special issue on International Conference on Industrial Bioprocesses, IFIB-2012: October 7-10, 2012, Taipei, Taiwan Preface
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Lee, Duu-Jong; Dussap, Claude-Gilles; Hallenbeck, Patrick C.; Huang, Chieh-Chen; DUU-JONG LEE |
| 臺大學術典藏 |
2020-06-11T06:44:39Z |
Special issue on Internet of Things (IoT) for in-vehicle systems Preface
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Huang, Shih-Chia;Hwang, Jenq-Neng;Kuo, Sy-Yen;Binotto, Alecto P. D.;Upadhyay, Devesh;Hung, Patrick C. K.; Huang, Shih-Chia; Hwang, Jenq-Neng; Kuo, Sy-Yen; Binotto, Alecto P. D.; Upadhyay, Devesh; Hung, Patrick C. K.; SY-YEN KUO |
| 臺大學術典藏 |
2020-02-10T09:25:16Z |
Special issue on it-related service: A multidisciplinary perspective
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Lemon K.N.;Huang M.-H.;Rust R.T.; Lemon K.N.; Huang M.-H.; Rust R.T.; MING-HUI HUANG |
| 國立臺灣大學 |
2003-12 |
SPECIAL ISSUE ON LEAD-FREE SOLDERS AND PROCESSING ISSUES IN MICROELECTRONIC PACKAGING
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Lucas, J. P.; Chada, S.; Kang, S. K.; Kao, C. R.; Lin, K. L.; Ready, J.; Yu, and J. |
| 國立成功大學 |
2003-12 |
Special issue on lead-free solders and processing issues in microelectronic packaging - Foreword
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Lucas, James P.; Chada, Srini; Kang, Sung K.; Kao, C. Robert; Lin, Kwang-Lung; Ready, Jud; Yu, Jin |
| 國立成功大學 |
2004-12 |
Special issue on lead-free solders and processing issues relevant to microelectronic packaging - Foreword
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Chada, Srinivas; Turbini, Laura J.; Kang, Sung K.; Lin, Kwang-Lung; Notis, Michael R.; Yu, Jin |
顯示項目 773396-773405 / 2348719 (共234872頁)
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