| 國立臺灣大學 |
1995 |
Thermomagnetics of reversible transverse susceptibility
|
Yang, Jyh-Shinn; Chang, Ching-Ray; Klik, Ivo |
| 臺大學術典藏 |
2019-12-20T01:17:41Z |
Thermomagnetics of Reversible Transverse Susceptibility
|
Yang, Js;Chang, Cr;Klik, I.; Yang, Js; Chang, Cr; Klik, I.; CHING-RAY CHANG |
| 國立成功大學 |
2008-05-15 |
Thermomechanical and optical characteristics of stretched polyvinylidene fluoride
|
Chang, Wen-Yang; Fang, Te-Hua; Lin, Yu-Cheng |
| 國立高雄第一科技大學 |
2004.04 |
Thermomechanical Behavior of Underfill/Solder Mask/Substrate Interface UnderThermal Cycling
|
C.-H.Chien;Y.-C.Chen, C.-C;Hsieh, Y.-T.;Chiou;Y.-D.Wu;Chen, T.-R; 謝其昌 |
| 臺大學術典藏 |
2018-09-10T05:58:00Z |
Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits
|
Gleskova, H.; Cheng, I.-C.; Wagner, S.; Suo, Z.; I-CHUN CHENG |
| 義守大學 |
2005-07 |
Thermomechanical effects on adsorbed water in clays around a heat source
|
Chenmin Ma;Tomasz Hueckel |
| 國立臺灣大學 |
2010 |
Thermomechanical models for the dynamics and melting processes in the Mariana subduction system
|
Lin, Shu-Chuan; Kuo, Ban-Yuan; Chung, Sun-Lin |
| 國立成功大學 |
2022-03-25 |
Thermomechanical properties of cold-sprayed copper coatings from differently fabricated powders
|
Wei;Jun, Fu;chou;Yen, Bang;Fung;Zhong, Kuan;Tsai;Yi, Shu |
| 國立中山大學 |
2007 |
Thermomechanical Properties of Nanosilica Reinforced PEEK Composites
|
Y.H. Lai;M.C. Kuo;J.C. Huang;M. Chen |
| 國立中山大學 |
2007 |
Thermomechanical Properties of Nanosilica Reinforced PEEK Composites
|
Y.H. Lai;M.C. Kuo;J.C. Huang;M. Chen |
| 國立中山大學 |
2006-10-22 |
Thermomechanical Properties of Nanosilica Reinforced PEEK Composites
|
Y.H. Lai;M.C. Kuo;J.C. Huang;M. Chen |
| 國立臺灣海洋大學 |
1995 |
Thermomechanical Response Analysis of Lithographic Mask Structure Using FEM
|
D. C. Li;S. W. Chyuan;J. T. Chen;C. Y. Sun |
| 國立中山大學 |
2000 |
Thermomechanical Treatment in Processing High Strain Rate Superplastic 6061 Al with 1% SiO2?nano-Particles
|
T.D. Wang;J.C. Huang |
| 中華大學 |
2005 |
Thermometer Code Current Mode 8-bits Digital-to-Analog Converter Design
|
林君明; Lin, Jium-Ming |
| 臺大學術典藏 |
2018-09-10T15:21:01Z |
Thermometry for Dirac fermions in graphene
|
Hsu, C.-S.; Lo, S.-T.; Chuang, C.; Huang, L.-I.; Woo, T.-P.; Liang, C.-T.; Fukuyama, Y.; Yang, Y.; Elmquist, R.E.; Wang, P.; Lin, X.; Liu, F.-H.; CHI-TE LIANG et al. |
| 臺大學術典藏 |
2019-12-27T01:16:42Z |
Thermometry for Dirac fermions in graphene
|
Liu, F.-H.; Hsu, C.-S.; Lo, S.-T.; Chuang, C.; Huang, L.-I.; Woo, T.-P.; Liang, C.-T.; Fukuyama, Y.; Yang, Y.; Elmquist, R.E.; Wang, P.; Lin, X.; TAK-PONG WOO |
| 國立交通大學 |
2014-12-08T15:30:49Z |
Thermomigration in eutectic-SnPb solder with Cu UBM at the room temperature
|
Lin, Jie An; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:14:17Z |
Thermomigration in flip-chip SnPb solder joints under alternating current stressing
|
Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:09:48Z |
Thermomigration in Pb-free SnAg solder joint under alternating current stressing
|
Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:29:18Z |
Thermomigration in solder joints
|
Chen, Chih; Hsiao, Hsiang-Yao; Chang, Yuan-Wei; Ouyang, Fanyi; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:11:46Z |
Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints
|
Chen, Hsiao-Yun; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:22:41Z |
Thermomigration of Ti in flip-chip solder joints
|
Chen, Hsiao-Yun; Lin, Han-Wen; Liu, Chien-Min; Chang, Yuan-Wei; Huang, Annie T.; Chen, Chih |
| 國立中山大學 |
2009 |
Thermomigration versus electromigration in microelectronics solder joints
|
M.F. Abdulhamid;C. Basaran;Y.S. Lai |
| 國立臺灣大學 |
1989 |
Thermophilic and Thermotolerant Fungi in Taiwan (I)
|
Chen, G. Y.; 陳瑞青; Chen, G. Y.; Chen, Zuei-Ching |
| 國立臺灣大學 |
1990 |
Thermophilic and Thermotolerant Fungi in Taiwan (II)
|
Chen, G. Y.; 陳瑞青; Chen, G. Y.; Chen, Zuei-Ching |
