|
English
|
正體中文
|
简体中文
|
總筆數 :0
|
|
造訪人次 :
52724415
線上人數 :
616
教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
|
|
|
顯示項目 875306-875315 / 2348674 (共234868頁) << < 87526 87527 87528 87529 87530 87531 87532 87533 87534 87535 > >> 每頁顯示[10|25|50]項目
| 臺大學術典藏 |
2021-10-07T08:50:19Z |
Three-dimensional finite element analysis of contact phenomena on patterned and planarized media
|
Wei Wu; Jia-Yang Juang; JIA-YANG JUANG |
| 國立成功大學 |
2021-06 |
Three-dimensional finite element analysis of geosynthetic-reinforced soil walls with turning corners
|
Hung;C;Liu;C, H.;Liu;H |
| 國立交通大學 |
2014-12-08T15:01:36Z |
Three-dimensional finite element analysis of sheet-metal bending with complex die geometry
|
Chou, IN; Hung, CH |
| 國立交通大學 |
2019-04-02T05:59:35Z |
Three-dimensional finite element analysis of sheet-metal bending with complex die geometry
|
Chou, IN; Hung, CH |
| 臺北醫學大學 |
1999 |
Three-dimensional finite element analysis of subdural hematoma.
|
陳建志; Huang HM; Lee MC; Chiu WT; Chen CT and Lee SY |
| 臺北醫學大學 |
2000 |
Three-Dimensional finite element analysis of subdural hematoma.
|
李勝揚; Huang H-M; Lee M-C; Chiu W-T; Chen C-T and Lee S-Y |
| 臺北醫學大學 |
1999 |
Three-dimensional finite element analysis of subdural hematoma.
|
黃豪銘; Huang HM; Lee MC; Chiu WT; Chen CT and Lee SY |
| 國立成功大學 |
2005 |
Three-dimensional finite element analysis of thermomechanical behavior in flip-chip packages under temperature cycling conditions
|
Wu, Gien-Huang; Tsein, T. C.; Ju, Shen-Haw |
| 臺大學術典藏 |
2020-01-13T08:18:03Z |
Three-dimensional finite element analysis of wrinkling in a stamping process
|
Chen, F.-K.; Liao, Y.-C.; FUH-KUO CHEN |
| 國立臺灣大學 |
1998 |
Three-Dimensional Finite Element Contact Stress Analysis of the Artificial Knee Joint
|
陳文斌; 黃偉良; 簡秋記; 江清泉; CHEN, WENG-PIN; HUANG, WOEI-LIANG; CHIEN, CHYOU-CHI; JIANG, CHING-CHUAN |
顯示項目 875306-875315 / 2348674 (共234868頁) << < 87526 87527 87528 87529 87530 87531 87532 87533 87534 87535 > >> 每頁顯示[10|25|50]項目
|