| 國立成功大學 |
2005-12 |
Bond strength and debonding characteristics of a new ceramic bracket
|
Liu, Jia-Kuang; Chung, Ching-Hung; Chang, Chuan-Yang; hieh, Dar-Bin |
| 大葉大學 |
2007-11 |
Bond strength of binary Ti-Cr alloys to porcelain
|
Hsu, H.C.;Chiang, T.Y.;Wu, S.C.;Lin, H.C.;Ho, W.F. |
| 臺北醫學大學 |
2006 |
Bond strength of light curing composite resin with various lights.
|
王蔚南; Hwang SD; Teng CM; Tsai NC; Hwang HM; Wang WN; |
| 臺北醫學大學 |
2006 |
Bond strength of light curing composite resin with various lights.In press.
|
鄧乃嘉; 李勝揚; 蔡志孟; Hwang SD; Teng NC; Tsai CM; Hwang HM; Wang WN; |
| 臺北醫學大學 |
2005 |
Bond strength of light-cured composite resin using various light sources
|
黃豪銘; Hwang SD; Tsai CM; Teng NC; Huang HM; Lee SY; Wang WN |
| 臺北醫學大學 |
2010 |
Bond strength of orthodontic light-cured resin-modified glass ionomer cement
|
CY, Chen;CH, Chen;CL, Li;HH, Tsai;TH, Chou;WN, Wang |
| 臺北醫學大學 |
2011 |
Bond strength of orthodontic light-cured resin-modified glass ionomer cement
|
CY, Chen;CH, Chen;CL, Li;HH, Tsai;TH, Chou;WN, Wang |
| 臺北醫學大學 |
2011 |
Bond strength of orthodontic light-cured resin-modified glass ionomer cement
|
Chen, CY;Chen, CH;Li, CL;Tsai, HH;Chou, TH;Wang, WN |
| 臺北醫學大學 |
2010 |
Bond strength of orthodontic light-cured resin-modified glass ionomer cement
|
Chen, CY;Chen, CH;Li, CL;Tsai, HH;Chou, TH;Wang, WN |
| 大葉大學 |
2013-01 |
Bond strength of Ti-5Cr based alloys to dental porcelain with Mo addition.
|
HO, WEN-FU;Wu, Shih-Ching;Hsu, Shih-Kuang;Fang, Lih-Sheng;Hsu, Hsueh-Chuan |
| 臺北醫學大學 |
2004 |
Bond strength of various bracket base designs
|
林利香; 林哲堂; Wei Nan Wang; Chung Hsing Li; Ta Hsiung Chou; Dennis Ding Hwa Wang; Li Hsiang Lin; Che Tong Lin |
| 臺北醫學大學 |
2004 |
Bond strength of various bracket base designs
|
王蔚南; 林哲堂; Wang WNLi CHChou THWang DDHLin LHLin CT |
| 大葉大學 |
2013-10-19 |
Bond strengths between Ti-25Nb-xSn alloys and low-fusing porcelain.
|
Hsu, Hsueh-Chuan;Lin, Yi-Hsin;HO, WEN-FU;Wu, Shih-Ching;Hsu, Shih-Kuang |
| 國立臺灣大學 |
2003-10 |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee, BS; Hsieh, TT; Lee, YL; Lan, WH; Hsu, YJ; Wen, PH; Lin, CP |
| 臺大學術典藏 |
2018-09-10T04:25:44Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; CHUN-PIN LIN |
| 臺大學術典藏 |
2018-09-10T04:25:46Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; BOR-SHIUNN LEE |
| 臺大學術典藏 |
2018-09-10T04:25:50Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee, B.-S.;Hsieh, T.-T.;Lee, Y.-L.;Lan, W.-H.;Hsu, Y.-J.;Wen, P.-H.;Lin, C.-P.; YUAN-LING LEE |
| 臺大學術典藏 |
2021-07-05T07:35:52Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee B.-S.; Hsieh T.-T.; YUAN-LING LEE; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; Lin C.-P. |
| 臺大學術典藏 |
2021-07-26T06:53:20Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
Lee B.-S.; Hsieh T.-T.; Lee Y.-L.; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; CHUN-PIN LIN |
| 臺大學術典藏 |
2021-07-05T03:41:30Z |
Bond strengths of orthodontic bracket after acid-etched, Er:YAG laser-irradiated and combined treatment on enamel surface
|
BOR-SHIUNN LEE; Hsieh T.-T.; Lee Y.-L.; Lan W.-H.; Hsu Y.-J.; Wen P.-H.; Lin C.-P. |
| 國立成功大學 |
2008-03 |
Bond structure in porous SiOCH low-k film fabricated by ultraviolet irradiation
|
Huang, Chun-Hsien; Huang, Hui-Ling; Hung, Chen I.; Wang, Na-Fu; Wang, Yeong-Her; Houng, Mau-Phon |
| 國立成功大學 |
2001-01-05 |
Bond types of molecular orbitals and the photoelectron spectrum
|
Lee, Hsing-Yi; Wang, Shao-Pin; Chang, Tse-Chiang |
| 國立成功大學 |
2020 |
Bond-breaking induced lifshitz transition in robust dirac semimetal VAI3
|
Liu, Y.;Liu, Y.-F.;Gui, X.;Xiang, C.;Zhou, H.-B.;Hsu, C.-H.;Lin, H.;Chang, T.-R.;Xie, W.;Jia, S. |
| 國立成功大學 |
2016-01 |
Bond-Pad Charging Protection Design for Charging-Free Reference Transistor Test Structures
|
Lin, Wallace |
| 國立臺灣科技大學 |
2017 |
Bond-slip responses of stainless reinforcing bars in grouted ducts
|
Zhou, Y;Ou, Y.-C;Lee, G.C. |
