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Institution	Date	Title	Author
國立聯合大學	2010	Effect of Cu and Ni doping on the structure and magnetic properties of FePt nanoparticles	S. W. Yung, J. S. Lin and S. P. Ju
國立臺灣大學	2002-02	Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders	Chen, W. T.; Ho, C. E.; Kao, and C. R.
國立臺灣大學	2002-06	Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni	Ho, C. E.; Tsai, R. Y.; Lin, Y. L.; Kao, and C. R.
國立臺灣大學	2010	Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni	Yang, S.C.; Chang, C.C.; Tsai, M.H.; Kao, C.R.
臺大學術典藏	2020-04-28T07:11:48Z	Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni	Tsai, M. H.; Kao, C. R.; CHIEN-CHENG CHANG; Chang, C. C.; Yang, S. C.
淡江大學	2003	Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization	Hsu, S. C.; Wang, S. J.; Liu, C. Y.
國立成功大學	2022-10	Effect of Cu Intercalation Layer on the Enhancement of Spin-to-Charge Conversion in Py/Cu/Bi2Se3	Su;Hsuan, Shu;Chong;Cheong-Wei;Lee;Jung-Chuan;Chen;Yi-Chun;Marchenkov;Viktorovich, Vyacheslav;Huang;Andrew, Jung-Chun
元智大學	2019/11/15	Effect of Cu Interconnect Roughness on the Signal Transmission Performance at 1–110 GHz	W. L. Chou; J. C. Yu; C. Y. Lee; Y. S. Wu; Chien-Chang Huang; Cheng-En Ho
元智大學	2019/11/15	Effect of Cu Interconnect Roughness on the Signal Transmission Performance at 1–110 GHz	W. L. Chou; J. C. Yu; C. Y. Lee; Y. S. Wu; Chien-Chang Huang; Cheng-En Ho
國立高雄大學	2010-07	Effect of Cu species on leaching behavior of simulated copper sludge after thermal treatment: ESCA analysis	Chou, Jing-Dong; Lin, Chiou-Liang; Wey, Ming-Yen; Chang, Shih-Hsien

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