| 臺大學術典藏 |
2020-01-06T03:04:52Z |
Fundamental parameters extraction from dark I-V characteristics: A comprehensive study on amorphous/crystalline silicon hetero-junction solar cell
|
CHUNG-WEN LAN;Lan, C.-W.;Lu, W.-H.;Hsu, W.-C.;Liao, C.-H.;Chen, C.-H.;Lin, C.-H.;Shiao, J.-C.;Wu, D.-C.; Wu, D.-C.; Shiao, J.-C.; Lin, C.-H.; Chen, C.-H.; Liao, C.-H.; Hsu, W.-C.; Lu, W.-H.; Lan, C.-W.; CHUNG-WEN LAN |
| 臺大學術典藏 |
2000-06 |
Fundamental performance analysis for spoken dialogue systems based on a quantitative simulation approach
|
Lin, Bor-Shen; Lee, Lin-Shan; Lin, Bor-Shen; Lee, Lin-Shan |
| 國立臺灣大學 |
2000-06 |
Fundamental performance analysis for spoken dialogue systems based on a quantitative simulation approach
|
Lin, Bor-Shen; Lee, Lin-Shan |
| 臺大學術典藏 |
2018-09-10T06:35:06Z |
Fundamental Performance Limits of Data Replication for Peer-to-Peer Applications in Wireless Ad-hoc Networks
|
S. C. Wang; H. Z. Chou; D. S. L. Wei; S. Y. Kuo; SY-YEN KUO |
| 國立臺灣大學 |
2002-01 |
Fundamental Pharmacology (Chinese). 5th edition.
|
Liu, SH; Chen, SP |
| 國立臺灣大學 |
2006-01 |
Fundamental Pharmacology (Chinese). 6th edition.
|
Liu, SH; Chao, KF; Chen, SP |
| 國立政治大學 |
1998-10 |
Fundamental Principles Relevant to the Establishment of International Boundaries
|
趙國材 |
| 國立成功大學 |
2023-07-12 |
Fundamental properties of alkali-intercalated bilayer graphene nanoribbons
|
Huynh;Duyen, Thi My;Hung;Guo-Song;Gumbs;Godfrey;Tran;Thuy, Ngoc Thanh |
| 國立成功大學 |
2022 |
Fundamental Properties of Hydrogen-Functionalized GaSe Monolayer
|
Duyen, Huynh T.M.;Hien, Nguyen T.D.;Lin, M.-F. |
| 國立成功大學 |
2008 |
Fundamental Properties of Integrated-depth Equations for Nonlinear Water Waves Propagating in Porous Media
|
Hu, Kai-Cheng; Hsiao, Shih-Chun; Hwung, Hwung-Hweng |
| 真理大學 |
2002-11 |
Fundamental Properties of Interval Vector Max--Norm
|
Kuo-Ping Chiao; 喬國平 |
| 國立成功大學 |
2020-06-16 |
Fundamental Properties of Metal-Adsorbed Silicene: A DFT Study
|
Tran, Ngoc Thanh Thuy;Gumbs;Godfrey;Nguyen, Duy Khanh;Lin;Ming-Fa |
| 國立成功大學 |
2023 |
Fundamental properties of transition-metal-adsorbed germanene: a DFT study
|
Pham, H.D.;Lin, S.-Y.;Dien, V.K.;Lee, C.-H.;Liu, H.-Y.;Huynh, T.M.D.;Han, N.T.;Tran, N.T.T.;Nguyen, T.D.H.;Li, W.-B.;Lin, M.-F. |
| 國立成功大學 |
2022 |
Fundamental Properties of Transition-Metals-Adsorbed Germanene: A DFT Study
|
Liu, H.-Y.;Wu, J.-Y. |
| 國立成功大學 |
2019-10-2 |
Fundamental Properties of Transition-Metals-Adsorbed Graphene
|
Tran, Ngoc Thanh Thuy;Nguyen, Duy Khanh;Lin;Shih-Yang;Gumbs;Godfrey;Lin;Ming-Fa |
| 國立聯合大學 |
2010 |
FUNDAMENTAL SOLUTIONS FOR AN INHOMOGENEOUS CROSS- ANISOTROPIC MATERIAL DUE TO HORIZONTAL AND VERTICAL PLANE STRAIN LINE LOADS
|
Wang, CD; Hou, JY; Wang, WJ |
| 南亞技術學院 |
2002/12/20 |
Fundamental Solutions for Non-homogeneous Transversely Isotropic Half-Spaces
|
Wang, Cheng-Der;Tzeng, Chi-Shiang;Liao, Jyh-Jong |
| 國立成功大學 |
2019-11 |
Fundamental solutions for two-dimensional anisotropic thermo-magneto-electro-elasticity
|
Hwu;Chyanbin;Hsu;Chung-Lei;Hsu;Chia-Wei;Shiah;Y, C. |
| 國立臺灣大學 |
2004 |
Fundamental Statistical Concepts
|
Lyuu, Yuh-Dauh |
| 臺大學術典藏 |
2004 |
Fundamental Statistical Concepts
|
Lyuu, Yuh-Dauh; Lyuu, Yuh-Dauh |
| 臺大學術典藏 |
2018-09-10T04:51:58Z |
Fundamental Study and Oxide Reliability of the MBE-Grown Ga 2- x Gd x O 3 Dielectric Oxide for Compound Semiconductor MOSFETs
|
Kwo, J; Hong, M; Mannaerts, JP; Lee, YJ; Wu, YD; Lee, WG; Milkap, S; Yang, B; Gustaffson, T; MINGHWEI HONG |
| 國立臺灣科技大學 |
2004 |
Fundamental Study and Theoretical Analysis in the Constrain-Surface Stereolithography System
|
Huang, You-Min; Kuriyama, S. ; Jiang, C. P. |
| 臺大學術典藏 |
2019-11-27T02:02:48Z |
Fundamental study of 95 high-lead solder bump on substrates pre-soldered with eutectic PbSn
|
C. ROBERT KAO;Kao C.R.;Lin C.-C.;Chang C.-C.; Chang C.-C.; Lin C.-C.; Kao C.R.; C. ROBERT KAO |
| 國立中山大學 |
2009 |
Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substrates
|
C.C. Chang;Y.W. Lin;Y.S. Lai;C.R. Kao |
| 臺大學術典藏 |
2020-04-28T07:11:49Z |
Fundamental Study of the Intermixing of 95Pb-5Sn High-Lead Solder Bumps and 37Pb-63Sn Pre-Solder on Chip-Carrier Substrates
|
CHIEN-CHENG CHANG; Lai, Y. S.; Kao, C. R.; Lin, Y. W.; Chang, C. C. |
