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Institution	Date	Title	Author
南亞技術學院	2002/12/20	Fundamental Solutions for Non-homogeneous Transversely Isotropic Half-Spaces	Wang, Cheng-Der;Tzeng, Chi-Shiang;Liao, Jyh-Jong
國立成功大學	2019-11	Fundamental solutions for two-dimensional anisotropic thermo-magneto-electro-elasticity	Hwu;Chyanbin;Hsu;Chung-Lei;Hsu;Chia-Wei;Shiah;Y, C.
國立臺灣大學	2004	Fundamental Statistical Concepts	Lyuu, Yuh-Dauh
臺大學術典藏	2004	Fundamental Statistical Concepts	Lyuu, Yuh-Dauh; Lyuu, Yuh-Dauh
臺大學術典藏	2018-09-10T04:51:58Z	Fundamental Study and Oxide Reliability of the MBE-Grown Ga 2- x Gd x O 3 Dielectric Oxide for Compound Semiconductor MOSFETs	Kwo, J; Hong, M; Mannaerts, JP; Lee, YJ; Wu, YD; Lee, WG; Milkap, S; Yang, B; Gustaffson, T; MINGHWEI HONG
國立臺灣科技大學	2004	Fundamental Study and Theoretical Analysis in the Constrain-Surface Stereolithography System	Huang, You-Min; Kuriyama, S. ; Jiang, C. P.
臺大學術典藏	2019-11-27T02:02:48Z	Fundamental study of 95 high-lead solder bump on substrates pre-soldered with eutectic PbSn	C. ROBERT KAO;Kao C.R.;Lin C.-C.;Chang C.-C.; Chang C.-C.; Lin C.-C.; Kao C.R.; C. ROBERT KAO
國立中山大學	2009	Fundamental study of the intermixing of 95Pb-5Sn high-lead solder bumps and 37Pb-63Sn pre-solder on chip-carrier substrates	C.C. Chang;Y.W. Lin;Y.S. Lai;C.R. Kao
臺大學術典藏	2020-04-28T07:11:49Z	Fundamental Study of the Intermixing of 95Pb-5Sn High-Lead Solder Bumps and 37Pb-63Sn Pre-Solder on Chip-Carrier Substrates	CHIEN-CHENG CHANG; Lai, Y. S.; Kao, C. R.; Lin, Y. W.; Chang, C. C.
國立交通大學	2014-12-08T15:01:07Z	Fundamental study on hydration of cement and cement minerals with steam	Lin, WM; Lin, TD; Hwang, CL; Peng, YN

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