| 國立臺灣海洋大學 |
2008 |
Hot carrier photoluminescence in InN epilayers
|
M. D. Yang;Y. P. Chen;G. W. Shu;J. L Shen;S. C. Hung;G. C. Chi;T. Y. Lin;Y. C. Lee;C. T. Chen;C. H. Ko |
| 國立臺灣大學 |
2000 |
Hot carrier recombination model of visible electroluminescence from metal oxide silicon tunneling diodes
|
Liu, C. W.; Chang, S. T.; Liu, W. T.; Chen, Miin-Jang; Lin, Ching-Fuh |
| 中原大學 |
2000-12 |
Hot carrier recombination model of visible electroluminescence from metal-oxide-silicon tunneling diodes
|
C. W. Liu;S. T. Chang;W. T. Liu;Miin-Jang Chen;Ching-Fuh Lin |
| 臺大學術典藏 |
2018-09-10T03:29:44Z |
Hot carrier recombination model of visible electroluminescence from metal-oxide-silicon tunneling diodes
|
Liu, C.W.; Chang, S.T.; Liu, W.T.; Chen, M.-J.; Lin, C.-F.; CHEE-WEE LIU |
| 臺大學術典藏 |
2018-09-10T03:29:28Z |
Hot carrier recombination model of visible electroluminescence from metal-oxide-silicon tunneling diodes
|
Liu, C.W.; Chang, S.T.; Liu, W.T.; Chen, M.-J.; Lin, C.-F.; CHING-FUH LIN |
| 國立交通大學 |
2014-12-08T15:44:34Z |
Hot carrier reliability improvement by utilizing phosphorus transient enhanced diffusion for input/output devices of deep submicron CMOS technology
|
Wang, HCH; Diaz, CH; Liew, BK; Sun, JYC; Wang, TH |
| 國立暨南國際大學 |
2013 |
Hot carrier-induced emission from the InGaN/GaN light-emitting diode by characterizing reverse-bias electroluminescence
|
陳祥; Chen, H |
| 臺大學術典藏 |
2018-09-10T14:55:46Z |
Hot carriers in epitaxial graphene sheets with and without hydrogen intercalation: Role of substrate coupling
|
Lo, S.-T.; Chuang, C.; Woo, T.-P.; Lee, H.-Y.; Liu, C.-W.; Liu, C.-I.; Huang, L.-I.; Liu, C.-H.; Yang, Y.; Chang, C.-Y.S.; Li, L.-J.; Mende, P.C.; Feenstra, R.M.; Elmquist, R.E.; Liang, C.-T.; CHI-TE LIANG |
| 臺大學術典藏 |
2019-12-27T01:16:42Z |
Hot carriers in epitaxial graphene sheets with and without hydrogen intercalation: Role of substrate coupling
|
Liu, F.-H.; Lo, S.-T.; Chuang, C.; Woo, T.-P.; Lee, H.-Y.; Liu, C.-W.; Liu, C.-I.; Huang, L.-I.; Liu, C.-H.; Yang, Y.; Chang, C.-Y.S.; Li, L.-J.; Mende, P.C.; Feenstra, R.M.; Elmquist, R.E.; Liang, C.-T.; TAK-PONG WOO |
| 中華大學 |
2011 |
Hot Compressive Flow Behavior of Inconel 600 Superalloy
|
吳泓瑜; Wu, Horng-yu |
| 中華大學 |
2013 |
Hot compressive flow stress modeling of homogenized AZ61 Mg alloy using strain-dependent constitutive equations
|
吳泓瑜; Wu, Horng-yu |
| 國立虎尾科技大學 |
2006 |
Hot corrosion behavior of laser-glazed plasma-sprayed yttria-stabilized zirconia thermal barrier coatings in the presence of V2O5
|
Tsai, P.C.;Lee, J.H.;Hsu, C.S. |
| 國立交通大學 |
2014-12-08T15:30:32Z |
Hot Cracking in AZ31 and AZ61 Magnesium Alloy
|
Huang, C. J.; Cheng, C. M.; Chou, C. P.; Chen, F. H. |
| 國立交通大學 |
2014-12-08T15:19:02Z |
Hot cracking of welds on heat treatable aluminium alloys
|
Cheng, CM; Chou, CP; Lee, IK; Lin, HY |
| 國立臺灣海洋大學 |
2013-02 |
Hot cracking susceptibility of alloy 52M weld overlays onto CF8 stainless steel
|
H. A. Chu; M. C. Young; H. C. Chu; C. Chen; L.W. Tsay |
| 國立成功大學 |
2016-11-20 |
Hot deformation behaviour and microstructural evolution of biomedical Ti-13Nb-13Zr alloy in high strain rate range
|
Lee, Woei-Shyan; Kao, Chung-Hao |
| 中華大學 |
2012 |
Hot deformation characteristics and strain-dependent constitutive analysis of Inconel 600 superalloy
|
吳泓瑜; Wu, Horng-yu |
| 中華大學 |
2012 |
Hot deformation characteristics of as-cast and homogenized AZ61 Mg alloys under compression
|
吳泓瑜; Wu, Horng-yu |
| 國立交通大學 |
2014-12-08T15:47:12Z |
Hot ductility behaviour of 18%Ni maraging steel
|
Chen, MH; Chou, CP |
| 國立交通大學 |
2014-12-08T15:02:07Z |
Hot ductility behaviour of Al-Li alloy AA2091-T3
|
Hwang, RY; Chou, CP |
| 臺大學術典藏 |
2019-07-15T04:23:56Z |
Hot electron based surface plasmon resonance sensor with Au-TiO2-Ti planar micro-comb structure Schottky diodes
|
Wang C.;Chen L.-Q.;Chen Y.-M.;Lin C.-W.; Wang C.; Chen L.-Q.; Chen Y.-M.; Lin C.-W. |
| 淡江大學 |
2003-03-20 |
Hot embossing auto-leveling apparatus and method
|
趙崇禮; Chao, Choung-lii; Huang; Jung-yan; Tsai, Chu-shu; Mu, Chuan-kang; Yang, Jauh-jung; Huang, Cheng-chun ; Liu, Ming-yueh |
| 國立聯合大學 |
2008 |
Hot embossing by Joule heating
|
J. C. Lee, I. C. Leu*, G. L. Lai and M. H. Hon |
| 國立聯合大學 |
2007 |
Hot Embossing by Joule Heating
|
J. C. Lee, I. C. Leu, G. L. Lai and M. H. Hon, |
| 國立成功大學 |
2008-01 |
Hot embossing by Joule heating
|
Lee, Jui-Chi; Leu, Ing-Chi; Lai, K. L.; Hon, Min-Hsiung |
