元智大學 |
2003-11 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
|
楊鴻銘; 吳和生 |
元智大學 |
2002-12 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
|
楊鴻銘; 吳和生 |
元智大學 |
2002-12 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
|
楊鴻銘; 吳和生 |
國立交通大學 |
2014-12-08T15:42:26Z |
Interfacial mechanism studies of electroless plated Cu films on a-Ta : N layers catalyzed by PIII
|
Lin, JH; Lee, TL; Hsieh, WJ; Lin, CC; Kou, CS; Shih, HC |
臺大學術典藏 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han |
國立臺灣大學 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
|
Lin, Hsiu-Jen; Chuang, Tung-Han |
臺大學術典藏 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
|
Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
國立交通大學 |
2014-12-08T15:37:18Z |
Interfacial microstructure and electrical properties of PT/Al2O3/Si annealed at high temperatures
|
Chen, SY; Hsiao, CS; Hsu, JJ |
元智大學 |
Sep-18 |
Interfacial Microstructure and Mechanical Reliability of the Sn-Ag-Cu/Au/Pd(xP)/Ni(P) Reactive System: P Content Effects
|
Ying-Syuan Wu; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo; Cheng-En Ho |
國立成功大學 |
2006-09-28 |
Interfacial microstructure and shear behavior of Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste
|
Shih, Po-Cheng; Lin, Kwang-Lung |
國立成功大學 |
2011-04-29 |
Interfacial Microstructure Evolution of (B, Al)N Films Grown on Diamond Substrates
|
Song, Jen-Hao; Huang, Jow-Lay; Sung, James C.; Wang, Sheng-Chang; Lu, Horng-Hwa; Lii, Ding-Fwu |
國立中山大學 |
2002 |
Interfacial Microstructure of Pb-Free and Pb-Sn Solder Balls in the Ball-Grid Array Package
|
Chin-Su Chi;Hen-So Chang;Ker-Chang Hsieh;C.L. Chung |
元智大學 |
Aug-16 |
Interfacial Microstructures and Mechanical Properties of Molten Sn Reacting with Ni-xP Films
|
Wan-Zhen Hsieh; Md. Arifur Rahman; Tsung-Hsun Yang; Tsai-Tung Kuo; Cheng-En Ho |
國立聯合大學 |
2008 |
Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-1Al Pb-free solder pastes on OSP finished printed circuit boards
|
Ching-Tsung Lin, Chi-Shiung Hsi, Moo-Chin Wang, Tao-Chih Chang and Ming-Kann Liang |
臺大學術典藏 |
2018-09-10T03:44:28Z |
Interfacial microstructures of rf-sputtered TiNi shape memory alloy thin films on (100) silicon
|
Wu, S.K.; Chen, J.Z.; Wu, Y.J.; Wang, J.Y.; Yu, M.N.; Chen, F.R.; Kai, J.J.; SHYI-KAAN WU |
國立臺灣大學 |
2001 |
Interfacial microstructures of rf-sputtered TiNi shape memory alloy thin films on (100) silicon
|
Wu, S. K.; Chen, J. Z.; Wu, Y. J.; Wang, J. Y.; Yu, M. N.; Chen, F. R.; Kai, J. J. |
國立臺灣大學 |
2001 |
Interfacial microstructures of rf-sputtered TiNi shape memory alloy thin films on 100 Si
|
Wu, S. K.; Chen, J. Z.; Wu, Y. J.; Wang, J .Y.; Yu, M. N.; Chen, F. R.; Kai, J. J. |
國立臺灣科技大學 |
2013 |
Interfacial modification of the working electrode of dye-sensitized solar cells to improve the charge transport properties
|
Wu, K.-W.;Tedla, A.;Mu, Y.-T.;Tai, Y. |
國立交通大學 |
2014-12-08T15:05:52Z |
INTERFACIAL MORPHOLOGY AND PRE-OXIDATION EFFECT IN DENTAL ALLOY OPAQUE BONDING
|
DUH, JG; CHIEN, WS; CHIOU, BS |
國立成功大學 |
2007 |
Interfacial morphology in polymer light-emitting diodes
|
Jeng, Yeau-Ren; Guo, Ming-Lung; Li, Hung-Chang; Guo, Tzung-Fang |
臺大學術典藏 |
2018-09-10T07:47:04Z |
Interfacial nanostructuring on the performance of polymer/TiO2 nanorod bulk heterojunction solar cells
|
WEI-FANG SU;Chen, C.-W.;Chu, M.-W.;Chang, C.-P.;Su, W.-F.;Chang, C.-H.;Chuang, C.-H.;Li, S.-S.;Chu, T.-H.;Lin, Y.-Y.;WEI-FANG SU; Lin, Y.-Y.; Chu, T.-H.; Li, S.-S.; Chuang, C.-H.; Chang, C.-H.; Su, W.-F.; Chang, C.-P.; Chu, M.-W.; Chen, C.-W.; WEI-FANG SU |
臺大學術典藏 |
2019-11-27T02:28:34Z |
Interfacial nanostructuring on the performance of polymer/TiO2 nanorod bulk heterojunction solar cells
|
CHUN-WEI CHEN;Chen C.-W.;Chu M.-W.;Chang C.-P.;Su W.-F.;Chang C.-H.;Chuang C.-H.;Li S.-S.;Chu T.-H.;Lin Y.-Y.; Lin Y.-Y.; Chu T.-H.; Li S.-S.; Chuang C.-H.; Chang C.-H.; Su W.-F.; Chang C.-P.; Chu M.-W.; Chen C.-W.; CHUN-WEI CHEN |
臺大學術典藏 |
2020-04-24T08:53:14Z |
Interfacial nanostructuring on the performance of polymer/TiO2 nanorod bulk heterojunction solar cells
|
Chu, T.-H.; Li, S.-S.; Chuang, C.-H.; Chang, C.-H.; Su, W.-F.; Chang, C.-P.; Chu, M.-W.; Chen, C.-W.; Chen, C.-W.;Chu, M.-W.;Chang, C.-P.;Su, W.-F.;Chang, C.-H.;Chuang, C.-H.;Li, S.-S.;Chu, T.-H.;Lin, Y.-Y.; Lin, Y.-Y. |
國立臺灣海洋大學 |
2005 |
Interfacial operatior approach to computing modes of surface plasmon polariton for periodic structures
|
Chien C;Chang, R. L;Chern;C. Chung Chang;R. R. Hwang |
臺大學術典藏 |
2018-09-10T05:56:40Z |
Interfacial operator approach to computing band structures for photonic crystals of polar materials
|
Chern, R.-L. and Chang, C.C. and Chang, C.C.; RUEY-LIN CHERN |