| 臺大學術典藏 |
2008 |
Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish
|
Chuang, Tung-Han; Wu, Hui-Min; Jain, Chao-Chi; Wang, Shiuan-Sheng; Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han |
| 臺大學術典藏 |
2020-05-12T02:53:11Z |
Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finish
|
Jain, C.-C.; Wang, S.-S.; Wu, H.-M.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2008 |
Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads
|
Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H. |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads
|
Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
|
Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu Pads
|
TUNG-HAN CHUANG; Chuang, T.-H.; Lin, H.-J. |
| 臺大學術典藏 |
2008 |
Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish
|
ChuangTH; Wu, H.M.; Jain, C.C.; Chuang, T.H.; Chuang, T.H.; Jain, C.C.; Wu, H.M. |
| 國立臺灣大學 |
2008 |
Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish
|
Chuang, T.H.; Jain, C.C.; Wu, H.M. |
| 臺大學術典藏 |
2009-01-06T01:28:22Z |
Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads
|
Chuang, Tung-Han; Chi, Chih-Chien; Chi, Chih-Chien; Chuang, Tung-Han |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads
|
Chi, Chih-Chien; Chuang, Tung-Han |
| 臺大學術典藏 |
2006 |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
|
Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han; Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
|
Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2020-05-12T02:53:14Z |
Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads
|
Liu, Y.U.-C.; Lin, W.-H.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2006 |
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
|
ChuangTH; Cheng, M. D.; Yen, S. F.; Chuang, T. H.; Chuang, T. H.; Yen, S. F.; Cheng, M. D.Chuangth |
| 國立臺灣大學 |
2006 |
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
|
Chuang, T. H.; Yen, S. F.; Cheng, M. D. |
| 臺大學術典藏 |
2020-05-12T02:53:13Z |
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
|
Chuang, T.H.; Yen, S.F.; Cheng, M.D.; TUNG-HAN CHUANG |
| 國立成功大學 |
2012-10 |
Intermetallic solid solution Fe1-xCoxGa3: Synthesis, structure, NQR study and electronic band structure calculations
|
Verchenko, V. Yu; Likhanov, M. S.; Kirsanova, M. A.; Gippius, A. A.; Tkachev, A. V.; Gervits, N. E.; Galeeva, A. V.; Buettgen, N.; Kraetschmer, W.; Lue, C. S.; Okhotnikov, K. S.; Shevelkov, A. V. |
| 嘉南藥理大學 |
2009 |
Intermetallics
|
Elsevier SDOL |
| 國立臺灣大學 |
1991-06 |
Intermetallics Research and Development in Taiwan, R. O. C.
|
許樹恩; Lee, T. S.; Yang, C. C.; Wang C. Y.; Tong, C. H.; 吳錫侃; Hsu, Shu-En; Lee, T. S.; Yang, C. C.; Wang C. Y.; Tong, C. H.; Wu, Shyi-Kaan |
| 中國文化大學 |
2011-12 |
Intermetropolitan Networks of Co-invention in American Biotechnology
|
李德軒 |
| 國立成功大學 |
2005 |
Intermittency analyses on the SIERRA measurements of the electric field fluctuations in the auroral zone
|
Tam; �Tam,� Sunny �W. �Y.; Chang,� Tom; P. M. Kintner; E. Klatt |
| 元智大學 |
2016-12-04 |
Intermittent blood pressure prediction via multiscale entropy and ensemble artificial neural networks
|
Muammar Sadrawi; J.S. Shieh; Shou Zen Fan; Chien Hung Lin; Koichi Haraikawa; Jen Chien Chien; Maysam F. Abbod |
| 臺大學術典藏 |
2018-09-10T18:03:18Z |
Intermittent blood pressure prediction via multiscale entropy and ensemble artificial neural networks
|
Sadrawi, M.;Shieh, J.-S.;Fan, S.Z.;Lin, C.H.;Haraikawa, K.;Chien, J.C.;Abbod, M.F.; SHOU-ZEN FAN |
| 臺北醫學大學 |
2015 |
Intermittent bolus or continuous infusion of proton pump inhibitors for ulcer bleeding?
|
Hsu, YC;Lin, HJ |
| 義守大學 |
2015-03 |
Intermittent Bolus or Continuous Infusion of Proton Pump Inhibitors for Ulcer Bleeding?
|
Yao-Chun Hsu;Hwai-Jeng Lin |
