| 國立交通大學 |
2014-12-08T15:01:31Z |
Interfacial abruptness in Si/SiGe heteroepitaxy grown by ultrahigh vacuum chemical vapor deposition
|
Tsai, WC; Chang, CY; Jung, TG; Chang, TC; Lin, HC; Chen, LP |
| 中國文化大學 |
2002 |
Interfacial adhesion and microstructure of thick film metallized aluminum nitride substrates
|
Tsai CJ; Tseng WJ; Hsi CS |
| 國立臺灣大學 |
1999-11 |
Interfacial Adsorption in Ternary Alloys
|
Huang, C.; Cruz, M. Olvera de la; Voorhees, P. W. |
| 臺大學術典藏 |
2020-03-02T07:40:19Z |
Interfacial adsorption in ternary alloys
|
Huang, C.; Olvera De La Cruz, M.; Voorhees, P.W.; CHING-I HUANG |
| 義守大學 |
2013-12 |
Interfacial analysis of the ex-situ reinforced phase of a laser spot welded Zr-based bulk metallic glass composite
|
Huei-Sen Wang;Hou-Guang Chen;Jason Shian-Ching Jang;Dong-Yih Lin;Jhen-Wang Gu |
| 中原大學 |
2004-11 |
Interfacial Analysis on Crossflow Ultrafiltration of Binary Protein Mixture
|
Tung, K. L.;C. L. Li; |
| 國立交通大學 |
2014-12-08T15:35:14Z |
Interfacial and mechanical characterization of yttria-stabilized zirconia (YSZ) to stainless steel joints fabricated using Ag-Cu-Ti interlayers
|
Lin, Kun-Lin; Singh, Mrityunjay; Asthana, Rajiv; Lin, Chao-Hsien |
| 國立成功大學 |
2011 |
Interfacial and nano-scale mechanical properties in polymer bulk-heterojunctionn solar cells
|
Guo, Tzung-Fang; Hsiao, Yu-Jer; Rao, K. Koteswara; Jeng, Jun-Yuan; Jeng, Yean-Ren; Li, Hung-Chang; Wen, Ten-Chin |
| 國立成功大學 |
2006-12-25 |
Interfacial and quantum well effects on ac magnetotransport of La0.7Sr0.3MnO3/La1.4Sr1.6Mn2O7 composites
|
Hsu, C. Y.; Chou, Hsiung; Liao, B. Y.; Huang, Jung-Chun Andrew |
| 臺大學術典藏 |
2022-03-22T08:27:11Z |
Interfacial assembly of nanorods: Smectic alignment and multilayer stacking
|
Cheng Y.-T;Tsao H.-K;Sheng Y.-J.; Cheng Y.-T; Tsao H.-K; Sheng Y.-J.; YU-JANE SHENG |
| 臺大學術典藏 |
2022-03-22T08:30:07Z |
Interfacial assembly of nanorods: Smectic alignment and multilayer stacking
|
Cheng Y.-T;Tsao H.-K;Sheng Y.-J.; Cheng Y.-T; Tsao H.-K; Sheng Y.-J.; YU-JANE SHENG |
| 臺大學術典藏 |
2022-03-22T08:30:08Z |
Interfacial assembly of nanorods: Smectic alignment and multilayer stacking
|
Cheng Y.-T;Tsao H.-K;Sheng Y.-J.; Cheng Y.-T; Tsao H.-K; Sheng Y.-J.; YU-JANE SHENG |
| 臺大學術典藏 |
2021-09-14T23:19:20Z |
Interfacial assembly of nanorods: Smectic alignment and multilayer stacking
|
Cheng, Yi Ting; Tsao, Heng Kwong; YU-JANE SHENG |
| 元智大學 |
Oct-14 |
Interfacial atomic structure analysis at sub-angstrom resolution using aberration-corrected STEM
|
Chien-Nan Hsiao; Shou-Yi Kuo; Fang-I Lai; Wei-Chun Chen |
| 國立臺灣大學 |
2002 |
Interfacial Behavior between BZN-V and Ag
|
Su, W-F; Lin, S-C |
| 國立東華大學 |
2006-07 |
Interfacial Behaviour between Bi-Ag based Solders and Ni substrate
|
Song,J. M.; Chuang,H. Y. |
| 國立東華大學 |
2007 |
Interfacial Behaviour between Bi-Ag Solders and the Ni substrate
|
宋振銘; 莊鑫毅 |
| 臺大學術典藏 |
2018-06-28T21:48:08Z |
Interfacial behaviour between Bi1.5ZnNb1.5O7.0.02V2O5 and Ag
|
Lin, Shin-Chih; Su, Wei-Fang; Su, Wei-Fang; Lin, Shin-Chih |
| 國立臺灣大學 |
2003 |
Interfacial behaviour between Bi1.5ZnNb1.5O7.0.02V2O5 and Ag
|
Su, Wei-Fang; Lin, Shin-Chih |
| 臺大學術典藏 |
2003 |
Interfacial behaviour between Bi1.5ZnNb1.5O7·0.02V2O5and Ag
|
Lin, S.-C.; WEI-FANG SU; Su, W.-F.; WEI-FANG SU;Lin, S.-C.;Su, W.-F.;WEI-FANG SU |
| 國立東華大學 |
2006 |
Interfacial behaviour between molten Bi based solders and Cu substrate
|
宋振銘; 莊鑫毅 |
| 國立成功大學 |
2005-01 |
Interfacial bonding behavior with introduction of Sn-Zn-Bi paste to Sn-Ag-Cu ball grid array package during multiple reflows
|
Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立臺灣科技大學 |
2009 |
Interfacial bonding strength between brazing alloys and CVD diamond
|
Hsieh Y.-C.; Lin S.-T. |
| 國立臺灣大學 |
1993 |
Interfacial characterisation of Al2O3-Ni composites
|
Chang, L.; Chen, S.C.; Tuan, W.H.; Brook, R.J. |
| 臺大學術典藏 |
2020-05-12T02:54:02Z |
Interfacial characterisation of Al2O3-Ni composites
|
Chang, L.; Chen, S.C.; Tuan, W.H.; Brook, R.J.; WEI-HSING TUAN |
