English  |  正體中文  |  简体中文  |  总笔数 :2837387  
造访人次 :  39271722    在线人数 :  907
教育部委托研究计画      计画执行:国立台湾大学图书馆
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
关于TAIR

浏览

消息

著作权

相关连结

跳至: [ 中文 ] [ 数字0-9 ] [ A B C D E F G H I J K L M N O P Q R S T U V W X Y Z ]
请输入前几个字:   

显示项目 517051-517075 / 2332462 (共93299页)
<< < 20678 20679 20680 20681 20682 20683 20684 20685 20686 20687 > >>
每页显示[10|25|50]项目

机构 日期 题名 作者
國立聯合大學 2004 Intermetallic Compounds Formation of the Sn-9Zn-xAg Lead-free Solders Hot-dipped on Cu Substrate T.C. Chang , . M.C. Wang(王木琴) and M..H. Hon
國立成功大學 2003-04-30 Intermetallic compounds formed at the interface between Cu substrate and an Sn-9Zn-0.5Ag lead-free solder Chang, Tao-Chih; Hon, Min-Hsiung; Wang, Moo-Chin
國立臺灣大學 2002 Intermetallic compounds formed at the interface between liquid indium and copper substrates Yu, C. L.; Wang, S. S.; Chuang, T. H.
臺大學術典藏 2020-05-12T02:53:18Z Intermetallic compounds formed at the interface between liquid indium and copper substrates Yu, C.L.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:14Z Intermetallic compounds formed during diffusion soldering of Au/Cu/Al 2O3 and Cu/Ti/Si with Sn/In interlayer Chuang, T.-H.; Lin, H.-J.; Tsao, C.-W.; TUNG-HAN CHUANG
臺大學術典藏 2009-01-06T01:29:28Z Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer Tsao, Cheng-Wen; Chuang, Tung-Han; Lin, Hsiu-Jen; Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen
國立臺灣大學 2006 Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer Chuang, Tung-Han; Lin, Hsiu-Jen; Tsao, Cheng-Wen
國立臺灣大學 2002 Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates Chiu, M. Y.; Wang, S. S.; Chuang, T. H.
臺大學術典藏 2020-05-12T02:53:18Z Intermetallic compounds formed during interfacial reactions between liquid Sn-8Zn-3Bi solders and Ni substrates Chiu, M.Y.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG
國立臺灣大學 2006 Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates Wang, S. S.; Tseng, Y. H.; Chuang, T. H.
臺大學術典藏 2020-05-12T02:53:14Z Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates Wang, S.S.; Tseng, Y.H.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:29Z Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates Wang, S. S.; Tseng, Y. H.; Chuang, T. H.; TUNG-HAN CHUANG
國立臺灣大學 2004 Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu Solder Ball Grid Array Packages Cheng, M. D.; Chang, S. Y.; Yen, S. F.; Chuang, T. H.
臺大學術典藏 2020-05-12T02:53:29Z Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages (vol 33, pg 171, 2004) TUNG-HAN CHUANG; Yen, S. F.; Chuang, T. H.; Chang, S. Y.; Cheng, M. D.
臺大學術典藏 2020-05-12T02:53:15Z Intermetallic Compounds Formed during the Reflow and Aging of Sn-3.8Ag-0.7Cu and Sn-20ln-2Ag-0.5Cu Solder Ball Grid Array Packages Cheng, M.D.; Yen, S.F.; Yen, S.F.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:17Z Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages Chuang, T.H.; Chang, S.Y.; Tsao, L.C.; Weng, W.P.; Wu, H.M.; TUNG-HAN CHUANG
臺大學術典藏 2018-06-28T22:11:27Z Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.; ChuangTH
國立臺灣大學 2003 Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages Chuang, T. H.; Chang, S. Y.; Tsao, L. C.; Weng, W. P.; Wu, H. M.
國立臺灣大學 2002 Intermetallic Compounds formed during the Soldering Reactions of Eutectic Sn-9Zn with Cu and Ni Substrates Chan, Y. C.; Chiu, M. Y.; Chuang, T. H.
臺大學術典藏 2020-05-12T02:53:18Z Intermetallic compounds formed during the soldering reactions of eutectic Sn-9Zn with Cu and Ni substrates Chan, Y.C.; Chiu, M.Y.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:10Z Intermetallic compounds formed in In-3Ag solder BGA packages with ENIG and ImAg surface finishes Chuang, T.H.; Jain, C.C.; Wang, S.S.; TUNG-HAN CHUANG
國立臺灣大學 2008 Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H.
臺大學術典藏 2020-01-06T03:11:16Z Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads Jain, C. C.; Wang, S. S.; Huang, K. W.; Chuang, T. H.; STEVEN SHENG-SHIH WANG
臺大學術典藏 2020-05-12T02:53:10Z Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads Jain, C.C.; Wang, S.S.; Huang, K.W.; Chuang, T.H.; TUNG-HAN CHUANG
國立交通大學 2019-04-03T06:42:01Z Intermetallic compounds in 3D integrated circuits technology: a brief review Annuar, Syahira; Mahmoodian, Reza; Hamdi, Mohd; Tu, King-Ning

显示项目 517051-517075 / 2332462 (共93299页)
<< < 20678 20679 20680 20681 20682 20683 20684 20685 20686 20687 > >>
每页显示[10|25|50]项目