|
显示项目 519041-519065 / 2346260 (共93851页)
<< < 20757 20758 20759 20760 20761 20762 20763 20764 20765 20766 > >>
每页显示[10|25|50]项目
| 淡江大學 |
2012 |
Interfacial interaction of gas molecules and single-walled carbon nanotubes
|
Zhou, Jun; Gu, Yudong; Hu, Youfan; Mai,Wenjie; Yeh,Ping-Hung; Bao, Gang; Sood, Ashok K.; Polla,Dennis L.; Wang, Zhong Lin |
| 淡江大學 |
2012-05 |
Interfacial interaction of gas molecules and single-walled carbon nanotubes
|
Zhong, Jun; Chiou, Jauwern; Dong, Chungli; Glans, Per-Anders; Pong, Way-Faung; Chang, Chinglin; Wu, Ziyu; Guo, Jinghua |
| 臺大學術典藏 |
2018-09-10T08:18:30Z |
Interfacial Interactions and Doping in Organic Light-Emitting Diodes Incorporated with Cesium-based Compounds
|
Chen, Mei-Hsin;Lu, Yin-Jui;Chang, Yu-Jen;Wu, Chung-Chih;Wu, Chih-I; Chen, Mei-Hsin; Lu, Yin-Jui; Chang, Yu-Jen; Wu, Chung-Chih; Wu, Chih-I; Wu, Chung-Chih; Wu, Chih-I |
| 國立勤益科技大學 |
2004 |
Interfacial interactions and their influence to phase behavior in poly(vinyl pyrrolidone)/silica hybrid materials prepared by sol–gel process
|
Chan, Cheng-Kuang;Chu, I-Ming;Ou, Cheng-Fang; Lin, Yen-Wen |
| 國立交通大學 |
2018-08-21T05:54:23Z |
Interfacial Investigation on Printable Carbon-Based Mesoscopic Perovskite Solar Cells with NiOx/C Back Electrode
|
Behrouznejad, Fatemeh; Tsai, Cheng-Min; Narra, Sudhakar; Diau, Eric W. -G.; Taghavinia, Nima |
| 臺大學術典藏 |
2018-09-10T05:20:10Z |
Interfacial kinetic roughening with correlated noise
|
Pang, N.-N.;Yu, Y.-K.;Halpin-Healy, T.; Pang, N.-N.; Yu, Y.-K.; Halpin-Healy, T.; NING-NING PANG |
| 國立交通大學 |
2014-12-08T15:08:14Z |
Interfacial layer dependence on device property of high-kappa TiLaO Ge/Si N-type metal-oxide-semiconductor capacitors at small equivalent-oxide thickness
|
Chen, W. B.; Chin, Albert |
| 國立交通大學 |
2019-04-02T06:04:16Z |
Interfacial Layer Engineering for Ge MOSFET by Metal Element Doping and Characterization of Interface Density
|
Chien, Chao-Hsin |
| 臺大學術典藏 |
2018-09-10T09:48:16Z |
Interfacial layer reduction and high permittivity tetragonal ZrO 2 on germanium reaching ultrathin 0.39 nm equivalent oxide thickness
|
CHEE-WEE LIU; Liu, C.W.; Hu, C.; Luo, S.-J.; Wong, I.-H.; Chang, H.-C.; Lin, C.-M.; Lin, C.-M.;Chang, H.-C.;Wong, I.-H.;Luo, S.-J.;Liu, C.W.;Hu, C. |
| 國立交通大學 |
2014-12-08T15:06:28Z |
INTERFACIAL LAYER THEORY OF THE SCHOTTKY-BARRIER DIODES
|
WU, CY |
| 臺大學術典藏 |
2018-09-10T09:22:34Z |
Interfacial layer-free ZrO2 on Ge with 0.39-nm EOT, κ?43, ?2×10-3 A/cm2 gate leakage, SS =85 mV/dec, Ion/Ioff =6×105, and high strain response
|
Chang, H.-C.; Chen, Y.-T.; Wong, I.-H.; Lan, H.-S.; Luo, S.-J.; Lin, J.-Y.; Tseng, Y.-J.; Liu, C.W.; Hu, C.; Yang, F.-L.; Lin, C.-M.; CHEE-WEE LIU et al. |
| 國立交通大學 |
2014-12-08T15:06:24Z |
INTERFACIAL LAYER-THERMIONIC-DIFFUSION THEORY FOR THE SCHOTTKY-BARRIER DIODE
|
WU, CY |
| 臺大學術典藏 |
2021-12-10T08:36:46Z |
Interfacial Layering and Screening Behavior of Glyme-Based Lithium Electrolytes
|
Nojabaee, M; Cheng, HW; Valtiner, M; Popovic, J; Maier, J; HSIU-WEI CHENG |
| 國立成功大學 |
2021 |
Interfacial magnetic coupling in Co/antiferromagnetic van der Waals compound FePS3
|
Dhanarajgopal, A.;Chang, P.-C.;Liu, S.-Y.;Chuang, T.-H.;Wei, D.-H.;Kuo, C.-C.;Kuo, C.-N.;Lue, C.S.;Lin, W.-C. |
| 臺大學術典藏 |
2020-03-31T08:24:54Z |
Interfacial magnetic coupling in hetero-structure of Fe/double-perovskite NdBaMn2O6 single crystal
|
Lin, W. C.; Tsai, C. L.; Ogawa, K.; Yamada, S.; Gandhi, A. C.; Lin, J. G. |
| 元智大學 |
2003-11 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
|
楊鴻銘; 吳和生 |
| 元智大學 |
2002-12 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
|
楊鴻銘; 吳和生 |
| 元智大學 |
2002-12 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
|
楊鴻銘; 吳和生 |
| 元智大學 |
2002-12 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
|
楊鴻銘; 吳和生 |
| 國立交通大學 |
2014-12-08T15:42:26Z |
Interfacial mechanism studies of electroless plated Cu films on a-Ta : N layers catalyzed by PIII
|
Lin, JH; Lee, TL; Hsieh, WJ; Lin, CC; Kou, CS; Shih, HC |
| 臺大學術典藏 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 國立臺灣大學 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
|
Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
|
Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 國立交通大學 |
2014-12-08T15:37:18Z |
Interfacial microstructure and electrical properties of PT/Al2O3/Si annealed at high temperatures
|
Chen, SY; Hsiao, CS; Hsu, JJ |
| 元智大學 |
Sep-18 |
Interfacial Microstructure and Mechanical Reliability of the Sn-Ag-Cu/Au/Pd(xP)/Ni(P) Reactive System: P Content Effects
|
Ying-Syuan Wu; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo; Cheng-En Ho |
显示项目 519041-519065 / 2346260 (共93851页)
<< < 20757 20758 20759 20760 20761 20762 20763 20764 20765 20766 > >>
每页显示[10|25|50]项目
|
