|
顯示項目 545206-545215 / 2348719 (共234872頁)
<< < 54516 54517 54518 54519 54520 54521 54522 54523 54524 54525 > >>
每頁顯示[10|25|50]項目
| 東方設計學院 |
2008-11-07 |
Lead-Free Piezoelectric Ceramic K0.5Na0.5NbO3
|
Cheng, C.M.; Chen, K.H.; Jong, F.C.; Cheng, W.H.; Kung, M.C.; 陳開煌; (東方技術學院電子與資訊系) |
| 南台科技大學 |
2023-01 |
Lead-Free Piezoelectric Ceramic Micro-Pressure Thick Films
|
Kai-Huang Chen;Chien-Min Cheng;Ying-Jie Chen;Mei-Li Chen |
| 南台科技大學 |
2008-11 |
LEAD-FREE PIEZOELECTRIC CERAMICS K0.5Na0.5NbO3
|
C. M. Cheng; K. H. Chen; F. C. Jong; C. F. Yang; W. H. Cheng; M. C. Kung |
| 南台科技大學 |
2008 |
LEAD-FREE PIEZOELECTRIC CERAMICS K0.5Na0.5NbO3
|
C. M. Cheng; K. H. Chen; F. C. Jong; C. F. Yang; W. H. Cheng; M. C. Kung |
| 國立成功大學 |
2002-01-15 |
Lead-free Solder
|
Lin, Kwang-Lung; Chen, Kang-I; Cheng, Shou-Chang; Huang, Jia-Wei |
| 國立成功大學 |
2002-05-01 |
Lead-free Solder
|
Lin, Kwang-Lung; Chen, Kang-I; Cheng, Shou-Chang; Huang, Jia-Wei |
| 國立臺灣大學 |
2006-12 |
Lead-Free Solder Implementation: Reliability, Alloy Development, New Technology
|
N. Chawla, S. Chada, S. K. Kang, C. R. Kao, K. W. Lin, J. Lucas,; L. Turbini |
| 國立成功大學 |
2006-12 |
Lead-free solder implementation: Reliability, alloy development, new technology - Foreword
|
Chawla, Nik; Chada, Srinivas; Kang, Sung K.; Kao, C. Robert; Lin, Kwang-Lung; Lucas, Jim; Turbini, Laura |
| 國立交通大學 |
2014-12-08T15:10:27Z |
Lead-free solder joint reliability estimation of flip chip package using FEM-based sensitivity analysis
|
Lee, Chang-Chun; Chang, Kuo-Chin; Yang, Ya-Wen |
| 國立臺灣大學 |
2001-09 |
Lead-free solder materials and soldering technologies
|
Kang, S. K.; Mavoori, H.; Chada, S.; Kao, C. R.; Smith, and R. W. |
顯示項目 545206-545215 / 2348719 (共234872頁)
<< < 54516 54517 54518 54519 54520 54521 54522 54523 54524 54525 > >>
每頁顯示[10|25|50]項目
|
