| 臺大學術典藏 |
2018-09-10T03:42:37Z |
Metallo-β-lactamases in clinical Pseudomonas isolates in Taiwan and identification of VIM-3, a novel variant of the VIM-2 enzyme
|
Yan, J.-J. and Hsueh, P.-R. and Ko, W.-C. and Luh, K.-T. and Tsai, S.-H. and Wu, H.-M. and Wu, J.-J.; PO-REN HSUEH |
| 臺大學術典藏 |
2020-03-27T05:31:09Z |
Metallo-β-lactamases in clinical Pseudomonas isolates in Taiwan and identification of VIM-3, a novel variant of the VIM-2 enzyme
|
Wu J.-J.;Wu H.-M.;Tsai S.-H.;Luh K.-T.;Ko W.-C.;PO-REN HSUEH;Yan J.-J.; Yan J.-J.; PO-REN HSUEH; Ko W.-C.; Luh K.-T.; Tsai S.-H.; Wu H.-M.; Wu J.-J. |
| 義守大學 |
1999 |
Metallocene聚烴基彈性體與交連助劑TAC交連加工研究
|
戴宏哲 |
| 淡江大學 |
2018-03-18 |
Metallodithiolate ligands as pendant base in [FeIFeI], [FeI[Fe(NO)]II] and [(μ-H)FeIIFeII] systems
|
Kariyawasam Pathirana, Kavindu Dilshan;Ghosh, Pokhraj;Hsieh, Chung-Hung;Bhuvanesh, Nattamai;Darensbourg, Marcetta Y. |
| 淡江大學 |
2014 |
Metallodithiolates as Ligands to Dinitrosyl Iron Complexes: Toward the Understanding of Structures, Equilibria, and Spin Coupling
|
Pinder Tiffany A.; Montalvo Steven K.; Hsieh, Chung-Hung; Lunsford Allen M.; Bethel Ryan D.; Pierce Brad S; Darensbourg Marcetta Y. |
| 南台科技大學 |
1992-12 |
Metallographic development and thermal reaction of 304L-Si powder mixtures during sintering
|
王文峰; W. F. Wang |
| 國立成功大學 |
2023-02 |
Metallographic Mechanism of Embrittlement of 15 μm Ultrafine Quaternary Silver Alloy Bonding Wire in Chloride Ions Environment
|
Zhao;Jun-Ren;Hung;Fei-Yi;Hsu;Che-Wei |
| 國立東華大學 |
2007-07 |
Metallomesogen of Ag(I), Au(I) and Pd(II) Complexes of N-Alkyl Imidazoles With A 2-Hydroxyldroxyl Pendant
|
Chiou, J. Y. Z. ; S. W. T. Chiang; I. J. B. Lin. |
| 中國醫藥大學 |
2006-02-? |
Metallomesogenic stationary phase for open-tubular capillary electrochromatography?
|
陳建良(Jian-Lian Chen)? |
| 國立臺灣大學 |
1996 |
Metallomesogens as stationary phases for ligand exchange gas chromatography — Part I. The use of nickel and zinc complexes of 4-decanoxydithiobenzoic acid for the separation of polycyclic aromatic hydrocarbons and dialkyl sulfides
|
Hu, Cho-Chun; Liu, Chuen-Ying |
| 國立臺灣大學 |
1999 |
Metallomesogens as stationary phases for the separation of phenols by gas chromatography
|
Liu, Chuen-Ying; Hu, Cho-Chun; Chen, Jien-Lian; Liu, Kung-Tien |
| 嘉南藥理大學 |
2009 |
Metallomics
|
RSC Publishing |
| 國立成功大學 |
2000-06 |
Metalloprotease is not essential for Vibrio vulnificus virulence in mice
|
Shao, Chung-Ping; Hor, Lien-I |
| 臺北醫學大學 |
2011 |
Metalloproteinase expression as biomarker in patients with colorectal polyps: a preliminary study
|
JH, Chen;CM, Chen;CK, Shih;CS, Lei;CH, Chou;SC, Li |
| 國立臺灣大學 |
2005 |
Metallothionein induction and heavy metal accumulation in white shrimp Litopenaeus vannamei exposed to cadmium and zinc
|
Wu, Jui Pin; Chen, Hon-Cheng |
| 國立臺灣大學 |
2005-01 |
Metallothionein induction and heavy metal accumulation in white shrimp Litopenaeus vannamei exposed to cadmium and zinc.
|
Wu, JP; Chen, HC |
| 中山醫學大學 |
2010-12-03 |
Metallothionein-1 genotypes in the risk of oral squamous cell carcinoma
|
AI, Zavras;AJ, Yoon;MK, Chen;CW, Lin;SF, Yang |
| 國立成功大學 |
2020 |
Metallothionein在Vitamin D Binding Protein調控卵巢癌惡化或抗藥性上的角色
|
黃于芳;周振陽;吳怡慧 |
| 國立成功大學 |
2019 |
Metallothionein在Vitamin D Binding Protein調控卵巢癌惡化或抗藥性上的角色
|
黃于芳;吳怡慧 |
| 國立成功大學 |
2021 |
Metallothionein在Vitamin D Binding Protein調控卵巢癌惡化或抗藥性上的角色
|
黃于芳; 周振陽;吳怡慧 |
| 國立成功大學 |
2014 |
Metallurgical Mechanism and Optical Properties of CuSnZnSSe Powders Using a 2-Step Sintering Process
|
Liu, Tai-Hsiang; Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Kuan-Jen |
| 國立東華大學 |
2008-12 |
Metallurgical Perspective on Alloying Modification of Sn-Ag-Cu Solders
|
Song,J. M.; Li-Wei Lin,; Ning-Cheng Lee,; Yi-Shao Lai,; Ying-Ta Chiu, |
| 國立交通大學 |
2014-12-08T15:40:03Z |
Metallurgical reaction of the Sn-3.5Ag solder and Sn-37Pb solder with Ni/Cu under-bump metallization in a flip-chip package
|
Huang, CS; Duh, JG; Chen, YM |
| 國立交通大學 |
2014-12-08T15:03:14Z |
METALLURGICAL REACTIONS AT THE INTERFACE OF SN/PB SOLDER AND ELECTROLESS COPPER-PLATED ALN SUBSTRATE
|
CHIOU, BS; CHANG, JH; DUH, JG |
| 國立交通大學 |
2014-12-08T15:18:20Z |
Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization
|
Huang, CP; Chen, C; Liu, CY; Lin, SS; Chen, KH |
