| 國立臺灣大學 |
1999 |
Metallomesogens as stationary phases for the separation of phenols by gas chromatography
|
Liu, Chuen-Ying; Hu, Cho-Chun; Chen, Jien-Lian; Liu, Kung-Tien |
| 嘉南藥理大學 |
2009 |
Metallomics
|
RSC Publishing |
| 國立成功大學 |
2000-06 |
Metalloprotease is not essential for Vibrio vulnificus virulence in mice
|
Shao, Chung-Ping; Hor, Lien-I |
| 臺北醫學大學 |
2011 |
Metalloproteinase expression as biomarker in patients with colorectal polyps: a preliminary study
|
JH, Chen;CM, Chen;CK, Shih;CS, Lei;CH, Chou;SC, Li |
| 國立臺灣大學 |
2005 |
Metallothionein induction and heavy metal accumulation in white shrimp Litopenaeus vannamei exposed to cadmium and zinc
|
Wu, Jui Pin; Chen, Hon-Cheng |
| 國立臺灣大學 |
2005-01 |
Metallothionein induction and heavy metal accumulation in white shrimp Litopenaeus vannamei exposed to cadmium and zinc.
|
Wu, JP; Chen, HC |
| 中山醫學大學 |
2010-12-03 |
Metallothionein-1 genotypes in the risk of oral squamous cell carcinoma
|
AI, Zavras;AJ, Yoon;MK, Chen;CW, Lin;SF, Yang |
| 國立成功大學 |
2020 |
Metallothionein在Vitamin D Binding Protein調控卵巢癌惡化或抗藥性上的角色
|
黃于芳;周振陽;吳怡慧 |
| 國立成功大學 |
2019 |
Metallothionein在Vitamin D Binding Protein調控卵巢癌惡化或抗藥性上的角色
|
黃于芳;吳怡慧 |
| 國立成功大學 |
2021 |
Metallothionein在Vitamin D Binding Protein調控卵巢癌惡化或抗藥性上的角色
|
黃于芳; 周振陽;吳怡慧 |
| 國立成功大學 |
2014 |
Metallurgical Mechanism and Optical Properties of CuSnZnSSe Powders Using a 2-Step Sintering Process
|
Liu, Tai-Hsiang; Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Kuan-Jen |
| 國立東華大學 |
2008-12 |
Metallurgical Perspective on Alloying Modification of Sn-Ag-Cu Solders
|
Song,J. M.; Li-Wei Lin,; Ning-Cheng Lee,; Yi-Shao Lai,; Ying-Ta Chiu, |
| 國立交通大學 |
2014-12-08T15:40:03Z |
Metallurgical reaction of the Sn-3.5Ag solder and Sn-37Pb solder with Ni/Cu under-bump metallization in a flip-chip package
|
Huang, CS; Duh, JG; Chen, YM |
| 國立交通大學 |
2014-12-08T15:03:14Z |
METALLURGICAL REACTIONS AT THE INTERFACE OF SN/PB SOLDER AND ELECTROLESS COPPER-PLATED ALN SUBSTRATE
|
CHIOU, BS; CHANG, JH; DUH, JG |
| 國立交通大學 |
2014-12-08T15:18:20Z |
Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization
|
Huang, CP; Chen, C; Liu, CY; Lin, SS; Chen, KH |
| 國立成功大學 |
2018 |
Metalmetal joining using super-spread wetting into interface fine mesh structure
|
Yeon, J.;Yen, Yen Y.-M.;Nakamoto, M.;Tanaka, Tanaka T. |
| 中山醫學大學 |
2019-07-01 |
MetaLnc9-FoxO3致病鏈促使頰黏膜肌纖維母細胞轉分化及產生氧化壓力的分子機制剖析及其診治應用評估(1/3)
|
呂明怡 |
| 國立中山大學 |
1992 |
Metalorganic chemical vapor deposition growth of Ga(0.5)In(0.5)P ordered alloys by phosphate modulation
|
M.K. Lee; R.H. Horng; L.C. Haung |
| 國立中山大學 |
1992 |
Metalorganic chemical vapor deposition growth of Ga(0.5)In(0.5)P ordered alloys by phosphate modulation
|
M.K. Lee;R.H. Horng;L.C. Haung |
| 國立臺灣大學 |
2009 |
Metalorganic chemical vapor deposition of GaN layers on ZnO substrates using Al2O3 as a transition layer
|
Wang, Shen-Jie; Li, Nola; Yu, Hong Bo; Feng, Zhe Chuan; Summers, Christopher; Ferguson, Ian |
| 國立臺灣大學 |
2007 |
Metalorganic Chemical Vapor Deposition of InGaN Layers on ZnO Substrates
|
Wang, Shen-Jie; Li, Nola; Park, Eun-Hyun; Lien, Siou-Cheng; Feng, Zhe Chuan; Valencia, Adriana; Nause, Jeff; Ferguson, Ian |
| 國立臺灣科技大學 |
2003 |
Metalorganic chemical vapor deposition of SrRuO3 thin film and its characterization
|
Lee, H.C.;Tsai, D.S. |
| 國立交通大學 |
2014-12-08T15:42:31Z |
Metalorganic chemical vapor deposition of tungsten carbonitride films by bis(tertbutylimido)bis(diethylamido)tungsten.
|
Chuang, SH; Chiu, HT; Chou, YH; Chang, YH; Chen, SF; Yang, JY |
| 國立交通大學 |
2014-12-08T15:02:46Z |
Metalorganic chemical vapor deposition of tungsten nitride for advanced metallization
|
Tsai, MH; Sun, SC; Chiu, HT; Chuang, SH |
| 國立交通大學 |
2019-04-02T05:59:15Z |
METALORGANIC CHEMICAL-VAPOR-DEPOSITION OF TANTALUM NITRIDE BY TERTBUTYLIMIDOTRIS(DIETHYLAMIDO)TANTALUM FOR ADVANCED METALLIZATION
|
TSAI, MH; SUN, SC; CHIU, HT; TSAI, CE; CHUANG, SH |
