| 嘉南藥理大學 |
2009 |
Pacific-Basin Finance Journal
|
Elsevier SDOL |
| 國立中山大學 |
2006-06-02 |
Pacifism, Nationalism, and Security Alliance in Japan
|
Reinhot S. Shi; 施少棠 |
| 中原大學 |
1993-12 |
Pacing-induced left ventricular asynchronies in Dogs with Critical Coronary Stenosis: Mechanisms and effect of Anesthetics
|
Spahn, D.R.;Hu, W.;Smith, L.R.;Lenoe, B.J. |
| 國立交通大學 |
2018-08-21T05:53:16Z |
Pack Graphs with Subgraphs of Size Three
|
Chen, Zhen-Chun; Fu, Hung-Lin; Huang, Kuo-Ching |
| 國立交通大學 |
2019-08-02T02:24:21Z |
Package and Chip Accelerated Aging Methods for Power MOSFET Reliability Evaluation
|
Lin, Tingyou; Su, Chauchin; Hung, Chung-Chih; Nidhi, Karuna; Tu, Chily; Huang, Shao-Chang |
| 國立高雄師範大學 |
2004-10 |
Package and PCB effects on linearity of a micromixer-based W-CDMA upconverter
|
Jian-Ming Wu;F. Y. Han;J. K. Jau;T.S. Horng; 吳建銘 |
| 國立中山大學 |
2004-10 |
Package and PCB effects on linearity of a micromixer-based W-CDMA upconverter
|
J.M. Wu;F.Y. Han;J.K. Jau;T.S. Horng |
| 國立高雄師範大學 |
2004-12 |
Package and PCB effects on the linearity of W-CDMA upconverter MM
|
Jian-Ming Wu;T. S. Horng; 吳建銘 |
| 國立中山大學 |
2004-12 |
Package and PCB effects on the linearity of W-CDMA upconverter MMICs
|
J.M. Wu;T.S. Horng |
| 國立臺灣科技大學 |
2014 |
Package design: Colour harmony and consumer expectations
|
Wei, S.-T.;Ou, L.-C.;Luo, M.R.;Hutchings, J.B. |
| 國立中山大學 |
2003-12-06 |
Package Implementation: A Study of Data and Output Misfit Identification
|
Jen-Her Wu;Chi-Cheng Wu;Shin-Shing Shin |
| 淡江大學 |
2018-10-04 |
Package mTEXO for testing the presence of outliers in exponential samples
|
Lin, Chien-Tai;Lee, Ying-Chen;Balakrishnan, Narayanaswamy |
| 淡江大學 |
2018-07-28 |
Package mTEXO for testing the presence of outliers in exponential samples
|
Lin, C. T.;Lee, Y. C.;Balakrishnan, N. |
| 淡江大學 |
2018-10-04 |
Package mTEXO for testing the presence of outliers in exponential samples.
|
Chien-Tai Lin, Ying Chen Lee, and N. Balakrishnan |
| 國立交通大學 |
2017-04-21T06:49:40Z |
Package Routability- and IR-Drop-Aware Finger/Pad Assignment in Chip-Package Co-Design
|
Lu, Chao-Hung; Chen, Hung-Ming; Liu, Chien-Nan Jimmy; Shih, Wen-Yu |
| 國立交通大學 |
2014-12-08T15:31:26Z |
Package routability- and IR-drop-aware finger/pad planning for single chip and stacking IC designs
|
Lu, Chao-Hung; Chen, Hung-Ming; Liu, Chien-Nan Jimmy; Shih, Wen-Yu |
| 國立交通大學 |
2015-12-04T07:03:11Z |
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
|
LIN Chien-Chung; KUO Hao-Chung; CHEN Kuo-Ju; HAN Hau-Vei; CHEN Hsin-Chu |
| 國立交通大學 |
2017-02-09 |
PACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICE
|
Hsien-Hao Tu; Zong-Yi Tu; Kuo-Ju Chen; Hau-Vei Han; Chin-Wei Sher; Hao-Chung Kuo; Chien-Chung Lin |
| 國立臺灣科技大學 |
2020 |
Package structure of polarized white chip-on-board light-emitting diode with high thermal conductivity
|
Su, J.-C.;Huang, S.-B. |
| 義守大學 |
2007-02 |
Package-induced cross-coupling effect on amplifier harmonic suppression
|
Han-Jan Chen;Tsung-Hui Huang;Chin-Sheng Chang;Lih-Shan Chen;Jui-Hong Horng;Yeong-Her Wang;Mau-Phon Houng |
| 國立成功大學 |
2007-02 |
Package-induced cross-coupling effect on amplifier harmonic suppression
|
Chen, Han-Jan; Huang, Tsung-Hui; Chang, Chin-Sheng; Chen, Lih-Shan; Horng, Jui-Hong; Wang, Yeong-Her; Houng, Mau-Phon |
| 國立成功大學 |
2016-08-03 |
Package-on-Package封裝體之熱傳研究
|
周景弘; Chou, Ching-Hung |
| 國立成功大學 |
2016-07-08 |
Package-on-Package封裝體之熱傳研究
|
周景弘; Chou, Ching-Hung |
| 臺大學術典藏 |
2018-09-10T04:55:28Z |
Package-strain-enhanced device and circuit performance
|
Maikap, S.;Liao, M.H.;Yuan, F.;Lee, M.H.;Huang, C.-F.;Chang, S.T.;Liu, C.W.; Maikap, S.; Liao, M.H.; Yuan, F.; Lee, M.H.; Huang, C.-F.; Chang, S.T.; Liu, C.W.; CHEE-WEE LIU |
| 臺大學術典藏 |
2019-03-11T08:00:57Z |
Package-strain-enhanced device and circuit performance
|
Liu, C.W.;Chang, S.T.;Huang, C.-F.;Lee, M.H.;Yuan, F.;Maikap, S.;Liao, M.H.; Maikap, S.; Liao, M.H.; Yuan, F.; Lee, M.H.; Huang, C.-F.; Chang, S.T.; Liu, C.W. |
