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教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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顯示項目 648406-648415 / 2348487 (共234849頁)
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| 國立成功大學 |
2008-01 |
Packaging parameter analysis and optimization design on solder joint reliability for twin die stacked packages by variance in strain energy density (SED) of each solder joint
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Mao, Chao-Yang; Chen, Rong-Sheng |
| 國立成功大學 |
2015-06 |
Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls
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Cheng, Hsin-En; Chen, Rong-Sheng; Mao, Chao-Yang |
| 淡江大學 |
2004-09 |
Packaging the international travelling exhibition: the generic space under the form of McDonaldization
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Lai, Chia-ling |
| 國立成功大學 |
2017-07-07 |
Packaging unit for liquid sample loading devices applied in electron microscope and packaging method
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Tseng, Shih-Wen |
| 東海大學 |
2008 |
Packaging-TapeHouse
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龔智隆; Kung, Chih-Lung |
| 國立交通大學 |
2014-12-08T15:16:22Z |
Packet classification using diagonal-based tuple space search
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Lee, FY; Shieh, S |
| 亞洲大學 |
2007-12 |
Packet Construction for Secure Conference Call Request in Ad Hoc Network Systems
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陳興忠;Chen, Hsing-Chung |
| 國立臺灣科技大學 |
2015 |
Packet controller for video streaming over IEEE 802.11e
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Chen, K.-Y.;Chen, W.-M. |
| 國立臺灣大學 |
2004-09-13 |
Packet Format Report of OFDM-based Agile Baseband Transceiver for Future Spectrum Pooling Wireless Systems
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Lien, Jui-Ping |
| 國立政治大學 |
2006-05 |
Packet Fragmentation in IPv6 and IPv4 Integrated Environment
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姜國輝 |
顯示項目 648406-648415 / 2348487 (共234849頁)
<< < 64836 64837 64838 64839 64840 64841 64842 64843 64844 64845 > >>
每頁顯示[10|25|50]項目
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