臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
國立交通大學	2017-04-21T06:49:40Z	Package Routability- and IR-Drop-Aware Finger/Pad Assignment in Chip-Package Co-Design	Lu, Chao-Hung; Chen, Hung-Ming; Liu, Chien-Nan Jimmy; Shih, Wen-Yu
國立交通大學	2014-12-08T15:31:26Z	Package routability- and IR-drop-aware finger/pad planning for single chip and stacking IC designs	Lu, Chao-Hung; Chen, Hung-Ming; Liu, Chien-Nan Jimmy; Shih, Wen-Yu
國立交通大學	2015-12-04T07:03:11Z	PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME	LIN Chien-Chung; KUO Hao-Chung; CHEN Kuo-Ju; HAN Hau-Vei; CHEN Hsin-Chu
國立交通大學	2017-02-09	PACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICE	Hsien-Hao Tu; Zong-Yi Tu; Kuo-Ju Chen; Hau-Vei Han; Chin-Wei Sher; Hao-Chung Kuo; Chien-Chung Lin
國立臺灣科技大學	2020	Package structure of polarized white chip-on-board light-emitting diode with high thermal conductivity	Su, J.-C.;Huang, S.-B.
義守大學	2007-02	Package-induced cross-coupling effect on amplifier harmonic suppression	Han-Jan Chen;Tsung-Hui Huang;Chin-Sheng Chang;Lih-Shan Chen;Jui-Hong Horng;Yeong-Her Wang;Mau-Phon Houng
國立成功大學	2007-02	Package-induced cross-coupling effect on amplifier harmonic suppression	Chen, Han-Jan; Huang, Tsung-Hui; Chang, Chin-Sheng; Chen, Lih-Shan; Horng, Jui-Hong; Wang, Yeong-Her; Houng, Mau-Phon
國立成功大學	2016-08-03	Package-on-Package封裝體之熱傳研究	周景弘; Chou, Ching-Hung
國立成功大學	2016-07-08	Package-on-Package封裝體之熱傳研究	周景弘; Chou, Ching-Hung
臺大學術典藏	2018-09-10T04:55:28Z	Package-strain-enhanced device and circuit performance	Maikap, S.;Liao, M.H.;Yuan, F.;Lee, M.H.;Huang, C.-F.;Chang, S.T.;Liu, C.W.; Maikap, S.; Liao, M.H.; Yuan, F.; Lee, M.H.; Huang, C.-F.; Chang, S.T.; Liu, C.W.; CHEE-WEE LIU

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