| 淡江大學 |
1998-05-05 |
Process and apparatus for manufacturing aluminum laminally filled plastic pellets for shielding electromagnetic interference
|
Chuang, Tung-han; 林清彬; Lin, Ching-bin; Tsai, Teng-chun; Chang, Jiin-chyuan |
| 淡江大學 |
1996/11/01 |
Process and apparatus for manufacturing aluminum laminally filled plastic pellets for shielding electromagnetic interference
|
Chuang, Tung-Han;Lin, Ching-Bin;Tsai, Teng-Chun;Chang, Jiin-Chyuan |
| 淡江大學 |
2000/06/05 |
Process and apparatus for plating copper on particulate graphite
|
Lin, Ching-Bin;Lin, Jen-Fin |
| 亞洲大學 |
2010-06 |
Process and Ballistic-resistant Buffer Effect of Cushion Composite Layer Made of Three-dimensional Crimped Hollow Fiber
|
林青玫;LIN, CHIN-MEI |
| 亞洲大學 |
2008-03 |
Process and Bullet-resistant Buffer Effect of an Elastic Cushioning Structure Made of Polyamide Non-woven Fabric and Chloroprene Rubber
|
林敬文;Lin, Ching-wen |
| 南台科技大學 |
2017-07 |
Process and Challenges of Realtor Transformation: The case of SINGFUJIA
|
LEE, YING-CHI; 李應吉 |
| 國立交通大學 |
2014-12-08T15:15:16Z |
Process and characteristics of fully silicided source/drain (FSD) thin-film transistors
|
Lin, Chia-Pin; Hsiao, Yi-Hsuan; Tsui, Bing-Yue |
| 國立交通大學 |
2014-12-08T15:18:05Z |
Process and characteristics of modified Schottky barrier (MSB) p-channel FinFETs
|
Tsui, BY; Lin, CP |
| 淡江大學 |
2005-07-24 |
Process and Content Authority: A Moral Dilemma
|
黃怡萍 |
| 淡江大學 |
2005-01-14 |
Process and Content Authority: A Moral Dilemma
|
黃怡萍 |
| 國立中山大學 |
2009 |
Process and design considerations for redistribution in wafer level chip size packaging technology for high power device applications
|
J. Chen;Y.S. Lai;C.A. Hsieh;C.Y. Hu |
| 國立中山大學 |
2009 |
Process and design considerations for redistribution in wafer level chip size packaging technology for high power device applications
|
J. Chen;Y.S. Lai;C.A. Hsieh;C.Y. Hu |
| 國立交通大學 |
2014-12-08T15:26:36Z |
Process and doping species dependence of negative-bias-temperature instability for p-channel MOSFETs
|
Lee, DY; Lin, HC; Chiang, WJ; Lu, WT; Huang, GW; Huang, TY; Wang, T |
| 元培科技大學 |
2008-02 |
Process and formulation characterizations of the thermal adhesion granulation (TAG) process for improving granular properties
|
林宏糧（Lin, Hong-Liang） |
| 臺北醫學大學 |
2008 |
Process and formulation characterizations of the thermal adhesiongranulation (TAG) process for improving granular properties
|
許明照; 何秀娥; Hong-Lian Lin; Hsiu-O. Ho; Chi-Chia Chen; Ta-Shuong Yeh; Ming-Thau Sheu; |
| 臺北醫學大學 |
2002 |
Process and Outcome of Organizing One Health Promotion Committee in Taipei.
|
陳靜敏; Chen; Ching-Min |
| 臺北醫學大學 |
2002 |
Process and Outcome of Organizing one Health Promotion Committee in Taipei.
|
陳靜敏; Chen; Ching-Min; Chuang; Jui-Ling |
| 國立政治大學 |
2011-06 |
Process and performance in human-robot teams, Journal of Cognitive Engineering and Decision Making
|
簡士鎰; Lewis, Michael;Wang, Huadong;Chien, Shih Yi;Velagapudi, Prasanna;Scerri, Paul;Sycara, Katia; Chien, Shih Yi |
| 國立交通大學 |
2014-12-08T15:08:28Z |
Process and properties of the carbon nanotube assisted LiCoO(2) thin-film battery electrode by pulsed laser deposition
|
Lo, An-Ya; Sun, Chuan-Shu; Tseng, Wen-Shou; Kuo, Cheng-Tzu |
| 國立交通大學 |
2019-04-03T06:37:48Z |
Process and properties of the carbon nanotube assisted LiCoO2 thin-film battery electrode by pulsed laser deposition
|
Lo, An-Ya; Sun, Chuan-Shu; Tseng, Wen-Shou; Kuo, Cheng-Tzu |
| 臺大學術典藏 |
2006 |
Process and property characterization of La-Al-B-O/Al2O3 glass ceramic composites
|
Chen, Chih-Lung; Wei, Wen-Cheng J.; Wang, S.F.; Chen, Chih-Lung; Wei, Wen-Cheng J.; Wang, S.F. |
| 國立臺灣大學 |
2006 |
Process and property characterization of La-Al-B-O/Al2O3 glass ceramic composites
|
Chen, Chih-Lung; Wei, Wen-Cheng J.; Wang, S.F. |
| 臺大學術典藏 |
2018-09-10T06:56:07Z |
PROCESS AND RESISTIVITY STUDIES OF THE HIGH-TC SUPERCONDUCTORS IN TL-CA-BA-CU-O
|
Liu, R. S.;Lee, W. H.;Wu, P. T.;Chen, Y. C.;Chang, C. T.; Liu, R. S.; Lee, W. H.; Wu, P. T.; Chen, Y. C.; Chang, C. T.; RU-SHI LIU |
| 國立成功大學 |
2023 |
Process and Simulation design of Silicon-On-Insulator (SOI) NMOS
|
Chen, Z.-F.;Lai, Y.-S.;Huang, C.-M.;Wang, Y.-H.;Chiang, M.-H. |
| 國立成功大學 |
2020 |
Process and Structure Considerations for the Post FinFET Era
|
Su, C.-J.;Sung, P.-J.;Kao, Kao K.-H.;Lee, Y.-J.;Wu, Wu W.-F.;Yeh, W.-K. |
