| 淡江大學 |
2021-11-05 |
Solarpunk: Hope In and After the Anthropocene
|
KELSALL, BROWN IAIN |
| 國立臺灣海洋大學 |
2008 |
SOLAS-related study in Taiwan, Global Change Research in Taiwan
|
Gong G.-C.;G. T.-F. Wong;W.-T. Tsai;K.-K. Liu |
| 嘉南藥理大學 |
2017 |
Solasodine inhibits invasion of human lung cancer cell through downregulation of miR-21 and MMPs expression
|
陳品晟; 陳幸儀; 翁郁婷; 張家維 |
| 嘉南藥理大學 |
2016-05-10 |
Solasodine 抑制人類肺腺癌細胞侵入作用之探討
|
翁郁婷; 陳幸儀; 高鈺婷; 吳孟珊 |
| 高雄醫學大學 |
2000 |
Solasodine 毫微球粒子的製備及其對人類肝癌細胞之毒殺作用
|
劉旭珮;郭國華;蔡東榮;詹道明 |
| 嘉南藥理大學 |
2017 |
Solasodine 通過調降 miR-21 和 MMPs 的表達而抑制人類肺腺癌細胞的侵入作用
|
張家維 |
| 嘉南藥理大學 |
2015-05-05 |
Solasodine抑制人類肺癌細胞及其癌幹細胞特性之探討
|
林家葦; 林建文; 陳品晟 |
| 嘉南藥理大學 |
2011 |
Solasodine抑制人類肺癌細胞爬行及侵入之研究
|
方力珩 |
| 輔英科技大學 |
2009-05-02 |
solation of New Aristolactam and Dioxoaporphine from the Leaves of Michelia compressa var. lanyuensis (Magnoliaceae).
|
陳中一 |
| 臺北醫學大學 |
2010-02-11 |
Solaxin / 舒肉筋新錠
|
藥劑部藥師 |
| 臺北醫學大學 |
2011 |
Solaxin 200mgtab 舒肉筋新 錠
|
藥劑部藥師 |
| 臺大學術典藏 |
2020-05-04T07:48:22Z |
Solder Ball 3D Reconstruction with X-Ray Images Using Filtered Back Projection
|
Tsan, T.-C.;Lin, B.-J.;Lee, Y.-H.;Tung, T.-C.;Fuh, C.-S.; Tsan, T.-C.; Lin, B.-J.; Lee, Y.-H.; Tung, T.-C.; CHIOU-SHANN FUH; Fuh, C.-S. |
| 臺大學術典藏 |
2020-05-04T07:48:26Z |
Solder Ball 3D Reconstruction with X-Ray Images Using Filtered Back Projection.
|
CHIOU-SHANN FUH; Fuh, Chiou-Shann; Tung, Tzu-Chia; Tsan, Ting-Chen; Lin, Bing-Jhang; Lee, You-Hsien |
| 國立交通大學 |
2014-12-12T01:36:05Z |
Solder Bump製程應用在Wafer Level CSP RDL結構可靠度提升 Study
|
王家鴻; Wang, Chia-Hong; 張翼; Chang, Edward Yi |
| 元智大學 |
2007-01 |
Solder Joint Reliablity Assessment for Flip Chip Ball Grid Array Components with Various Designs in Lead free Solder Materials and Solder Mask Dimensions
|
陳永樹; 王慶順; 王泰喬; 鄭武輝; K.C. Chang; T.D. Yuan |
| 元智大學 |
Jul-15 |
Solder Joint with A Multilayer Intermetallic Compound Structure
|
王詩茹; 吳昱輝; Cheng-En Ho |
| 國立成功大學 |
2000-12 |
Solder thickness variation with respect to soldering parameters
|
Lin, Kwang-Lung; Yao, S. |
| 元智大學 |
2012-05 |
Solder Volume Effect on the Microstructure of Solder Joints Using Au/Pd(P)/Ni(P) Surface Finish
|
W. H. Wu; S. W. Lin; Y. C. Lin; Cheng-En Ho |
| 元智大學 |
2017-04-25 |
Solderability between Sn-3Ag-0.5Cu Alloy and Cu Pillars Deposited via Different Plating Current Densities
|
Pei-Tzu Lee; Ying-Syuan Wu; Ying-Hua Weng; Sheng-Wei Lin; Cheng-En Ho |
| 國立成功大學 |
2006-09-28 |
Solderability of Sn-9Zn-0.5Ag-1In lead-free solder on Cu substrate Part 1. Thermal properties, microstructure, corrosion and oxidation resistance
|
Chang, Tao-Chih; Wang, Jian-Wen; Wang, Moo-Chin; Hon, Min-Hsiung |
| 元智大學 |
2016-10-26 |
Soldering Contact Design for Thermal Elements in Reducing Thermal Stresses of Thermoelectric Modules
|
Yeongshu Chen; Leila Bakhtiaryfard |
| 國立交通大學 |
2014-12-08T15:32:55Z |
Soldering of solution-processed organic vertical transistor and light-emitting diode on separate glass substrates by tin micro-balls
|
Lin, Yu-Hsin; Chang, Yu-Fan; Meng, Hsin-Fei; Zan, Hsiao-Wen; Hsu, Wensyang; Chen, Chao-Hsuan |
| 元智大學 |
2010-11 |
Soldering Reaction between Ni and Sn-Pd Alloys with Various Pd Concentrations
|
Sheng-Wei Lin; Cheng-En Ho |
| 國立臺灣大學 |
2002 |
Soldering reactions between In49Sn and Ag thick films
|
Cheng, M. D.; Wang, S. S.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Soldering reactions between In49Sn and Ag thick films
|
Cheng, M.D.; Wang, S.S.; Chuang, T.H.; TUNG-HAN CHUANG |
