| 國立成功大學 |
2023-12 |
Thermal characterization of an interior permanent magnet electric motor
|
Chang;Woei, Shyy;Wu;Pey-Shey;Hong;Yu-Siang;Hsu;Yung-Chih;Huang;Shih-Hang |
| 國立交通大學 |
2014-12-08T15:19:50Z |
THERMAL CHARACTERIZATION OF HIGH THERMAL CONDUCTIVE GRAPHITES REINFORCED ALUMINUM MATRIX COMPOSITES
|
Chang, Chih-Jong; Chang, Chih-Hao; Hwang, Jen-Dong; Kuo, Cheng-Tzu |
| 國立高雄應用科技大學 |
2011 |
Thermal characterization of shrouded plate fin array on an LED backlight panel
|
Shyu, Jin-Cherng; Hsu, Keng-Wei; Yang, Kai-Shing; Wang, Chi-Chuan |
| 國立交通大學 |
2014-12-08T15:26:43Z |
Thermal characterization of shrouded plate fin array on an LED backlight panel
|
Shyu, Jin-Cherng; Hsu, Keng-Wei; Yang, Kai-Shing; Wang, Chi-Chuan |
| 國立交通大學 |
2014-12-08T15:05:38Z |
THERMAL CHARACTERIZATION OF SYNTHESIZED Y2O3-CEO2-ZRO2
|
DUH, JG; LEE, MY; CHIOU, BS |
| 中華大學 |
2008 |
THERMAL CHARACTERIZATION OF THERMAL INTERFACE MATERIALS
|
陳精一; Chen, Ching-I |
| 國立成功大學 |
2004-07-30 |
Thermal chip fabrication with arrays of sensors and heaters for micro-scale impingement cooling heat transfer analysis and measurements
|
Shen, C. H.; Gau, Chie |
| 國立成功大學 |
2024-05-15 |
Thermal Circuit Modeling and Numerical Verification for Concurrent Fluid Flows through an Iso-Flux Heated Concentric Double Tube
|
Ho;C, J.;Huang;Shih-Hui;Huang;Zai-Ping;Yen;Jung-Yi;Chen;K, S.;Lai;-Ming, Chi |
| 國立彰化師範大學 |
2005-06 |
Thermal Comfort Control on Multi-room Fan Coil Unit System Using LEE-based Fuzzy Logic
|
Chu, Chi-Min; Jong, Tai-Lang; Huang, Yue-Wei |
| 國立成功大學 |
2013 |
Thermal Comfort for Urban Parks in Subtropics: Understanding Visitor's Perceptions, Behavior and Attendance
|
Lin, Chuang-Hung; Lin, Tzu-Ping; Hwang, Ruey-Lung |
| 朝陽科技大學 |
2021-05-28 |
Thermal Comfort of a Walking Environment under an Elevated Urban Railway: A Case Study of Taichung Overpass
|
許國威 |
| 中國醫藥大學 |
2007-12 |
Thermal Comfort Requirements for Occupants of Semi-Outdoor and Outdoor Environments in Hot-Humid Regions
|
黃瑞隆(Reuy Lung Hwang); 林子平(Tzu-Ping Lin)* |
| 中國醫藥大學 |
2008.06 |
Thermal comfort requirements in air-conditioned residences in hot-humid climate
|
鄭明仁(Ming-Jen Cheng); 黃瑞隆(Reuy Lung Hwang)* |
| 國立成功大學 |
2004-02 |
Thermal compensation for a chirp fiber bragg grating bonded substrate
|
Chang, Y. M.; Cheng, Chih-Chun; Lo, Yu-Lung |
| 臺大學術典藏 |
2022-09-21T23:30:34Z |
Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface
|
Huang, C. H.; Shih, P. S.; Huang, J. H.; Grafner, S. J.; Chen, Y. A.; Kao, C. R. |
| 國立交通大學 |
2019-04-03T06:39:00Z |
Thermal conductance and the Peltier coefficient of carbon nanotubes
|
Lin, MF; Chuu, DS; Shung, KWK |
| 臺大學術典藏 |
2018-09-10T07:09:18Z |
Thermal conduction analysis on microwave IC packages
|
J.-F. Kiang; S.-P. Liu; W.-T. Lo; JEAN-FU KIANG |
| 國立成功大學 |
2001-04 |
Thermal conduction of a circular inclusion with variable interface parameter
|
Chen, Tungyang |
| 國立臺灣科技大學 |
2013 |
Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method
|
Kuo, D.H.;Lin, C.Y.;Jhou, Y.C.;Cheng, J.Y.;Liou, G.S. |
| 臺大學術典藏 |
2018-09-10T09:43:06Z |
Thermal conductive performance of organosoluble polyimide/BN and polyimide/(BN + ALN) composite films fabricated by a solution-cast method
|
GUEY-SHENG LIOU;Liou, G.S.;Cheng, J.Y.;Jhou, Y.C.;Lin, C.Y.;Kuo, D.H.;GUEY-SHENG LIOU; Kuo, D.H.; Lin, C.Y.; Jhou, Y.C.; Cheng, J.Y.; Liou, G.S.; GUEY-SHENG LIOU |
| 元智大學 |
2015-07-12 |
THERMAL CONDUCTIVITIES OF ALIGNED CNT NANOCOMPOSITES
|
M. W. Wang; C. C. Liao; Niann-i YU |
| 元智大學 |
2011-12-10 |
Thermal Conductivities of CNT/Epoxy Composites
|
C. Huang; Niann-i YU |
| 元智大學 |
2017-07-16 |
THERMAL CONDUCTIVITIES OF GNP/CNT/EPOXY COMPOSITES
|
C.P. Su; Niann-i YU |
| 元智大學 |
2015-11-20 |
Thermal Conductivities of GNP/CNT/Epoxy Nanocomposites
|
C. P. Su; Niann-i YU |
| 元智大學 |
2014-11-21 |
Thermal Conductivities of GNP/Epoxy Composites
|
K. Y. Huang; Niann-i YU |
