| 淡江大學 |
2010-04 |
Thermal Stability of Al2O3 Coated Low Transition Temperature Glass
|
Ma, Kung-jeng; Chien, His-hsin; Vattikuti, S. Prabhakar; Kuo, Chien-huang; Huo, Cheng-bang; Chao, Choung-lii |
| 國立交通大學 |
2014-12-08T15:03:01Z |
Thermal stability of AlSiCu/W/n(+)p diodes with and without TiN barrier layer
|
Yeh, WK; Chen, MC; Wang, PJ; Liu, LM; Lin, MS |
| 國立交通大學 |
2014-12-08T15:46:52Z |
Thermal stability of amorphous-like WNx/W bilayered diffusion barrier for chemical vapor deposited-tungsten/p(+)-Si contact system
|
Chang, KM; Deng, IC; Yeh, TH; Lain, KD; Fu, CM |
| 臺大學術典藏 |
2019-12-19T08:36:59Z |
Thermal stability of amorphous-like WNx/W bilayered diffusion barrier for chemical vapor deposited-tungsten/p(+)-Si contact system
|
Chang, K. M.; Deng, I. C.; Yeh, T. H.; Lain, K. D.; Fu, C. M.; CHAO-MING FU |
| 國立高雄師範大學 |
1999 |
Thermal Stability of amorphous-like WNx/W bilayered difussion barrier for chemical deposited-tungsten/p+-Si contact system
|
傅昭銘; Chao-Ming Fu |
| 國立臺灣科技大學 |
2014 |
Thermal stability of barrierless Cu-Ni-Sn films
|
Li, X.N.;Wang, M.;Zhao, L.R.;Bao, C.M.;Chu, J.P.;Dong, C. |
| 國立成功大學 |
2009-02 |
Thermal stability of catalytically grown multi-walled carbon nanotubes observed in transmission electron microscopy
|
Wang, Cheng-Yu; Liu, Chuan-Pu; Boothroyd, C. B. |
| 國立中山大學 |
1998 |
Thermal Stability of Co-Spttered Ru-ti Ally Electrodes for Dynamic Random Access Memory Application
|
R.H. Horng;D.S. Wuu;L.H. Wu;M.K. Lee;S.H. Chan;C.C. Leu |
| 國立屏東大學 |
2008 |
Thermal stability of CrAlSiN Superhard Nanocomposite Coating by Vacuum Arc with Rotating Cathodes for Dry Machining
|
何偉雲;Ho, Wei-Yu;Chen, Hui-Chu;Chang, Chi-Lung;Wang, Da-Yung |
| 國立屏東大學 |
2008 |
Thermal stability of CrAlSiN Superhard Nanocomposite Coating by Vacuum Arc with Rotating Cathodes for Dry Machining
|
何偉雲;Ho, Wei-Yu;Chen, Chi-Wei;Chang, Chi-Lung;Wang, Da-Yung |
| 國立屏東大學 |
2008 |
Thermal stability of CrAlSiN Superhard Nanocomposite Coating by Vacuum Arc with Rotating Cathodes for Dry Machining
|
何偉雲;Ho, Wei-Yu;Chen, Chi-Wei;Chang, Chi-Lung;Wang, Da-Yung |
| 國立臺灣海洋大學 |
2012-11 |
Thermal stability of CrTaN hard coatings prepared using biased direct current sputter deposition
|
Chen;Y.-I*;Lin;K.-Y.;Chou;C.-C.;; 周昭昌 |
| 國立臺灣海洋大學 |
2013-10 |
Thermal stability of CrTaN hard coatings prepared using biased direct current sputter deposition
|
Yung-I Chen;Kun-Yi Lin;Chau-Chang Chou |
| 國立臺灣科技大學 |
2013 |
Thermal stability of Cu at Ag core-shell nanoparticles
|
Tsai, C.-H.;Chen, S.-Y.;Song, J.-M.;Chen, I.-G.;Lee, H.-Y. |
| 國立臺灣海洋大學 |
2006-11-01 |
Thermal Stability of Cu(W) and Cu(Mo) Films for Advanced Barrierless Cu Metallization: Effects of Annealing Time
|
J. P. Chu;C. H. Lin |
| 國立交通大學 |
2014-12-08T15:38:33Z |
Thermal stability of Cu/NiSi-contacted p(+)n shallow junction
|
Wang, CC; Lin, HH; Chen, MC |
| 國立交通大學 |
2014-12-08T15:44:38Z |
Thermal stability of Cu/Ta/GaAs multilayers
|
Chen, CY; Chang, L; Chang, EY; Chen, SH; Chang, DF |
| 國立成功大學 |
2001-09-21 |
Thermal stability of Cu/TiN and Cu/Ti/TiN metallizations on silicon
|
Chen, Jen-Sue; Lu, K. Y. |
| 國立成功大學 |
2013-09 |
Thermal stability of Cu@Ag core-shell nanoparticles
|
Tsai, Chi-Hang; Chen, Shih-Yun; Song, Jenn-Ming; Chen, In-Gann; Lee, Hsin-Yi |
| 中原大學 |
2002 |
Thermal Stability of Epoxy Resins Containing Flame Retardant Components: An Evaluation with Thermogravimetric Analysis
|
Chuan Shao Wu;Ying Ling Liu;Yie Chan Chiu;Yie Shun Chiu |
| 中原大學 |
2004-03 |
Thermal stability of epoxy-silica hybrid materials by thermogravimetric analysis
|
Ying-Ling Liu;Wen-Lung Wei;Keh-Ying Hsu;Wen-Hsuan Ho |
| 中原大學 |
2004 |
Thermal stability of epoxy-silica hybrid materials by thermogravimetric analysis
|
Ying-Ling Liu;Wen-Lung Wei;Keh-Ying Hsu;Wen-Hsuan Ho |
| 國立臺灣大學 |
1999-05 |
Thermal stability of fullerene-linked oligoaniline star macromolecules
|
Wang, LY; Anantharaj, V; Chu, CC; Chiang, LY |
| 臺大學術典藏 |
2020-05-12T02:53:06Z |
Thermal stability of grain structure and material properties in an annealing twinned Ag-4Pd alloy wire
|
Chuang, T.-H.; Lin, H.-J.; Chuang, C.-H.; Shiue, Y.-Y.; Shieu, F.-S.; Huang, Y.-L.; Hsu, P.-C.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:09Z |
Thermal stability of grain structure and material properties in an annealing-twinned Ag-8Au-3Pd alloy wire
|
Chuang, T.-H.; Wang, H.-C.; Tsai, C.-H.; Chang, C.-C.; Chuang, C.-H.; Lee, J.-D.; Tsai, H.-H.; TUNG-HAN CHUANG |
