| 國立成功大學 |
2022-03-11 |
Thermal-/Light-Tunable Hydrogels Showing Reversible Widening and Closing Actuations Based on Predesigned Interpenetrated Networks
|
Liu;Chun-Yen;Chang;Chien-Hsiang;Thi, Thanh Tran;Wu;Guan-Yi;Tu;Chia-Ming;Chen;Hung-Yi |
| 國立交通大學 |
2014-12-08T15:31:46Z |
Thermal-activated carrier transfer in ZnCdO thin film grown by plasma-assisted molecular beam epitaxy
|
Chien, K. F.; Hsu, W. L.; Tzou, A. J. .; Lin, Y. C.; Chou, W. C.; Lee, L.; Chia, C. H.; Yang, C. S. |
| 臺大學術典藏 |
2018-09-10T03:50:58Z |
Thermal-ADI: A Linear-Time Chip-Level Dynamic Thermal Simulation Algorithm Based on Alternating-Direction-Implicit (ADI) Method
|
Ting-Yuan Wang; Charlie Chung-Ping Chen; CHUNG-PING CHEN |
| 國立臺灣大學 |
2003 |
Thermal-ADI: A Linear-Time Chip-Level Dynamic Thermal Simulation Algorithm Based on Alternating-Direction-Implicit (ADI) Method
|
Wang, Ting-Yuan; Chen, Charlie Chung-Ping |
| 臺大學術典藏 |
2018-09-10T04:36:03Z |
Thermal-ADI: A Linear-Time Chip-Level Dynamic Thermal Simulation Algorithm Based on Alternating-Direction-Implicit (ADI) Method
|
Ting-Yuan Wang; Charlie Chung-Ping Chen; CHUNG-PING CHEN |
| 國立交通大學 |
2014-12-08T15:04:16Z |
THERMAL-ANALYSIS OF HIGH-T(C) SUPERCONDUCTING BOLOMETERS
|
WU, JP; CHEN, RC; CHU, HS |
| 國立交通大學 |
2018-08-21T05:52:51Z |
Thermal-Annealing-Induced Self-Stretching: Fabrication of Anisotropic Polymer Particles on Polymer Films
|
Lo, Yu-Ching; Chiu, Yu-Jing; Tseng, Hsiao-Fan; Chen, Jiun-Tai |
| 臺大學術典藏 |
2018-09-10T15:23:43Z |
Thermal-Aware 3D Network-On-Chip (3D NoC) Designs: Routing Algorithms and Thermal Managements
|
Chen, K.-C.J.;Chao, C.-H.;Wu, A.-Y.A.; Chen, K.-C.J.; Chao, C.-H.; Wu, A.-Y.A.; AN-YEU(ANDY) WU |
| 臺大學術典藏 |
2018-09-10T15:23:42Z |
Thermal-Aware 3D Network-On-Chip (3D NoC) Designs: Routing Algorithms and Thermal Managementse
|
AN-YEU(;Y) WU; AN-YEU(; Y) WU; AN-YEU(ANDY) WU |
| 國立成功大學 |
2011-08-02 |
Thermal-Aware Bus-Driven Floorplanning
|
Wu, Po-Hsun; Ho, Tsung-Yi |
| 臺大學術典藏 |
2018-09-10T14:58:25Z |
Thermal-aware Dynamic Buffer Allocation for Proactive routing algorithm on 3D Network-on-Chip systems
|
Lee, Y.-S.;Hsin, H.-K.;Chen, K.-C.;Chang, E.-J.;Wu, A.-Y.A.; Lee, Y.-S.; Hsin, H.-K.; Chen, K.-C.; Chang, E.-J.; Wu, A.-Y.A.; AN-YEU(ANDY) WU |
| 國立成功大學 |
2021-05 |
Thermal-Aware Fixed-Outline Floorplanning Using Analytical Models With Thermal-Force Modulation
|
Lin;Jai-Ming;Chen;Tai-Ting;Hsieh;Hao-Yuan;Shyu;Ya-Ting;Chang;Yeong-Jar;Lu;Juin-Ming |
| 國立成功大學 |
2021-09 |
Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC
|
Lin;Jai-Ming;Chang;Wei-Yi;Hsieh;Hao-Yuan;Shyu;Ya-Ting;Chang;Yeong-Jar;Lu;Juin-Ming |
| 元智大學 |
2014-10-07 |
Thermal-aware kernel mapping for three-dimensional multi-mode channel decoding
|
Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su |
| 國立交通大學 |
2014-12-08T15:23:05Z |
Thermal-Aware Logic Block Placement for 3D FPGAs Considering Lateral Heat Dissipation
|
Huang, Juinn-Dar; Huang, Ya-Shih; Hsu, Mi-Yu; Chang, Han-Yuan |
| 國立臺灣科技大學 |
2016 |
Thermal-aware MapReduce real-time scheduling in heterogeneous server systems
|
Tang, Tang T.-C;Chen, Y.-S. |
| 元智大學 |
2015-08-04 |
Thermal-aware Memory Mapping for Three-dimensional Block-based SRAM Architecture
|
Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su |
| 國立臺灣科技大學 |
2012 |
Thermal-aware real-time task scheduling for three-dimensional multicore chip
|
Tsai, T.-H.;Chen, Y.-S. |
| 臺大學術典藏 |
2020-06-16T06:36:16Z |
Thermal-aware router-sharing architecture for 3D network-on-chip designs
|
Huang, Y.-R.;Pan, J.-H.;Lu, Y.-C.; Huang, Y.-R.; Pan, J.-H.; Lu, Y.-C.; YI-CHANG LU |
| 國立臺灣科技大學 |
2012 |
Thermal-aware service rate adjustment for cyber-physical systems
|
Chu, H.-H.;Tsai, T.-H.;Chen, Y.-S. |
| 元智大學 |
2014-04-11 |
Thermal-aware task mapping for reconfigurable channel decoding
|
Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su |
| 元智大學 |
2014-08-05 |
Thermal-aware task mapping for three-dimensional reconfigurable channel decoding
|
Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su |
| 臺大學術典藏 |
2018-09-10T09:25:31Z |
Thermal-aware Test Schedule and TAM Co-Optimization for Three Dimensional IC
|
C. J. Shih;C. Y. Hsu;C. Y. Kou;J. C. M. Li;J. C. Rau;K. Chakrabarty; C. J. Shih; C. Y. Hsu; C. Y. Kou; J. C. M. Li; J. C. Rau; K. Chakrabarty; CHIEN-MO LI |
| 淡江大學 |
2012-10-18 |
Thermal-Aware Test Schedule and TAM Co-Optimization for Three-Dimensional IC
|
Shih, Chi-Jih; Hsu, Chih-Yao; Kuo, Chun-Yi; Li, James; Rau, Jiann-Chyi; Krishnendu Chakrabarty |
| 臺大學術典藏 |
2018-09-10T08:47:25Z |
Thermal-aware Test scheduling for 3D ICs
|
CY Hsu; JCM Li; K. Chakrbarty; CHIEN-MO LI |
