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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
國立臺灣大學 1996 Thermomagnetic effect in ferrofluids with weakly coupled particles Jang, I. J.; Yao, Y. D.; Klik, I.; Horng, H. E.; Yang, H. C.
東海大學 2010 Thermomagnetic irreversibility and magnetic short range ordering in Mn2.5Co0.5O4 tetragonal spinel thin films 王昌仁; Kuo, K.M., Chern, G., Li, Y.Y. and Wang, C.R.
國立交通大學 2020-10-05T02:00:30Z THERMOMAGNETIC MICRO-TRACKS-GUIDED MAGNETIC BEAD MANIPULATION: A DEMONSTRATION OF MOVING BEAD ACROSS DIFFERENT TRACKS ENABLED BY NOVEL EMBEDDED ON-CHIP MICRO HEATING WIRES Fang, Lin-Huei; Duan, Hao; Chen, Chin-Chung; Cheng, Chin-Cheng; Chung, Tien-Kan
國立臺灣大學 1993-11 Thermomagnetic Properties of Hysteresis, Coercivity and Dynamic Switching Field Distribution in Micromagnets 黃暉理; Huang, Huei-Li
國立臺灣大學 1995 Thermomagnetics of reversible transverse susceptibility Yang, Jyh-Shinn; Chang, Ching-Ray; Klik, Ivo
臺大學術典藏 2019-12-20T01:17:41Z Thermomagnetics of Reversible Transverse Susceptibility Yang, Js;Chang, Cr;Klik, I.; Yang, Js; Chang, Cr; Klik, I.; CHING-RAY CHANG
國立成功大學 2008-05-15 Thermomechanical and optical characteristics of stretched polyvinylidene fluoride Chang, Wen-Yang; Fang, Te-Hua; Lin, Yu-Cheng
國立高雄第一科技大學 2004.04 Thermomechanical Behavior of Underfill/Solder Mask/Substrate Interface UnderThermal Cycling C.-H.Chien;Y.-C.Chen, C.-C;Hsieh, Y.-T.;Chiou;Y.-D.Wu;Chen, T.-R; 謝其昌
臺大學術典藏 2018-09-10T05:58:00Z Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits Gleskova, H.; Cheng, I.-C.; Wagner, S.; Suo, Z.; I-CHUN CHENG
義守大學 2005-07 Thermomechanical effects on adsorbed water in clays around a heat source Chenmin Ma;Tomasz Hueckel
國立臺灣大學 2010 Thermomechanical models for the dynamics and melting processes in the Mariana subduction system Lin, Shu-Chuan; Kuo, Ban-Yuan; Chung, Sun-Lin
國立成功大學 2022-03-25 Thermomechanical properties of cold-sprayed copper coatings from differently fabricated powders Wei;Jun, Fu;chou;Yen, Bang;Fung;Zhong, Kuan;Tsai;Yi, Shu
國立中山大學 2007 Thermomechanical Properties of Nanosilica Reinforced PEEK Composites Y.H. Lai;M.C. Kuo;J.C. Huang;M. Chen
國立中山大學 2007 Thermomechanical Properties of Nanosilica Reinforced PEEK Composites Y.H. Lai;M.C. Kuo;J.C. Huang;M. Chen
國立中山大學 2006-10-22 Thermomechanical Properties of Nanosilica Reinforced PEEK Composites Y.H. Lai;M.C. Kuo;J.C. Huang;M. Chen
國立臺灣海洋大學 1995 Thermomechanical Response Analysis of Lithographic Mask Structure Using FEM D. C. Li;S. W. Chyuan;J. T. Chen;C. Y. Sun
國立中山大學 2000 Thermomechanical Treatment in Processing High Strain Rate Superplastic 6061 Al with 1% SiO2?nano-Particles T.D. Wang;J.C. Huang
中華大學 2005 Thermometer Code Current Mode 8-bits Digital-to-Analog Converter Design 林君明; Lin, Jium-Ming
臺大學術典藏 2018-09-10T15:21:01Z Thermometry for Dirac fermions in graphene Hsu, C.-S.; Lo, S.-T.; Chuang, C.; Huang, L.-I.; Woo, T.-P.; Liang, C.-T.; Fukuyama, Y.; Yang, Y.; Elmquist, R.E.; Wang, P.; Lin, X.; Liu, F.-H.; CHI-TE LIANG et al.
臺大學術典藏 2019-12-27T01:16:42Z Thermometry for Dirac fermions in graphene Liu, F.-H.; Hsu, C.-S.; Lo, S.-T.; Chuang, C.; Huang, L.-I.; Woo, T.-P.; Liang, C.-T.; Fukuyama, Y.; Yang, Y.; Elmquist, R.E.; Wang, P.; Lin, X.; TAK-PONG WOO
國立交通大學 2014-12-08T15:30:49Z Thermomigration in eutectic-SnPb solder with Cu UBM at the room temperature Lin, Jie An; Chen, Chih
國立交通大學 2014-12-08T15:14:17Z Thermomigration in flip-chip SnPb solder joints under alternating current stressing Hsiao, Hsiang-Yao; Chen, Chih
國立交通大學 2014-12-08T15:09:48Z Thermomigration in Pb-free SnAg solder joint under alternating current stressing Hsiao, Hsiang-Yao; Chen, Chih
國立交通大學 2014-12-08T15:29:18Z Thermomigration in solder joints Chen, Chih; Hsiao, Hsiang-Yao; Chang, Yuan-Wei; Ouyang, Fanyi; Tu, K. N.
國立交通大學 2014-12-08T15:11:46Z Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints Chen, Hsiao-Yun; Chen, Chih

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