| 元智大學 |
2007-12 |
Wabi-Sabi
|
謝慧中 |
| 元智大學 |
2007-12 |
Wabi-Sabi
|
謝慧中 |
| 國立政治大學 |
1996 |
WAC'96
|
趙玉 |
| 國立臺灣體育運動大學 |
2000-11-15 |
WADA(國際反禁藥組織)計劃在7城市設址
|
未知 |
| 國立臺灣科技大學 |
1999 |
WADGPS廣域修正信號之研究
|
陳志忠 |
| 臺大學術典藏 |
2022-04-26T06:17:51Z |
Wafer Bin Map Recognition with Autoencoder-based Data Augmentation in Semiconductor Assembly Process
|
Shen P;Lee C.; Shen P; Lee C.; CHIA-YEN LEE |
| 國立成功大學 |
2022 |
Wafer Bin Map Recognition with Autoencoder-Based Data Augmentation in Semiconductor Assembly Process
|
Shen, P.-C.;Lee, C.-Y. |
| 國立交通大學 |
2014-12-08T15:44:55Z |
Wafer bonding by low-temperature soldering
|
Lee, C; Huang, WF; Shie, JS |
| 國立交通大學 |
2014-12-08T15:40:21Z |
Wafer bonding by Ni-induced crystallization of amorphous silicon
|
Chao, CP; Wu, YCS; Lee, TL; Wang, YH |
| 國立交通大學 |
2014-12-08T15:19:18Z |
Wafer bonding for high-brightness light-emitting diodes via indium tin oxide intermediate layers
|
Liu, PC; Hou, CY; Wu, YCS |
| 國立彰化師範大學 |
2000 |
Wafer Bonding of 50 Mms Diameter Mirror Substrate to AlGaInP Light-emitting Diode Wafer
|
Seieh, C. H. ; Horng, R. H. ; Huang, Man-Fang; Wuu, D. S. ; Peng, W. C. ; Tsai, S. J. ; Liu, J. S. |
| 國立彰化師範大學 |
2001 |
Wafer Bonding of 50-mm-Diameter Mirror Substrates to AlGaInP Light-Emitting Diode Wafers
|
Horng, R. H. ; Wuu, D. S. ; Seieh, C. H. ; Peng, W. C. ; Huang, Man-Fang; Tsai, S. J. ; Liu, J. S. |
| 國立交通大學 |
2014-12-08T15:26:16Z |
Wafer bonding using indium tin oxide intermediate layer for high brightness LEDs
|
Liu, PC; Hou, CY; Wu, YCS |
| 國立臺灣海洋大學 |
2009-12 |
Wafer Defect Inspection by Neural Analysis of Region Features
|
Chuan-Yu Chang; Chun-Hsi Li; Yung-Chi Chang; MuDer Jeng |
| 國立交通大學 |
2014-12-08T15:09:01Z |
Wafer defect pattern recognition by multi-class support vector machines by using a novel defect cluster index
|
Chao, Li-Chang; Tong, Lee-Ing |
| 國立高雄第一科技大學 |
2012.05 |
Wafer Identification Recognition by Stroke Analysis and Template Matching
|
Hsu, Wei-Chih;Yu, Tsan-Ying;Chen, Kuan-Liang |
| 國立交通大學 |
2017-04-21T06:49:36Z |
Wafer Level Batch Fabrication and Assembly of Small Form Factor Optical Pickup Head
|
Hsiao, Sheng-Yi; Lee, Chih-Chun; Chiu, Yi; Shih, Hsi-Fu; Chiou, Jin-Chem; Shieh, Han-Ping D.; Fang, Weileun |
| 中華大學 |
2007 |
Wafer Level MEMS Vertical Probe Card Design
|
林君明; Lin, Jium-Ming |
| 國立交通大學 |
2014-12-16T06:14:01Z |
Wafer level packaging method and a packaging structure using thereof
|
Chen Tsung-Lin; Lien Jui-Chien |
| 中華大學 |
2008 |
Wafer Level Test Vertical Probe Design
|
林君明; Lin, Jium-Ming |
| 元智大學 |
2010-11 |
WAFER LITHOGRAPHIC MASK AND WAFER LITHOGRAPHY METHOD USING THE SAME
|
Shih-Cheng Tsai; Lin R.-B. |
| 元智大學 |
2010-11 |
WAFER LITHOGRAPHIC MASK AND WAFER LITHOGRAPHY METHOD USING THE SAME
|
Shih-Cheng Tsai; Lin R.-B. |
| 朝陽科技大學 |
2006-05 |
Wafer lot output time prediction with a hybrid artificial neural network
|
吳欣潔; Tsai, H.R.; Wu, H.C.; Chen, T. |
| 臺大學術典藏 |
2018-09-10T15:21:11Z |
Wafer map failure pattern recognition and similarity ranking for large-scale data sets
|
Wu, M.-J.;Jang, J.-S.R.;Chen, J.-L.; Wu, M.-J.; Jang, J.-S.R.; Chen, J.-L.; JYH-SHING JANG |
| 國立交通大學 |
2014-12-08T15:43:46Z |
Wafer rework strategies at the photolithography stage
|
Sha, DY; Hsieh, LF; Chen, KJ |
