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Institution Date Title Author
國立交通大學 2014-12-08T15:05:34Z INTERMETALLIC FORMATION ON THE FRACTURE OF SN/PB SOLDER AND PD/AG CONDUCTOR INTERFACES CHIOU, BS; LIU, KC; DUH, JG; PALANISAMY, PS
臺大學術典藏 2022-03-22T08:27:50Z Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:30:50Z Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2022-03-22T08:30:52Z Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes Chen C.-H;Lee P.-I;Yeh W.-T;Chuang T.-H.; Chen C.-H; Lee P.-I; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2021-11-21T23:18:55Z Intermetallic Growth at the Interfaces Between Zn4Sb3 Thermoelectric Material and Various Metallic Electrodes CHUN-HAO CHEN; Lee, Pei Ing; Yeh, Wei Ting; TUNG-HAN CHUANG
國立中山大學 2001 Intermetallic Growth of Wire-bond at 175 °C High Temperature Aging Hen-So Chang;J.X. Pon;Ker-Chang Hsieh;C.C. Chen
國立勤益科技大學 1999-06 Intermetallic phase formation and shear strength of a Au-In microjoint Shieu, F.S.;Chen, C.F.;Sheen, J.G.;Chang, Z.C.
國立成功大學 2014 Intermetallic Phase on the Interface of Ag-Au-Pd/Al Structure Hsueh, Hao-Wen; Hung, Fei-Yi; Lui, Truan-Sheng; Chen, Li-Hui; Chen, Kuan-Jen
臺大學術典藏 2018-06-28T22:11:31Z Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han; Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han
國立臺灣大學 2005 Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads Wu, Hui-Min; Wu, Feng-Chih; Chuang, Tung-Han
臺大學術典藏 2008 Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish Chuang, Tung-Han; Wu, Hui-Min; Jain, Chao-Chi; Wang, Shiuan-Sheng; Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han
國立臺灣大學 2008 Intermetallic Reactions in a Sn-51In Solder BGA Package with immersion Ag Surface Finish Jain, Chao-Chi; Wang, Shiuan-Sheng; Wu, Hui-Min; Chuang, Tung-Han
臺大學術典藏 2020-05-12T02:53:11Z Intermetallic reactions in a Sn-51In solder BGA package with immersion Ag surface finish Jain, C.-C.; Wang, S.-S.; Wu, H.-M.; Chuang, T.-H.; TUNG-HAN CHUANG
國立臺灣大學 2008 Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.
臺大學術典藏 2020-05-12T02:53:12Z Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads Chi, C.C.; Tsao, L.C.; Tsao, C.W.; Chuang, T.H.; TUNG-HAN CHUANG
國立臺灣大學 2006 Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads Lin, Hsiu-Jen; Chuang, Tung-Han
臺大學術典藏 2020-05-12T02:53:14Z Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu Pads TUNG-HAN CHUANG; Chuang, T.-H.; Lin, H.-J.
臺大學術典藏 2008 Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish ChuangTH; Wu, H.M.; Jain, C.C.; Chuang, T.H.; Chuang, T.H.; Jain, C.C.; Wu, H.M.
國立臺灣大學 2008 Intermetallic Reactions in Sn-0.4Co-0.7Cu Solder BGA Packages with an ENIG Surface Finish Chuang, T.H.; Jain, C.C.; Wu, H.M.
臺大學術典藏 2009-01-06T01:28:22Z Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads Chuang, Tung-Han; Chi, Chih-Chien; Chi, Chih-Chien; Chuang, Tung-Han
國立臺灣大學 2006 Intermetallic reactions in Sn-3.5Ag solder ball grid array packages with Ag/Cu and Au/Ni/Cu pads Chi, Chih-Chien; Chuang, Tung-Han
臺大學術典藏 2006 Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han; Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han
國立臺灣大學 2006 Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads Liu, Yu-Chih; Lin, Wei-Hong; Lin, Hsiu-Jen; Chuang, Tung-Han
臺大學術典藏 2020-05-12T02:53:14Z Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads Liu, Y.U.-C.; Lin, W.-H.; Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG
臺大學術典藏 2020-05-12T02:53:13Z Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes Chuang, T.H.; Yen, S.F.; Cheng, M.D.; TUNG-HAN CHUANG

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