| 淡江大學 |
2022/01/11 |
Interfacial Engineered Vanadium Oxide Nanoheterostructures Synchronizing High-Energy and Long-Term Potassium-Ion Storage
|
Gao, Xiaoxiao Kuai；Ke Li；Jianmei Chen；Hao Wang；Junyi Yao；Chao-Lung Chiang；Tingting Liu；Hanzhang Ye；Jianqing Zhao；Yan-Gu Lin；Labao Zhang；Valeria Nicolosi；Lijun |
| 國立交通大學 |
2014-12-08T15:33:18Z |
Interfacial engineering affects the photocatalytic activity of poly(3-hexylthiophene)-modified TiO2
|
Huang, Jen-Hsien; Ibrahem, Mohammed Aziz; Chu, Chih-Wei |
| 義守大學 |
2016-10 |
Interfacial engineering of melamine sponges using hydrophobic TiO2 nanoparticles for effective oil/water separation
|
Er-Chieh Cho;Cai-Wan Chang-Jian;Yu-Sheng Hsiao;Kuen-Chan Lee;Jen-Hsien Huang |
| 國立成功大學 |
2018-11-1 |
Interfacial engineering of ZnO surface modified with poly-vinylpyrrolidone and p-aminobenzoic acid for high-performance perovskite solar cells
|
Sivashanmugan;Kundan;Lin;Chen-Hsueh;Hsu;Sheng-Hao;Guo;Tzung-Fang;Wen;Ten-Chin |
| 國立交通大學 |
2018-08-21T05:52:54Z |
Interfacial Engineering with Cross-Linkable Fullerene Derivatives for High-Performance Perovskite Solar Cells
|
Kang, Tin; Tsai, Cheng-Min; Jiang, Yu-He; Gollavelli, Ganesh; Mohanta, Nayantara; Diau, Eric Wei-Guang; Hsu, Chain-Shu |
| 國立成功大學 |
2020-09-15 |
Interfacial evolution and mechanical properties of Au-Sn solder jointed Cu heat sink during high temperature storage test
|
Ho;Ching-Yuan;Lin;Chia-Wei;Lee;Yueh-Yang;Cheng;Shao-Chien |
| 國立成功大學 |
2020 |
Interfacial evolution and mechanical properties of Au–Sn solder jointed Cu heat sink during high temperature storage test
|
Ho, C.-Y.;Lin, C.-W.;Lee, Y.-Y.;Cheng, S.-C. |
| 國立成功大學 |
2003-08 |
Interfacial evolution between Cu and Pb-free Sn-Zn-Ag-Al solders upon aging at 150 degrees C
|
Cheng, Shou-Chang; Lin, Kwang-Lung |
| 臺大學術典藏 |
1991 |
Interfacial Film in Nickel Particle Reinforced Alumina Matrix Composite
|
Chang, L.; Chu, T.; Tuan, Wei-Hsing; Chang, L.; Chu, T.; 段維新; Chang, L.; Chu, T.; Tuan, Wei-Hsing |
| 國立臺灣大學 |
1991 |
Interfacial Film in Nickel Particle Reinforced Alumina Matrix Composite
|
Chang, L.; Chu, T.; 段維新; Chang, L.; Chu, T.; Tuan, Wei-Hsing |
| 臺大學術典藏 |
2020-05-12T02:53:55Z |
Interfacial fracture energy of Al2O3/Ni nanocomposites
|
WEI-HSING TUAN; Chen, R.Z.; Tuan, W.H. |
| 元智大學 |
Jan-15 |
Interfacial Fracture Toughness of Multilayer Composite Structures
|
Shiuh-Chuan Her; Wei-Bo Su |
| 國立東華大學 |
2007-10 |
Interfacial Influences and Electron-Injection Mechanisms of Tris-(8-Hydroxyquinoline)-Aluminum Doped With Cesium-Derivatives In Organic Light Emitting Devices
|
陳美杏; Chen, Mei-Hsin; Lu, Y. J. ; Wu, C. C. ; Wu, C. I. |
| 國立成功大學 |
2024-08-27 |
Interfacial insights for divergent dendrite formation mechanisms in lithium and magnesium anodes
|
Chen;Hong-Kai;Tian;Hong-Kang |
| 大葉大學 |
2002 |
Interfacial instabilities of miscible fluids in a rotating Hele-Shaw cell
|
Wang, S-W |
| 元智大學 |
2017-05-12 |
Interfacial interaction and crystallization behavior of poly(3-hydroxybutyrate) nanocomposites with modidied silica nanoparticales:eddect of surface Properties
|
藍慶鴻; Sun Y.-M. |
| 中山醫學大學 |
2019-03 |
Interfacial interaction between CMS layer and substrate: Critical factors affecting membrane microstructure and H 2 and CO 2 separation performance from CH 4
|
Wang, C.-T.; Tseng, H.-H. |
| 淡江大學 |
2012 |
Interfacial interaction of gas molecules and single-walled carbon nanotubes
|
Zhou, Jun; Gu, Yudong; Hu, Youfan; Mai,Wenjie; Yeh,Ping-Hung; Bao, Gang; Sood, Ashok K.; Polla,Dennis L.; Wang, Zhong Lin |
| 淡江大學 |
2012-05 |
Interfacial interaction of gas molecules and single-walled carbon nanotubes
|
Zhong, Jun; Chiou, Jauwern; Dong, Chungli; Glans, Per-Anders; Pong, Way-Faung; Chang, Chinglin; Wu, Ziyu; Guo, Jinghua |
| 臺大學術典藏 |
2018-09-10T08:18:30Z |
Interfacial Interactions and Doping in Organic Light-Emitting Diodes Incorporated with Cesium-based Compounds
|
Chen, Mei-Hsin;Lu, Yin-Jui;Chang, Yu-Jen;Wu, Chung-Chih;Wu, Chih-I; Chen, Mei-Hsin; Lu, Yin-Jui; Chang, Yu-Jen; Wu, Chung-Chih; Wu, Chih-I; Wu, Chung-Chih; Wu, Chih-I |
| 國立勤益科技大學 |
2004 |
Interfacial interactions and their influence to phase behavior in poly(vinyl pyrrolidone)/silica hybrid materials prepared by sol–gel process
|
Chan, Cheng-Kuang;Chu, I-Ming;Ou, Cheng-Fang; Lin, Yen-Wen |
| 國立交通大學 |
2018-08-21T05:54:23Z |
Interfacial Investigation on Printable Carbon-Based Mesoscopic Perovskite Solar Cells with NiOx/C Back Electrode
|
Behrouznejad, Fatemeh; Tsai, Cheng-Min; Narra, Sudhakar; Diau, Eric W. -G.; Taghavinia, Nima |
| 臺大學術典藏 |
2018-09-10T05:20:10Z |
Interfacial kinetic roughening with correlated noise
|
Pang, N.-N.;Yu, Y.-K.;Halpin-Healy, T.; Pang, N.-N.; Yu, Y.-K.; Halpin-Healy, T.; NING-NING PANG |
| 國立交通大學 |
2014-12-08T15:08:14Z |
Interfacial layer dependence on device property of high-kappa TiLaO Ge/Si N-type metal-oxide-semiconductor capacitors at small equivalent-oxide thickness
|
Chen, W. B.; Chin, Albert |
| 國立交通大學 |
2019-04-02T06:04:16Z |
Interfacial Layer Engineering for Ge MOSFET by Metal Element Doping and Characterization of Interface Density
|
Chien, Chao-Hsin |
| 臺大學術典藏 |
2018-09-10T09:48:16Z |
Interfacial layer reduction and high permittivity tetragonal ZrO 2 on germanium reaching ultrathin 0.39 nm equivalent oxide thickness
|
CHEE-WEE LIU; Liu, C.W.; Hu, C.; Luo, S.-J.; Wong, I.-H.; Chang, H.-C.; Lin, C.-M.; Lin, C.-M.;Chang, H.-C.;Wong, I.-H.;Luo, S.-J.;Liu, C.W.;Hu, C. |
| 國立交通大學 |
2014-12-08T15:06:28Z |
INTERFACIAL LAYER THEORY OF THE SCHOTTKY-BARRIER DIODES
|
WU, CY |
| 臺大學術典藏 |
2018-09-10T09:22:34Z |
Interfacial layer-free ZrO2 on Ge with 0.39-nm EOT, κ?43, ?2×10-3 A/cm2 gate leakage, SS =85 mV/dec, Ion/Ioff =6×105, and high strain response
|
Chang, H.-C.; Chen, Y.-T.; Wong, I.-H.; Lan, H.-S.; Luo, S.-J.; Lin, J.-Y.; Tseng, Y.-J.; Liu, C.W.; Hu, C.; Yang, F.-L.; Lin, C.-M.; CHEE-WEE LIU et al. |
| 國立交通大學 |
2014-12-08T15:06:24Z |
INTERFACIAL LAYER-THERMIONIC-DIFFUSION THEORY FOR THE SCHOTTKY-BARRIER DIODE
|
WU, CY |
| 臺大學術典藏 |
2021-12-10T08:36:46Z |
Interfacial Layering and Screening Behavior of Glyme-Based Lithium Electrolytes
|
Nojabaee, M; Cheng, HW; Valtiner, M; Popovic, J; Maier, J; HSIU-WEI CHENG |
| 國立成功大學 |
2021 |
Interfacial magnetic coupling in Co/antiferromagnetic van der Waals compound FePS3
|
Dhanarajgopal, A.;Chang, P.-C.;Liu, S.-Y.;Chuang, T.-H.;Wei, D.-H.;Kuo, C.-C.;Kuo, C.-N.;Lue, C.S.;Lin, W.-C. |
| 臺大學術典藏 |
2020-03-31T08:24:54Z |
Interfacial magnetic coupling in hetero-structure of Fe/double-perovskite NdBaMn2O6 single crystal
|
Lin, W. C.; Tsai, C. L.; Ogawa, K.; Yamada, S.; Gandhi, A. C.; Lin, J. G. |
| 元智大學 |
2003-11 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
|
楊鴻銘; 吳和生 |
| 元智大學 |
2002-12 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
|
楊鴻銘; 吳和生 |
| 元智大學 |
2002-12 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
|
楊鴻銘; 吳和生 |
| 元智大學 |
2002-12 |
Interfacial Mechanism and Kinetics of Phase-Transfer Catalysis
|
楊鴻銘; 吳和生 |
| 國立交通大學 |
2014-12-08T15:42:26Z |
Interfacial mechanism studies of electroless plated Cu films on a-Ta : N layers catalyzed by PIII
|
Lin, JH; Lee, TL; Hsieh, WJ; Lin, CC; Kou, CS; Shih, HC |
| 臺大學術典藏 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
|
Chuang, Tung-Han; Lin, Hsiu-Jen; Lin, Hsiu-Jen; Chuang, Tung-Han |
| 國立臺灣大學 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
|
Lin, Hsiu-Jen; Chuang, Tung-Han |
| 臺大學術典藏 |
2011 |
Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish
|
Lin, H.-J.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 國立交通大學 |
2014-12-08T15:37:18Z |
Interfacial microstructure and electrical properties of PT/Al2O3/Si annealed at high temperatures
|
Chen, SY; Hsiao, CS; Hsu, JJ |
| 元智大學 |
Sep-18 |
Interfacial Microstructure and Mechanical Reliability of the Sn-Ag-Cu/Au/Pd(xP)/Ni(P) Reactive System: P Content Effects
|
Ying-Syuan Wu; Pei-Tzu Lee; Yu-Hsuan Huang; Tsai-Tung Kuo; Cheng-En Ho |
| 國立成功大學 |
2006-09-28 |
Interfacial microstructure and shear behavior of Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste
|
Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2011-04-29 |
Interfacial Microstructure Evolution of (B, Al)N Films Grown on Diamond Substrates
|
Song, Jen-Hao; Huang, Jow-Lay; Sung, James C.; Wang, Sheng-Chang; Lu, Horng-Hwa; Lii, Ding-Fwu |
| 淡江大學 |
2024-12-25 |
Interfacial microstructure in the reaction between BiIn solder and Cu substrate
|
Wang, Yi-wun;Lin, Tzu-yi;Tsai, Cheng-ting |
| 國立中山大學 |
2002 |
Interfacial Microstructure of Pb-Free and Pb-Sn Solder Balls in the Ball-Grid Array Package
|
Chin-Su Chi;Hen-So Chang;Ker-Chang Hsieh;C.L. Chung |
| 元智大學 |
Aug-16 |
Interfacial Microstructures and Mechanical Properties of Molten Sn Reacting with Ni-xP Films
|
Wan-Zhen Hsieh; Md. Arifur Rahman; Tsung-Hsun Yang; Tsai-Tung Kuo; Cheng-En Ho |
| 國立聯合大學 |
2008 |
Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-1Al Pb-free solder pastes on OSP finished printed circuit boards
|
Ching-Tsung Lin, Chi-Shiung Hsi, Moo-Chin Wang, Tao-Chih Chang and Ming-Kann Liang |
| 臺大學術典藏 |
2018-09-10T03:44:28Z |
Interfacial microstructures of rf-sputtered TiNi shape memory alloy thin films on (100) silicon
|
Wu, S.K.; Chen, J.Z.; Wu, Y.J.; Wang, J.Y.; Yu, M.N.; Chen, F.R.; Kai, J.J.; SHYI-KAAN WU |
| 國立臺灣大學 |
2001 |
Interfacial microstructures of rf-sputtered TiNi shape memory alloy thin films on (100) silicon
|
Wu, S. K.; Chen, J. Z.; Wu, Y. J.; Wang, J. Y.; Yu, M. N.; Chen, F. R.; Kai, J. J. |
