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Institution	Date	Title	Author
國立交通大學	2014-12-08T15:09:55Z	Interfacial Reactions and Bonding Strength of Sn-xAg-0.5Cu/Ni BGA Solder Joints	Lin, K. S.; Huang, H. Y.; Chou, C. P.
國立臺灣大學	2010	Interfacial Reactions and Doping in Organic Light Emitting Diodes Incorporated with Cesium-Based Compounds	Chen, Mei-Hsin; Lu, Yin-Jui; Chang, Yu-Jen; Wu, Chung-Chih; Wu, Chih-I
臺北醫學大學	2005	Interfacial reactions and electrical properties of hafnium-based thin films in Cu/barrier/n+-p junction diodes	歐耿良; 黃豪銘; 李勝揚; 林哲堂; Ou,Keng-Liang; Tsai,Ming-Hung; Huang,Haw-Ming; Chiou,Shi-Yung; Lin,Che-Tong; Lee,Sheng-Yang
國立成功大學	2002-05	Interfacial reactions and electrical properties of Hf/p-Si0.85Ge0.15	Chung, Ming-Shaw; Wang, Ming-Jun; Lin, Wen-Tai; Chang, Tao-Chih; Fang, Yean-Kuen
元智大學	2013-03	Interfacial Reactions and Electromigration in Flip-Chip Solder Joints	Cheng-En Ho; C. R. Kao; K. N. Tu
國立臺灣科技大學	2009	Interfacial reactions and mechanism properties between SAC 405 and SACNG lead-free solders with Au/Ni(P)/Cu substrates reflowed by CO2 laser	Lo S.-C.; Hsieh Y.-P.; Yen Y.-W.
國立東華大學	2006	Interfacial Reactions between Bi-Ag High Temperature Solders and Metallic Substrates	Song,J. M.; Chuang,H. Y.; Wu,Z. M.
國立臺灣科技大學	2008	Interfacial reactions between Cu alloy and GaAs	Chu, J.P.;Leau, W.K.;Lin, C.H.
臺大學術典藏	2019-11-27T02:02:30Z	Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications	C. ROBERT KAO;Kao C.R.;Yu J.J.;Shih W.L.;Yang T.L.; Yang T.L.; Shih W.L.; Yu J.J.; Kao C.R.; C. ROBERT KAO
國立交通大學	2015-07-21T08:28:57Z	Interfacial reactions between Cu and SnAgCu solder doped with minor Ni	Cheng, Hsi-Kuei; Huang, Chin-Wen; Lee, Hsuan; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming

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