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總筆數 :2853504
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造訪人次 :
45193050
線上人數 :
674
教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
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顯示項目 519151-519160 / 2346260 (共234626頁) << < 51911 51912 51913 51914 51915 51916 51917 51918 51919 51920 > >> 每頁顯示[10|25|50]項目
| 臺大學術典藏 |
2020-05-12T02:53:22Z |
Interfacial Reactions between Liquid Indium and Nickel Substrate
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Tseng, Y.H.; Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2000 |
Interfacial Reactions between Liquid Indium and Silver Substrates
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Liu, Y. M.; Chen, Y. L.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between liquid indium and silver substrates
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Liu, Y.M.; Chen, Y.L.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:16Z |
Interfacial reactions between liquid Sn-8Zn-3Bi solders and Cu substrates
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Lin, W.H.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立成功大學 |
2011-08 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
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Wu, R. W.; Tsao, L. C.; Chang, S. Y.; Jain, C. C.; Chen, R. S. |
| 國立臺灣大學 |
2011 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
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Wu, R.W.; Tsao, L.C.; Chang, S.Y.; Jain, C.C.; Chen, R.S. |
| 國立中山大學 |
1989 |
Interfacial Reactions Between Metal and Gallium Arsenide
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L.C. Lin;K.J. Schulz;K.C. Hsieh;Y.A. Chang |
| 國立臺灣大學 |
1999-01 |
Interfacial reactions between Ni substrate and the component Bi in solders
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Lee, M. S.; Liu, C. M.; Kao, and C. R. |
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Ni/430 stainless steel as interconnect material and Ag-Cu alloy fillers in SOFC system
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Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W. |
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Ni/430 stainless steel as the interconnect material and Ag-Cu alloy fillers in a solid oxide fuel cell system
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Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W. |
顯示項目 519151-519160 / 2346260 (共234626頁) << < 51911 51912 51913 51914 51915 51916 51917 51918 51919 51920 > >> 每頁顯示[10|25|50]項目
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