| 國立臺灣科技大學 |
2011 |
Interfacial reactions between high-Pb solders and Ag
|
Lin, C.P.;Chen, C.M.;Yen, Y.W.;Wu, H.J.;Chen, S.W. |
| 國立臺灣大學 |
2000 |
Interfacial Reactions between In10Ag Solders and Ag Substrates
|
Liu, Y. M.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between In10Ag solders and Ag substrates
|
TUNG-HAN CHUANG; Chuang, T.H.; Liu, Y.M. |
| 國立臺灣科技大學 |
2017 |
Interfacial reactions between lead-free solders and Cu-40Zn alloys
|
Yen, Yen Y.-W.;Chen, P.-Y.;Chen, G.-D. |
| 國立臺灣科技大學 |
2019 |
Interfacial Reactions Between Lead-Free Solders and Ni-Pd-Co Alloys
|
Yen, Yen Y.-W.;Hsiao, Hsiao H.-M.;Chen, K.-J.;Lin, Y.-S.;Lai, M.-T. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between lead-free solders and the multilayer Au/Ni/SUS304 substrate
|
Yen Y.-W.; Lee C.-Y.; Kuo M.-H.; Chao K.-S.; Chen K.-D. |
| 國立臺灣大學 |
2000 |
Interfacial Reactions between Liquid In48Sn Solders and Ag Substrates
|
Huang, Y. T.; Chuang, T. H. |
| 國立臺灣大學 |
2000 |
Interfacial reactions between liquid indium and Au-deposited substrates
|
Liu, Y. M.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between liquid indium and Au-deposited substrates
|
Liu, Y.M.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
1999 |
Interfacial reactions between liquid indium and nickel substrate
|
Tseng, Y. H.; Yeh, M. S.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:22Z |
Interfacial Reactions between Liquid Indium and Nickel Substrate
|
Tseng, Y.H.; Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立臺灣大學 |
2000 |
Interfacial Reactions between Liquid Indium and Silver Substrates
|
Liu, Y. M.; Chen, Y. L.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between liquid indium and silver substrates
|
Liu, Y.M.; Chen, Y.L.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:16Z |
Interfacial reactions between liquid Sn-8Zn-3Bi solders and Cu substrates
|
Lin, W.H.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立成功大學 |
2011-08 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
|
Wu, R. W.; Tsao, L. C.; Chang, S. Y.; Jain, C. C.; Chen, R. S. |
| 國立臺灣大學 |
2011 |
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
|
Wu, R.W.; Tsao, L.C.; Chang, S.Y.; Jain, C.C.; Chen, R.S. |
| 國立中山大學 |
1989 |
Interfacial Reactions Between Metal and Gallium Arsenide
|
L.C. Lin;K.J. Schulz;K.C. Hsieh;Y.A. Chang |
| 國立臺灣大學 |
1999-01 |
Interfacial reactions between Ni substrate and the component Bi in solders
|
Lee, M. S.; Liu, C. M.; Kao, and C. R. |
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Ni/430 stainless steel as interconnect material and Ag-Cu alloy fillers in SOFC system
|
Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W. |
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Ni/430 stainless steel as the interconnect material and Ag-Cu alloy fillers in a solid oxide fuel cell system
|
Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W. |
| 國立臺灣科技大學 |
2018 |
Interfacial Reactions between Pb-free Solders and Cu-Ti Alloy (C1990HP)
|
安德罗 |
| 國立臺灣科技大學 |
2013 |
Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO2 laser and hot-air methods
|
Yen, Y.-W.;Hsiao, H.-M.;Lo, S.-C.;Fu, S.-M. |
| 國立臺灣科技大學 |
2018 |
Interfacial reactions between Sn and Au-xCu alloys
|
Lin, C.H.;Yeh, C.Y.;Yen, Yen Y.W. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between Sn-9Zn + Cu lead-free solders and the Au substrate
|
Liou W.-k.; Yen Y.-w.; Chen K.-d. |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions between Sn-9Zn+Cu lead-free solders and the Au substrate
|
Liou, W.K.;Yen, Y.W.;Chen, K.D. |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions between Sn-Zn alloys and Au substrate
|
Yen, Y.-W.;Lin, M.-C.;Lin, C.-K.;Chen, W.-C. |
| 國立交通大學 |
2020-02-02T23:54:41Z |
Interfacial reactions between Ti and Y2O3/Ca4Ti3O10 composites
|
Lu, Ming-Wei; Lin, Kun-Lin; Lin, Chien-Cheng |
| 國立交通大學 |
2014-12-08T15:45:57Z |
Interfacial reactions between Ti-6Al-4V alloy and zirconia mold during casting
|
Lin, KF; Lin, CC |
| 國立交通大學 |
2014-12-08T15:47:27Z |
Interfacial reactions between zirconia and titanium
|
Lin, KF; Lin, CC |
| 國立成功大學 |
2014-01 |
Interfacial Reactions in Cu/Ga and Cu/Ga/Cu Couples
|
Lin, Shih-kang; Cho, Cheng-liang; Chang, Hao-miao |
| 國立成功大學 |
2013-10-15 |
Interfacial reactions in Sn-20In-2.8Ag/Cu couples
|
Lin, Shih-kang; Hsu, Che-wei; Chen, Sinn-wen; Hsu, Chia-ming |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions in Sn/Fe-xNi couples
|
Yen, Y.-W.;Hsiao, H.-M.;Lin, S.-W.;Huang, P.-J.;Lee, C. |
| 國立臺灣科技大學 |
2017 |
Interfacial reactions in the Au/Sn-xZn/Cu sandwich couples
|
Yen, Yen Y.-W;Lin, C.-Y;Hermana, G.N;Chen, P.-Y;Wu, Y.-P. |
| 中原大學 |
2005 |
Interfacial Reactions in the Sn-(Ag)/(Ni,V) Couples and Phase Equilibria of the Sn-Ni-V System at the Sn-rich Corner
|
Chih-chi Chen;Sinn-wen Chen;Ching-ya Kao; |
| 臺大學術典藏 |
2021-08-05T02:41:04Z |
Interfacial reactions in Zn4Sb3/titanium diffusion couples
|
Chen C.-H;Yeh W.-T;Chuang T.-H.; Chen C.-H; Yeh W.-T; Chuang T.-H.; TUNG-HAN CHUANG |
| 國立成功大學 |
2019 |
Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates
|
Tseng, Tseng T.-H.;Yang, C.-H.;Chiang, J.-Y.;Huang, J.-J.;Chen, Chen C.-H.;Lin, S.-K.;Wang, C.-M.;Wu, A.T. |
| 國立交通大學 |
2014-12-08T15:46:21Z |
Interfacial reactions of Co/Si0.76Ge0.24 and Co(Si0.76Ge0.24)/Si0.76Ge0.24 by pulsed KrF laser annealing
|
Luo, JS; Hang, YL; Lin, WT; Chang, CY; Shih, PS |
| 國立臺灣科技大學 |
2014 |
Interfacial reactions of high-Bi alloys on various substrates
|
Wang, J.-Y.;Chen, C.-M.;Yen, Y.-W. |
| 國立成功大學 |
2004-12 |
Interfacial reactions of lead-free Sn-Zn based solders on Cu and Cu plated electroless Ni-P/Au layer under aging at 150 degrees C
|
Huang, Chia-Wei; Lin, Kwang-Lung |
| 國立臺灣大學 |
2002 |
Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
|
Su, T. L.; Tsao, L. C.; Chang, S. Y.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:17Z |
Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
|
Su, T.L.; Tsao, L.C.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立交通大學 |
2014-12-08T15:48:54Z |
Interfacial reactions of Ni on Si0.76Ge0.24 and Si by pulsed laser annealing
|
Luo, JS; Lin, WT; Chang, CY; Tsai, WC |
| 國立成功大學 |
1998-07 |
Interfacial reactions of Ni on Si0.76Ge0.24 and Si by pulsed laser annealing
|
Luo, Jian-Shing; Lin, Wen-Tai; Chang, C. Y.; Tsai, W. C. |
| 國立交通大學 |
2014-12-08T15:45:14Z |
Interfacial reactions of Ni/Si0.76Ge0.24 and Ni/Si1-x-yGexCy by vacuum annealing and pulsed KrF laser annealing
|
Luo, JS; Lin, WT; Chang, CY; Shih, PS |
| 國立成功大學 |
2000-06 |
Interfacial reactions of Ni/Si0.76Ge0.24 and Ni/Si1-x-yGexCy by vacuum annealing and pulsed KrF laser annealing
|
Luo, Jian-Shing; Lin, Wen-Tai; Chang, C. Y.; Shih, P. S. |
| 國立臺灣科技大學 |
2012 |
Interfacial reactions of Pb-free solders with Au/Pd/Ni/brass multilayer substrates
|
Yen, Y.-W.;Tsai, P.-H.;Fang, Y.-K.;Chen, B.-J.;Lee, C. |
| 國立交通大學 |
2014-12-08T15:48:43Z |
Interfacial reactions of Pd/Si0.76Ge0.24 by pulsed KrF laser annealing
|
Chen, DR; Luo, JS; Lin, WT; Chang, CY; Shih, PS |
| 國立成功大學 |
2008-02-25 |
Interfacial reactions of Pt-based Schottky contacts on InGaP
|
Chu, L. H.; Chang, Edward Yi; Wu, Y. H.; Huang, J. C.; Chen, Q. Y.; Chu, W. K.; Seo, H. W.; Lee, Ching-Ting |
| 國立交通大學 |
2014-12-08T15:12:34Z |
Interfacial reactions of Pt-based Schottky contacts on nGaP
|
Chu, L. H.; Chang, E. Y.; Wu, Y. H.; Huang, J. C.; Chen, Q. Y.; Chu, W. K.; Seo, H. W.; Lee, C. T. |
| 國立臺灣科技大學 |
2008 |
Interfacial Reactions of Pure Sn and Sn-3.0Ag-0.5Cu Lead-free Solders with the Fe-42Ni Substrate
|
Yu-Ping Hsieh;Wei-Kai Liou;Yee-Wen Yen |