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Showing items 519086-519095 of 2346288 (234629 Page(s) Totally)
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| 國立成功大學 |
2006-09-28 |
Interfacial microstructure and shear behavior of Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste
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Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2011-04-29 |
Interfacial Microstructure Evolution of (B, Al)N Films Grown on Diamond Substrates
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Song, Jen-Hao; Huang, Jow-Lay; Sung, James C.; Wang, Sheng-Chang; Lu, Horng-Hwa; Lii, Ding-Fwu |
| 淡江大學 |
2024-12-25 |
Interfacial microstructure in the reaction between BiIn solder and Cu substrate
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Wang, Yi-wun;Lin, Tzu-yi;Tsai, Cheng-ting |
| 國立中山大學 |
2002 |
Interfacial Microstructure of Pb-Free and Pb-Sn Solder Balls in the Ball-Grid Array Package
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Chin-Su Chi;Hen-So Chang;Ker-Chang Hsieh;C.L. Chung |
| 元智大學 |
Aug-16 |
Interfacial Microstructures and Mechanical Properties of Molten Sn Reacting with Ni-xP Films
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Wan-Zhen Hsieh; Md. Arifur Rahman; Tsung-Hsun Yang; Tsai-Tung Kuo; Cheng-En Ho |
| 國立聯合大學 |
2008 |
Interfacial microstructures and solder joint strengths of the Sn-8Zn-3Bi and Sn-9Zn-1Al Pb-free solder pastes on OSP finished printed circuit boards
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Ching-Tsung Lin, Chi-Shiung Hsi, Moo-Chin Wang, Tao-Chih Chang and Ming-Kann Liang |
| 臺大學術典藏 |
2018-09-10T03:44:28Z |
Interfacial microstructures of rf-sputtered TiNi shape memory alloy thin films on (100) silicon
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Wu, S.K.; Chen, J.Z.; Wu, Y.J.; Wang, J.Y.; Yu, M.N.; Chen, F.R.; Kai, J.J.; SHYI-KAAN WU |
| 國立臺灣大學 |
2001 |
Interfacial microstructures of rf-sputtered TiNi shape memory alloy thin films on (100) silicon
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Wu, S. K.; Chen, J. Z.; Wu, Y. J.; Wang, J. Y.; Yu, M. N.; Chen, F. R.; Kai, J. J. |
| 國立臺灣大學 |
2001 |
Interfacial microstructures of rf-sputtered TiNi shape memory alloy thin films on 100 Si
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Wu, S. K.; Chen, J. Z.; Wu, Y. J.; Wang, J .Y.; Yu, M. N.; Chen, F. R.; Kai, J. J. |
| 國立臺灣科技大學 |
2013 |
Interfacial modification of the working electrode of dye-sensitized solar cells to improve the charge transport properties
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Wu, K.-W.;Tedla, A.;Mu, Y.-T.;Tai, Y. |
Showing items 519086-519095 of 2346288 (234629 Page(s) Totally)
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