| 臺大學術典藏 |
2020-05-12T02:53:18Z |
Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate
|
Chiang, M.J.; Chuang, T.H.; TUNG-HAN CHUANG |
| 國立成功大學 |
2014-05 |
Interfacial Reaction Between Low-Temperature Co-fired Ceramics and NiCuZn Ferrites in Multilayer Composites
|
Hsiang, Hsing-I; Lyu, Bing Jyun; Mei, Li-Then; Hsi, Chi-Shiung |
| 國立臺灣科技大學 |
2019 |
Interfacial reaction between sn and cu-ti alloy (C1990hp)
|
Laksono, A.D.;Chang, J.-S.;Yan, J.;Yen, Yen Y.-W. |
| 國立交通大學 |
2014-12-08T15:09:47Z |
Interfacial reaction between Sn-1Ag-0.5Cu(-Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction
|
Lin, K. S.; Huang, H. Y.; Chou, C. P. |
| 國立成功大學 |
2019 |
Interfacial reaction between YSZ electrolyte and La 0.7 Sr 0.3 VO 3 perovskite anode for application
|
Liu, C.-Y.;Tsai, S.-Y.;Ni, C.-T.;Fung, K.-Z. |
| 國立成功大學 |
2019-03 |
Interfacial reaction between YSZ electrolyte and La0.7Sr0.3VO3 perovskite anode for application
|
Liu;Chi-Yang;Tsai;Shu-Yi;Ni;Chung-Ta;Fung;Kuan-Zong |
| 國立中山大學 |
1992 |
Interfacial Reaction Characterization in Aluminum Base Composites
|
Y.S. Lo;J.C. Huang |
| 國立臺灣大學 |
2007 |
Interfacial reaction issues for lead-free electronic solders
|
Ho, C. E.; Yang, S. C.; Kao, C. R. |
| 臺大學術典藏 |
2001 |
Interfacial reaction of infrared brazed NiAl/Al/NiAl and Ni3Al/Al/Ni3Al joints
|
Yang, T.Y.; Wu, S.K.; Shiue, R.K.; SHYI-KAAN WU; SHYI-KAAN WU;Shiue, R.K.;Wu, S.K.;Yang, T.Y.;SHYI-KAAN WU |
| 國立臺灣大學 |
2001 |
Interfacial reaction of infrared brazed NiAl/Al/NiAl and Ni3Al/Al/Ni3Al joints
|
Yang, T. Y.; Wu, S. K.; Shiue, R. K. |
| 臺大學術典藏 |
2020-05-12T02:52:55Z |
Interfacial reaction of infrared brazed NiAl/Al/NiAl and Ni3Al/Al/Ni3Al joints
|
Yang, T.Y.; Wu, S.K.; Shiue, R.K.; REN-KAE SHIUE |
| 國立成功大學 |
2004 |
Interfacial reaction of TiO2/NiCuZn ferrites in multilayer composites
|
Hsiang, Hsing-I; Liao, Wen-Chang; Wang, Yu-Ju; Cheng, Ya-Fang |
| 國立交通大學 |
2014-12-08T15:09:55Z |
Interfacial Reactions and Bonding Strength of Sn-xAg-0.5Cu/Ni BGA Solder Joints
|
Lin, K. S.; Huang, H. Y.; Chou, C. P. |
| 國立臺灣大學 |
2010 |
Interfacial Reactions and Doping in Organic Light Emitting Diodes Incorporated with Cesium-Based Compounds
|
Chen, Mei-Hsin; Lu, Yin-Jui; Chang, Yu-Jen; Wu, Chung-Chih; Wu, Chih-I |
| 臺北醫學大學 |
2005 |
Interfacial reactions and electrical properties of hafnium-based thin films in Cu/barrier/n+-p junction diodes
|
歐耿良; 黃豪銘; 李勝揚; 林哲堂; Ou,Keng-Liang; Tsai,Ming-Hung; Huang,Haw-Ming; Chiou,Shi-Yung; Lin,Che-Tong; Lee,Sheng-Yang |
| 國立成功大學 |
2002-05 |
Interfacial reactions and electrical properties of Hf/p-Si0.85Ge0.15
|
Chung, Ming-Shaw; Wang, Ming-Jun; Lin, Wen-Tai; Chang, Tao-Chih; Fang, Yean-Kuen |
| 元智大學 |
2013-03 |
Interfacial Reactions and Electromigration in Flip-Chip Solder Joints
|
Cheng-En Ho; C. R. Kao; K. N. Tu |
| 國立臺灣科技大學 |
2009 |
Interfacial reactions and mechanism properties between SAC 405 and SACNG lead-free solders with Au/Ni(P)/Cu substrates reflowed by CO2 laser
|
Lo S.-C.; Hsieh Y.-P.; Yen Y.-W. |
| 國立東華大學 |
2006 |
Interfacial Reactions between Bi-Ag High Temperature Solders and Metallic Substrates
|
Song,J. M.; Chuang,H. Y.; Wu,Z. M. |
| 國立臺灣科技大學 |
2008 |
Interfacial reactions between Cu alloy and GaAs
|
Chu, J.P.;Leau, W.K.;Lin, C.H. |
| 臺大學術典藏 |
2019-11-27T02:02:30Z |
Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications
|
C. ROBERT KAO;Kao C.R.;Yu J.J.;Shih W.L.;Yang T.L.; Yang T.L.; Shih W.L.; Yu J.J.; Kao C.R.; C. ROBERT KAO |
| 國立交通大學 |
2015-07-21T08:28:57Z |
Interfacial reactions between Cu and SnAgCu solder doped with minor Ni
|
Cheng, Hsi-Kuei; Huang, Chin-Wen; Lee, Hsuan; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming |
| 國立臺灣科技大學 |
2011 |
Interfacial reactions between high-Pb solders and Ag
|
Lin, C.P.;Chen, C.M.;Yen, Y.W.;Wu, H.J.;Chen, S.W. |
| 國立臺灣大學 |
2000 |
Interfacial Reactions between In10Ag Solders and Ag Substrates
|
Liu, Y. M.; Chuang, T. H. |
| 臺大學術典藏 |
2020-05-12T02:53:20Z |
Interfacial reactions between In10Ag solders and Ag substrates
|
TUNG-HAN CHUANG; Chuang, T.H.; Liu, Y.M. |
