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顯示項目 519391-519440 / 2346788 (共46936頁)
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機構	日期	題名	作者
臺大學術典藏	2020-05-12T02:53:18Z	Interfacial reaction between liquid Sn-20In-2.8Ag solder and Ag substrate	Chiang, M.J.; Chuang, T.H.; TUNG-HAN CHUANG
國立成功大學	2014-05	Interfacial Reaction Between Low-Temperature Co-fired Ceramics and NiCuZn Ferrites in Multilayer Composites	Hsiang, Hsing-I; Lyu, Bing Jyun; Mei, Li-Then; Hsi, Chi-Shiung
國立臺灣科技大學	2019	Interfacial reaction between sn and cu-ti alloy (C1990hp)	Laksono, A.D.;Chang, J.-S.;Yan, J.;Yen, Yen Y.-W.
國立交通大學	2014-12-08T15:09:47Z	Interfacial reaction between Sn-1Ag-0.5Cu(-Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction	Lin, K. S.; Huang, H. Y.; Chou, C. P.
國立成功大學	2019	Interfacial reaction between YSZ electrolyte and La 0.7 Sr 0.3 VO 3 perovskite anode for application	Liu, C.-Y.;Tsai, S.-Y.;Ni, C.-T.;Fung, K.-Z.
國立成功大學	2019-03	Interfacial reaction between YSZ electrolyte and La0.7Sr0.3VO3 perovskite anode for application	Liu;Chi-Yang;Tsai;Shu-Yi;Ni;Chung-Ta;Fung;Kuan-Zong
國立中山大學	1992	Interfacial Reaction Characterization in Aluminum Base Composites	Y.S. Lo;J.C. Huang
國立臺灣大學	2007	Interfacial reaction issues for lead-free electronic solders	Ho, C. E.; Yang, S. C.; Kao, C. R.
臺大學術典藏	2001	Interfacial reaction of infrared brazed NiAl/Al/NiAl and Ni3Al/Al/Ni3Al joints	Yang, T.Y.; Wu, S.K.; Shiue, R.K.; SHYI-KAAN WU; SHYI-KAAN WU;Shiue, R.K.;Wu, S.K.;Yang, T.Y.;SHYI-KAAN WU
國立臺灣大學	2001	Interfacial reaction of infrared brazed NiAl/Al/NiAl and Ni3Al/Al/Ni3Al joints	Yang, T. Y.; Wu, S. K.; Shiue, R. K.
臺大學術典藏	2020-05-12T02:52:55Z	Interfacial reaction of infrared brazed NiAl/Al/NiAl and Ni3Al/Al/Ni3Al joints	Yang, T.Y.; Wu, S.K.; Shiue, R.K.; REN-KAE SHIUE
國立成功大學	2004	Interfacial reaction of TiO2/NiCuZn ferrites in multilayer composites	Hsiang, Hsing-I; Liao, Wen-Chang; Wang, Yu-Ju; Cheng, Ya-Fang
國立交通大學	2014-12-08T15:09:55Z	Interfacial Reactions and Bonding Strength of Sn-xAg-0.5Cu/Ni BGA Solder Joints	Lin, K. S.; Huang, H. Y.; Chou, C. P.
國立臺灣大學	2010	Interfacial Reactions and Doping in Organic Light Emitting Diodes Incorporated with Cesium-Based Compounds	Chen, Mei-Hsin; Lu, Yin-Jui; Chang, Yu-Jen; Wu, Chung-Chih; Wu, Chih-I
臺北醫學大學	2005	Interfacial reactions and electrical properties of hafnium-based thin films in Cu/barrier/n+-p junction diodes	歐耿良; 黃豪銘; 李勝揚; 林哲堂; Ou,Keng-Liang; Tsai,Ming-Hung; Huang,Haw-Ming; Chiou,Shi-Yung; Lin,Che-Tong; Lee,Sheng-Yang
國立成功大學	2002-05	Interfacial reactions and electrical properties of Hf/p-Si0.85Ge0.15	Chung, Ming-Shaw; Wang, Ming-Jun; Lin, Wen-Tai; Chang, Tao-Chih; Fang, Yean-Kuen
元智大學	2013-03	Interfacial Reactions and Electromigration in Flip-Chip Solder Joints	Cheng-En Ho; C. R. Kao; K. N. Tu
國立臺灣科技大學	2009	Interfacial reactions and mechanism properties between SAC 405 and SACNG lead-free solders with Au/Ni(P)/Cu substrates reflowed by CO2 laser	Lo S.-C.; Hsieh Y.-P.; Yen Y.-W.
國立東華大學	2006	Interfacial Reactions between Bi-Ag High Temperature Solders and Metallic Substrates	Song,J. M.; Chuang,H. Y.; Wu,Z. M.
國立臺灣科技大學	2008	Interfacial reactions between Cu alloy and GaAs	Chu, J.P.;Leau, W.K.;Lin, C.H.
臺大學術典藏	2019-11-27T02:02:30Z	Interfacial reactions between Cu and Sn, Sn-Ag, Sn-Bi, Sn-Zn solder under space confinement for 3D IC micro joint applications	C. ROBERT KAO;Kao C.R.;Yu J.J.;Shih W.L.;Yang T.L.; Yang T.L.; Shih W.L.; Yu J.J.; Kao C.R.; C. ROBERT KAO
國立交通大學	2015-07-21T08:28:57Z	Interfacial reactions between Cu and SnAgCu solder doped with minor Ni	Cheng, Hsi-Kuei; Huang, Chin-Wen; Lee, Hsuan; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming
國立臺灣科技大學	2011	Interfacial reactions between high-Pb solders and Ag	Lin, C.P.;Chen, C.M.;Yen, Y.W.;Wu, H.J.;Chen, S.W.
國立臺灣大學	2000	Interfacial Reactions between In10Ag Solders and Ag Substrates	Liu, Y. M.; Chuang, T. H.
臺大學術典藏	2020-05-12T02:53:20Z	Interfacial reactions between In10Ag solders and Ag substrates	TUNG-HAN CHUANG; Chuang, T.H.; Liu, Y.M.
國立臺灣科技大學	2017	Interfacial reactions between lead-free solders and Cu-40Zn alloys	Yen, Yen Y.-W.;Chen, P.-Y.;Chen, G.-D.
國立臺灣科技大學	2019	Interfacial Reactions Between Lead-Free Solders and Ni-Pd-Co Alloys	Yen, Yen Y.-W.;Hsiao, Hsiao H.-M.;Chen, K.-J.;Lin, Y.-S.;Lai, M.-T.
國立臺灣科技大學	2009	Interfacial reactions between lead-free solders and the multilayer Au/Ni/SUS304 substrate	Yen Y.-W.; Lee C.-Y.; Kuo M.-H.; Chao K.-S.; Chen K.-D.
國立臺灣大學	2000	Interfacial Reactions between Liquid In48Sn Solders and Ag Substrates	Huang, Y. T.; Chuang, T. H.
國立臺灣大學	2000	Interfacial reactions between liquid indium and Au-deposited substrates	Liu, Y. M.; Chuang, T. H.
臺大學術典藏	2020-05-12T02:53:20Z	Interfacial reactions between liquid indium and Au-deposited substrates	Liu, Y.M.; Chuang, T.H.; TUNG-HAN CHUANG
國立臺灣大學	1999	Interfacial reactions between liquid indium and nickel substrate	Tseng, Y. H.; Yeh, M. S.; Chuang, T. H.
臺大學術典藏	2020-05-12T02:53:22Z	Interfacial Reactions between Liquid Indium and Nickel Substrate	Tseng, Y.H.; Yeh, M.S.; Chuang, T.H.; TUNG-HAN CHUANG
國立臺灣大學	2000	Interfacial Reactions between Liquid Indium and Silver Substrates	Liu, Y. M.; Chen, Y. L.; Chuang, T. H.
臺大學術典藏	2020-05-12T02:53:20Z	Interfacial reactions between liquid indium and silver substrates	Liu, Y.M.; Chen, Y.L.; Chuang, T.H.; TUNG-HAN CHUANG
臺大學術典藏	2020-05-12T02:53:16Z	Interfacial reactions between liquid Sn-8Zn-3Bi solders and Cu substrates	Lin, W.H.; Chuang, T.H.; TUNG-HAN CHUANG
國立成功大學	2011-08	Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates	Wu, R. W.; Tsao, L. C.; Chang, S. Y.; Jain, C. C.; Chen, R. S.
國立臺灣大學	2011	Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates	Wu, R.W.; Tsao, L.C.; Chang, S.Y.; Jain, C.C.; Chen, R.S.
國立中山大學	1989	Interfacial Reactions Between Metal and Gallium Arsenide	L.C. Lin;K.J. Schulz;K.C. Hsieh;Y.A. Chang
國立臺灣大學	1999-01	Interfacial reactions between Ni substrate and the component Bi in solders	Lee, M. S.; Liu, C. M.; Kao, and C. R.
國立臺灣科技大學	2008	Interfacial reactions between Ni/430 stainless steel as interconnect material and Ag-Cu alloy fillers in SOFC system	Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W.
國立臺灣科技大學	2008	Interfacial reactions between Ni/430 stainless steel as the interconnect material and Ag-Cu alloy fillers in a solid oxide fuel cell system	Yen, Y.-W.;Lee, C.-Y.;Huang, D.-P.;Su, J.-W.
國立臺灣科技大學	2018	Interfacial Reactions between Pb-free Solders and Cu-Ti Alloy (C1990HP)	安德罗
國立臺灣科技大學	2013	Interfacial reactions between SAC405 and SACNG lead-free solders with Au/Ni(P)/Cu substrate reflowed using the CO2 laser and hot-air methods	Yen, Y.-W.;Hsiao, H.-M.;Lo, S.-C.;Fu, S.-M.
國立臺灣科技大學	2018	Interfacial reactions between Sn and Au-xCu alloys	Lin, C.H.;Yeh, C.Y.;Yen, Yen Y.W.
國立臺灣科技大學	2009	Interfacial reactions between Sn-9Zn + Cu lead-free solders and the Au substrate	Liou W.-k.; Yen Y.-w.; Chen K.-d.
國立臺灣科技大學	2009	Interfacial reactions between Sn-9Zn+Cu lead-free solders and the Au substrate	Liou, W.K.;Yen, Y.W.;Chen, K.D.
國立臺灣科技大學	2012	Interfacial reactions between Sn-Zn alloys and Au substrate	Yen, Y.-W.;Lin, M.-C.;Lin, C.-K.;Chen, W.-C.
國立交通大學	2020-02-02T23:54:41Z	Interfacial reactions between Ti and Y2O3/Ca4Ti3O10 composites	Lu, Ming-Wei; Lin, Kun-Lin; Lin, Chien-Cheng
國立交通大學	2014-12-08T15:45:57Z	Interfacial reactions between Ti-6Al-4V alloy and zirconia mold during casting	Lin, KF; Lin, CC

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