| 國立臺灣科技大學 |
2016 |
Low temperature annealing effect on photoresponse of the bilayer structures of ZnO nanorod/nanodiamond films based on ultraviolet photodetector
|
Huang, B.-R;Ke, W.-C;Peng, Y.-H;Liou, R.-H. |
| 臺大學術典藏 |
2018-09-10T08:17:49Z |
Low temperature annealing for GaAsSbN grown by gas-source molecular beam epitaxy
|
Y. T. Lin,;T. C. Ma,;H. H. Lin; Y. T. Lin,; T. C. Ma,; H. H. Lin; HAO-HSIUNG LIN |
| 國立交通大學 |
2014-12-08T15:07:53Z |
Low Temperature Annealing with Solid-State Laser or UV Lamp Irradiation on Amorphous IGZO Thin-Film Transistors
|
Zan, Hsiao-Wen; Chen, Wei-Tsung; Chou, Cheng-Wei; Tsai, Chuang-Chuang; Huang, Ching-Neng; Hsueh, Hsiu-Wen |
| 國立交通大學 |
2019-12-13T01:12:49Z |
Low temperature Au-Au direct bonding with highly < 111 >-oriented Au films
|
Hsu, Wei-You; Wu, John; Chen, Chih |
| 國立臺灣大學 |
2007 |
Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3.5Ag4Ti(Ce,Ga) Filler
|
Chang, S.Y.; Chuang, T.H.; Yang, C.L. |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Low temperature bonding of alumina/alumina and alumina/copper in air using Sn3.5Ag4Ti(Ce,Ga) filler
|
Chang, S.Y.; Chuang, T.H.; Yang, C.L.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2020-05-12T02:53:05Z |
Low temperature bonding of Pd/Ni assembly for hydrogen purifier
|
Lin, Y.-C.; Chuang, C.-H.; Tsai, H.-H.; Chuang, T.-H.; TUNG-HAN CHUANG |
| 國立交通大學 |
2019-04-02T06:04:16Z |
Low Temperature Bonding Technology Development for 3D and Heterogeneous Integration
|
Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:21:23Z |
Low temperature bonding technology for 3D integration
|
Ko, Cheng-Ta; Chen, Kuan-Neng |
| 國立彰化師範大學 |
2009-02 |
Low Temperature Carbon Monoxide Oxidation over Gold Nanoparticles Supported on Sodium Titanate Nanotubes
|
Tsai, Jui-Ying; Chao, Jiunn-Hsing; Lin, Chiu-Hsun |
| 國立臺灣大學 |
1997 |
Low temperature chemical vapor deposition growth of -SiC on (100) Si using methylsilane and device characteristics
|
Liu, C. W.; Sturm, J. C. |
| 臺大學術典藏 |
2018-09-10T06:31:22Z |
Low temperature chemical vapor deposition growth of β-SiC on (100) Si using methylsilane and device characteristics
|
Liu, C.W.; Sturm, J.C.; CHEE-WEE LIU |
| 臺大學術典藏 |
1994 |
Low Temperature Coating of Refractory Metal and Carbide on SiC
|
Wei, Wen-Cheng; Lo, Ming-Hung; 韋文誠; Lo, Ming-Hung; Wei, Wen-Cheng; Lo, Ming-Hung |
| 國立臺灣大學 |
1994 |
Low Temperature Coating of Refractory Metal and Carbide on SiC
|
韋文誠; Lo, Ming-Hung; Wei, Wen-Cheng; Lo, Ming-Hung |
| 國立成功大學 |
2012 |
Low Temperature Cofired Soft Ferrites for High Frequency Applications
|
Hsiang, Hsing-I; Hsi, Chi-Shiung; Hsu, Xiao Ci |
| 國立交通大學 |
2020-10-05T02:01:09Z |
Low Temperature Copper-Copper Bonding of Non-Planarized Copper Pillar With Passivation
|
Tsai, Yi-Chieh; Hu, Han-Wen; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:26Z |
Low Temperature Cu-Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review
|
Panigrahy, Asisa Kumar; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:49Z |
Low temperature Cu-Cu direct bonding by (111) oriented nano-twin Cu
|
Juang, Jing-Ye; Chu, Yi-Cheng; Lu, Chia-Ling; Chen, Chih; Tu, King-Ning |
| 國立交通大學 |
2019-12-13T01:12:49Z |
Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package
|
Yang, Kai-Ming; Chou, Tzu-Chieh; Ko, Cheng-Ta; Lin, Chen-Hao; Chen, Yu-Hua; Tseng, Tzyy-Jang; Wu, Wen-Wei; Chen, Kuan-Neng |
| 國立交通大學 |
2020-01-02T00:04:24Z |
Low Temperature Cu-to-Cu Bonding in Non-vacuum Atmosphere with Thin Gold Capping on Highly (111) Oriented Nanotwinned Copper
|
Wu, Yu-Ting; Chen, Chih |
| 國立交通大學 |
2019-12-13T01:12:49Z |
Low Temperature Cu-to-Cu Direct Bonding with thin gold capping on Highly-orientated Nanotwinned Cu Films
|
Chen, Fu-Chian; Wu, Yu-Ting; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:27:23Z |
Low temperature deposited highly-conductive N-type SiC thin films
|
Cheng, KL; Cheng, HC; Lee, WH; Lee, C; Yew, TR |
| 國立交通大學 |
2020-10-05T01:59:48Z |
Low temperature deposition of high quality single crystalline AlN thin films on sapphire using highly oriented monolayer MoS 2 as a buffer layer
|
Lu, Li-Syuan; Chueh, Wei-Chen; Chang, Wen-Hao; Chen, Meei-Ru; Chien, Hung-Yi; Kuo, Po-Chun; Kao, Hui-Ling; Chen, Jyh-Shin |
| 臺大學術典藏 |
2008 |
Low Temperature Direct Electroless Nickel Plating on Silicon Wafer
|
Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray; Jain, Chao-Chi; Wang, Shiuan-Sheng; Chuang, Tung-Han; Yang, Sang-Ray |
| 臺大學術典藏 |
2020-05-12T02:53:11Z |
Low temperature direct electroless nickel plating on silicon wafer
|
TUNG-HAN CHUANG; Yang, S.-R.; Chuang, T.-H.; Wang, S.-S.; Jain, C.-C. |
