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显示项目 557011-557020 / 2346260 (共234626页)
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| 臺大學術典藏 |
1994 |
Low Temperature Coating of Refractory Metal and Carbide on SiC
|
Wei, Wen-Cheng; Lo, Ming-Hung; 韋文誠; Lo, Ming-Hung; Wei, Wen-Cheng; Lo, Ming-Hung |
| 國立臺灣大學 |
1994 |
Low Temperature Coating of Refractory Metal and Carbide on SiC
|
韋文誠; Lo, Ming-Hung; Wei, Wen-Cheng; Lo, Ming-Hung |
| 國立成功大學 |
2012 |
Low Temperature Cofired Soft Ferrites for High Frequency Applications
|
Hsiang, Hsing-I; Hsi, Chi-Shiung; Hsu, Xiao Ci |
| 國立交通大學 |
2020-10-05T02:01:09Z |
Low Temperature Copper-Copper Bonding of Non-Planarized Copper Pillar With Passivation
|
Tsai, Yi-Chieh; Hu, Han-Wen; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:26Z |
Low Temperature Cu-Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review
|
Panigrahy, Asisa Kumar; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:56:49Z |
Low temperature Cu-Cu direct bonding by (111) oriented nano-twin Cu
|
Juang, Jing-Ye; Chu, Yi-Cheng; Lu, Chia-Ling; Chen, Chih; Tu, King-Ning |
| 國立交通大學 |
2019-12-13T01:12:49Z |
Low Temperature Cu-Cu Gang Bonding for RDL-First Fan-Out Panel Level Package
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Yang, Kai-Ming; Chou, Tzu-Chieh; Ko, Cheng-Ta; Lin, Chen-Hao; Chen, Yu-Hua; Tseng, Tzyy-Jang; Wu, Wen-Wei; Chen, Kuan-Neng |
| 國立交通大學 |
2020-01-02T00:04:24Z |
Low Temperature Cu-to-Cu Bonding in Non-vacuum Atmosphere with Thin Gold Capping on Highly (111) Oriented Nanotwinned Copper
|
Wu, Yu-Ting; Chen, Chih |
| 國立交通大學 |
2019-12-13T01:12:49Z |
Low Temperature Cu-to-Cu Direct Bonding with thin gold capping on Highly-orientated Nanotwinned Cu Films
|
Chen, Fu-Chian; Wu, Yu-Ting; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:27:23Z |
Low temperature deposited highly-conductive N-type SiC thin films
|
Cheng, KL; Cheng, HC; Lee, WH; Lee, C; Yew, TR |
显示项目 557011-557020 / 2346260 (共234626页)
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