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Institution	Date	Title	Author
國立臺灣科技大學	2014	Package design: Colour harmony and consumer expectations	Wei, S.-T.;Ou, L.-C.;Luo, M.R.;Hutchings, J.B.
國立中山大學	2003-12-06	Package Implementation: A Study of Data and Output Misfit Identification	Jen-Her Wu;Chi-Cheng Wu;Shin-Shing Shin
淡江大學	2018-10-04	Package mTEXO for testing the presence of outliers in exponential samples	Lin, Chien-Tai;Lee, Ying-Chen;Balakrishnan, Narayanaswamy
淡江大學	2018-07-28	Package mTEXO for testing the presence of outliers in exponential samples	Lin, C. T.;Lee, Y. C.;Balakrishnan, N.
淡江大學	2018-10-04	Package mTEXO for testing the presence of outliers in exponential samples.	Chien-Tai Lin, Ying Chen Lee, and N. Balakrishnan
國立交通大學	2017-04-21T06:49:40Z	Package Routability- and IR-Drop-Aware Finger/Pad Assignment in Chip-Package Co-Design	Lu, Chao-Hung; Chen, Hung-Ming; Liu, Chien-Nan Jimmy; Shih, Wen-Yu
國立交通大學	2014-12-08T15:31:26Z	Package routability- and IR-drop-aware finger/pad planning for single chip and stacking IC designs	Lu, Chao-Hung; Chen, Hung-Ming; Liu, Chien-Nan Jimmy; Shih, Wen-Yu
國立交通大學	2015-12-04T07:03:11Z	PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME	LIN Chien-Chung; KUO Hao-Chung; CHEN Kuo-Ju; HAN Hau-Vei; CHEN Hsin-Chu
國立交通大學	2017-02-09	PACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICE	Hsien-Hao Tu; Zong-Yi Tu; Kuo-Ju Chen; Hau-Vei Han; Chin-Wei Sher; Hao-Chung Kuo; Chien-Chung Lin
國立臺灣科技大學	2020	Package structure of polarized white chip-on-board light-emitting diode with high thermal conductivity	Su, J.-C.;Huang, S.-B.

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