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Showing items 873056-873065 of 2348685 (234869 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:04:16Z |
THERMAL-ANALYSIS OF HIGH-T(C) SUPERCONDUCTING BOLOMETERS
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WU, JP; CHEN, RC; CHU, HS |
| 國立交通大學 |
2018-08-21T05:52:51Z |
Thermal-Annealing-Induced Self-Stretching: Fabrication of Anisotropic Polymer Particles on Polymer Films
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Lo, Yu-Ching; Chiu, Yu-Jing; Tseng, Hsiao-Fan; Chen, Jiun-Tai |
| 臺大學術典藏 |
2018-09-10T15:23:43Z |
Thermal-Aware 3D Network-On-Chip (3D NoC) Designs: Routing Algorithms and Thermal Managements
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Chen, K.-C.J.;Chao, C.-H.;Wu, A.-Y.A.; Chen, K.-C.J.; Chao, C.-H.; Wu, A.-Y.A.; AN-YEU(ANDY) WU |
| 臺大學術典藏 |
2018-09-10T15:23:42Z |
Thermal-Aware 3D Network-On-Chip (3D NoC) Designs: Routing Algorithms and Thermal Managementse
|
AN-YEU(;Y) WU; AN-YEU(; Y) WU; AN-YEU(ANDY) WU |
| 國立成功大學 |
2011-08-02 |
Thermal-Aware Bus-Driven Floorplanning
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Wu, Po-Hsun; Ho, Tsung-Yi |
| 臺大學術典藏 |
2018-09-10T14:58:25Z |
Thermal-aware Dynamic Buffer Allocation for Proactive routing algorithm on 3D Network-on-Chip systems
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Lee, Y.-S.;Hsin, H.-K.;Chen, K.-C.;Chang, E.-J.;Wu, A.-Y.A.; Lee, Y.-S.; Hsin, H.-K.; Chen, K.-C.; Chang, E.-J.; Wu, A.-Y.A.; AN-YEU(ANDY) WU |
| 國立成功大學 |
2021-05 |
Thermal-Aware Fixed-Outline Floorplanning Using Analytical Models With Thermal-Force Modulation
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Lin;Jai-Ming;Chen;Tai-Ting;Hsieh;Hao-Yuan;Shyu;Ya-Ting;Chang;Yeong-Jar;Lu;Juin-Ming |
| 國立成功大學 |
2021-09 |
Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC
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Lin;Jai-Ming;Chang;Wei-Yi;Hsieh;Hao-Yuan;Shyu;Ya-Ting;Chang;Yeong-Jar;Lu;Juin-Ming |
| 元智大學 |
2014-10-07 |
Thermal-aware kernel mapping for three-dimensional multi-mode channel decoding
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Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su |
| 國立交通大學 |
2014-12-08T15:23:05Z |
Thermal-Aware Logic Block Placement for 3D FPGAs Considering Lateral Heat Dissipation
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Huang, Juinn-Dar; Huang, Ya-Shih; Hsu, Mi-Yu; Chang, Han-Yuan |
Showing items 873056-873065 of 2348685 (234869 Page(s) Totally)
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