| 臺大學術典藏 |
2018-09-10T14:58:25Z |
Thermal-aware Dynamic Buffer Allocation for Proactive routing algorithm on 3D Network-on-Chip systems
|
Lee, Y.-S.;Hsin, H.-K.;Chen, K.-C.;Chang, E.-J.;Wu, A.-Y.A.; Lee, Y.-S.; Hsin, H.-K.; Chen, K.-C.; Chang, E.-J.; Wu, A.-Y.A.; AN-YEU(ANDY) WU |
| 國立成功大學 |
2021-05 |
Thermal-Aware Fixed-Outline Floorplanning Using Analytical Models With Thermal-Force Modulation
|
Lin;Jai-Ming;Chen;Tai-Ting;Hsieh;Hao-Yuan;Shyu;Ya-Ting;Chang;Yeong-Jar;Lu;Juin-Ming |
| 國立成功大學 |
2021-09 |
Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC
|
Lin;Jai-Ming;Chang;Wei-Yi;Hsieh;Hao-Yuan;Shyu;Ya-Ting;Chang;Yeong-Jar;Lu;Juin-Ming |
| 元智大學 |
2014-10-07 |
Thermal-aware kernel mapping for three-dimensional multi-mode channel decoding
|
Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su |
| 國立交通大學 |
2014-12-08T15:23:05Z |
Thermal-Aware Logic Block Placement for 3D FPGAs Considering Lateral Heat Dissipation
|
Huang, Juinn-Dar; Huang, Ya-Shih; Hsu, Mi-Yu; Chang, Han-Yuan |
| 國立臺灣科技大學 |
2016 |
Thermal-aware MapReduce real-time scheduling in heterogeneous server systems
|
Tang, Tang T.-C;Chen, Y.-S. |
| 元智大學 |
2015-08-04 |
Thermal-aware Memory Mapping for Three-dimensional Block-based SRAM Architecture
|
Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su |
| 國立臺灣科技大學 |
2012 |
Thermal-aware real-time task scheduling for three-dimensional multicore chip
|
Tsai, T.-H.;Chen, Y.-S. |
| 臺大學術典藏 |
2020-06-16T06:36:16Z |
Thermal-aware router-sharing architecture for 3D network-on-chip designs
|
Huang, Y.-R.;Pan, J.-H.;Lu, Y.-C.; Huang, Y.-R.; Pan, J.-H.; Lu, Y.-C.; YI-CHANG LU |
| 國立臺灣科技大學 |
2012 |
Thermal-aware service rate adjustment for cyber-physical systems
|
Chu, H.-H.;Tsai, T.-H.;Chen, Y.-S. |
| 元智大學 |
2014-04-11 |
Thermal-aware task mapping for reconfigurable channel decoding
|
Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su |
| 元智大學 |
2014-08-05 |
Thermal-aware task mapping for three-dimensional reconfigurable channel decoding
|
Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su |
| 臺大學術典藏 |
2018-09-10T09:25:31Z |
Thermal-aware Test Schedule and TAM Co-Optimization for Three Dimensional IC
|
C. J. Shih;C. Y. Hsu;C. Y. Kou;J. C. M. Li;J. C. Rau;K. Chakrabarty; C. J. Shih; C. Y. Hsu; C. Y. Kou; J. C. M. Li; J. C. Rau; K. Chakrabarty; CHIEN-MO LI |
| 淡江大學 |
2012-10-18 |
Thermal-Aware Test Schedule and TAM Co-Optimization for Three-Dimensional IC
|
Shih, Chi-Jih; Hsu, Chih-Yao; Kuo, Chun-Yi; Li, James; Rau, Jiann-Chyi; Krishnendu Chakrabarty |
| 臺大學術典藏 |
2018-09-10T08:47:25Z |
Thermal-aware Test scheduling for 3D ICs
|
CY Hsu; JCM Li; K. Chakrbarty; CHIEN-MO LI |
| 臺大學術典藏 |
2020-01-06T03:05:17Z |
Thermal-capillary analysis of floating-zone growth of tube crystals: steady-state and conduction dominated calculations
|
Lan, C.W.; CHUNG-WEN LAN |
| 中華大學 |
2003 |
Thermal-chemical polishing device and method thereof
|
馬廣仁; Ma, Kung-Jen |
| 淡江大學 |
2003-05-27 |
Thermal-chemical polishing devices and method thereof
|
趙崇禮; Chao, Choung-lii; Ma, Kung-jeng; Lin, Hung-yi |
| 元智大學 |
May-22 |
Thermal-constrained memory management for three-dimensional DRAM-PCM memory with deep neural network applications
|
Shu-Yen Lin; Shao-Cheng Wang |
| 國立交通大學 |
2015-12-02T02:59:38Z |
Thermal-Constrained Task Scheduling on 3-D Multicore Processors for Throughput-and-Energy Optimization
|
Liao, Chien-Hui; Wen, Charles H. -P. |
| 元智大學 |
Mar-17 |
Thermal-controlled Design Flow for the Three-dimensional Dual-mode Forward Error Correction Architecture
|
Shu-Yen Lin; Ho-Yun Su; Cheng-Hung Lin |
| 國立臺灣科技大學 |
2011 |
THERMAL-DIFFUSION AND DIFFUSION-THERMO EFFECTS ON NATURAL CONVECTION ALONG AN INCLINED STRETCHING SURFACE IN A POROUS MEDIUM WITH CHEMICAL REACTION
|
Huang, J.S.;Tsai, R.;Huang, K.H.;Huang, C.H. |
| 臺大學術典藏 |
2018-09-10T07:36:54Z |
Thermal-driven analog placement considering device matching
|
Lin, P.-H.;Zhang, H.;Wong, M.D.F.;Chang, Y.-W.; Lin, P.-H.; Zhang, H.; Wong, M.D.F.; Chang, Y.-W.; YAO-WEN CHANG |
| 臺大學術典藏 |
2018-09-10T08:42:36Z |
Thermal-driven analog placement considering device matching
|
YAO-WEN CHANG; Chang, Y.-W.; Wong, M.D.F.; Lin, M.P.-H.; Zhang, H.; Lin, M.P.-H.;Zhang, H.;Wong, M.D.F.;Chang, Y.-W. |
| 臺大學術典藏 |
2020-06-16T06:31:34Z |
Thermal-driven analog placement considering device matching.
|
Lin, Mark Po-Hung;Zhang, Hongbo;Wong, Martin D. F.;Chang, Yao-Wen; Lin, Mark Po-Hung; Zhang, Hongbo; Wong, Martin D. F.; Chang, Yao-Wen; YAO-WEN CHANG |
