| 臺大學術典藏 |
1992 |
Thermal Weight Function of Cracked Bodies Subjected to Thermal Loading
|
Tsai, Chwan-Huei; Ma, Chien-Ching; Tsai, Chwan-Huei; Tsai, Chwan-Huei; Ma, Chien-Ching |
| 國立臺灣大學 |
1992 |
Thermal Weight Function of Cracked Bodies Subjected to Thermal Loading
|
Tsai, Chwan-Huei; Ma, Chien-Ching |
| 國立臺灣大學 |
1992-01 |
Thermal Weight Function of Cracked Bodies Subjected to Thermal Loading
|
Tsai, Chwan-Huei; Ma, Chien-Ching |
| 國立交通大學 |
2014-12-08T15:26:34Z |
Thermal writing by long working distance Fiberlenses for Optical Recording Applications
|
Tien, CH; Milster, TD; Chiu, Y; Shieh, HPD |
| 國立聯合大學 |
2004 |
Thermal, chemical and structural characteristics of erbium-doped sodium phosphate glasses
|
P.Y. Shih（施並裕）, S.W. Yung & T.S. Chin |
| 國立成功大學 |
2011-02-15 |
Thermal, chemical, optical properties and structure of Er(3+)-doped and Er(3+)/Yb(3+)-codoped P(2)O(5)-Al(2)O(3)-ZnO glasses
|
Yung, S. W.; Hsu, S. M.; Chang, C. C.; Hsu, K. L.; Chin, T. S.; Hsiang, H. I.; Lai, Y. S. |
| 中國醫藥大學 |
2011 |
Thermal, chemical, optical properties and structure of Er3+-doped and Er3+/Yb3+-codoped P2O5–Al2O3–ZnO glasses
|
(S.W. Yung)*; 許世明(Shih-Ming Hsu); (C.C. Chang); (K.L. Hsu); (T.S. Chin); (H.I. Hsiang); (Y.S. Lai) |
| 東海大學 |
2012 |
Thermal, dynamic-mechanical, and dielectric properties of surfactant intercalated graphite oxide filled maleated polypropylene nanocomposites
|
Wang, Y., Tsai, H.-B. |
| 元智大學 |
2010-10 |
Thermal, electrical and electrochemical performance of (Ba0.5Sr0.5)0.8La0.2Co1-xCuxO3-δ cathode for low-temperature SOFC
|
I-Ming Hung; Chen-Yu Liang; Chun-Jing Ciou; Ay Su; Chan S.-H. |
| 義守大學 |
2013-03 |
Thermal, magnetic, electric, and adhesive properties of amorphous Co60Fe20B20 thin films
|
Yuan-Tsung Chen;W.H. Hsieh |
| 國立臺灣大學 |
2001-10 |
Thermal, mechanical, and morphological properties of novolac-type phenolic resin blended with fullerenol polyurethane and linear polyurethane
|
Ma CCM; Sung SC; Wang FY; Chiang LY; Wang LY; Chiang CL |
| 國立成功大學 |
2003-04-15 |
Thermal, morphology, and NMR characterizations on phase behavior and miscibility in blends of isotactic polystyrene with poly(cyclohexyl methacrylate)
|
Chang, Li-Ling; Woo, Eamor M. |
| 臺大學術典藏 |
2004 |
Thermal, spectroscopic and X-ray diffractional analyses of zirconium hydroxides precipitated at low pH values
|
Guo, G. Y.; Chen, Y. L.; Ying, W. J.; GUANG-YU GUO; Guo, G. Y.;Chen, Y. L.;Ying, W. J. |
| 國立成功大學 |
2009-01-16 |
Thermal, spectroscopy, and morphological studies on polymorphic crystals in poly(heptamethylene terephthalate)
|
Yen, Kai C.; Woo, Eamor M. |
| 國立中山大學 |
1992 |
Thermal- and impurity-induced order-disorder transformations of Ga(0.5)1n(0.5)P epilayers grown by metalorganic chemical vapor deposition
|
R.H. Horng; L.C. Haung; M.K. Lee |
| 元智大學 |
Mar-17 |
Thermal- and Performance-Aware Address Mapping for the Multi-Channel Three-Dimensional DRAM Systems
|
Shu-Yen Lin; Jin-Yi Lin |
| 國立成功大學 |
2022-03-11 |
Thermal-/Light-Tunable Hydrogels Showing Reversible Widening and Closing Actuations Based on Predesigned Interpenetrated Networks
|
Liu;Chun-Yen;Chang;Chien-Hsiang;Thi, Thanh Tran;Wu;Guan-Yi;Tu;Chia-Ming;Chen;Hung-Yi |
| 國立交通大學 |
2014-12-08T15:31:46Z |
Thermal-activated carrier transfer in ZnCdO thin film grown by plasma-assisted molecular beam epitaxy
|
Chien, K. F.; Hsu, W. L.; Tzou, A. J. .; Lin, Y. C.; Chou, W. C.; Lee, L.; Chia, C. H.; Yang, C. S. |
| 臺大學術典藏 |
2018-09-10T03:50:58Z |
Thermal-ADI: A Linear-Time Chip-Level Dynamic Thermal Simulation Algorithm Based on Alternating-Direction-Implicit (ADI) Method
|
Ting-Yuan Wang; Charlie Chung-Ping Chen; CHUNG-PING CHEN |
| 國立臺灣大學 |
2003 |
Thermal-ADI: A Linear-Time Chip-Level Dynamic Thermal Simulation Algorithm Based on Alternating-Direction-Implicit (ADI) Method
|
Wang, Ting-Yuan; Chen, Charlie Chung-Ping |
| 臺大學術典藏 |
2018-09-10T04:36:03Z |
Thermal-ADI: A Linear-Time Chip-Level Dynamic Thermal Simulation Algorithm Based on Alternating-Direction-Implicit (ADI) Method
|
Ting-Yuan Wang; Charlie Chung-Ping Chen; CHUNG-PING CHEN |
| 國立交通大學 |
2014-12-08T15:04:16Z |
THERMAL-ANALYSIS OF HIGH-T(C) SUPERCONDUCTING BOLOMETERS
|
WU, JP; CHEN, RC; CHU, HS |
| 國立交通大學 |
2018-08-21T05:52:51Z |
Thermal-Annealing-Induced Self-Stretching: Fabrication of Anisotropic Polymer Particles on Polymer Films
|
Lo, Yu-Ching; Chiu, Yu-Jing; Tseng, Hsiao-Fan; Chen, Jiun-Tai |
| 臺大學術典藏 |
2018-09-10T15:23:43Z |
Thermal-Aware 3D Network-On-Chip (3D NoC) Designs: Routing Algorithms and Thermal Managements
|
Chen, K.-C.J.;Chao, C.-H.;Wu, A.-Y.A.; Chen, K.-C.J.; Chao, C.-H.; Wu, A.-Y.A.; AN-YEU(ANDY) WU |
| 臺大學術典藏 |
2018-09-10T15:23:42Z |
Thermal-Aware 3D Network-On-Chip (3D NoC) Designs: Routing Algorithms and Thermal Managementse
|
AN-YEU(;Y) WU; AN-YEU(; Y) WU; AN-YEU(ANDY) WU |
| 國立成功大學 |
2011-08-02 |
Thermal-Aware Bus-Driven Floorplanning
|
Wu, Po-Hsun; Ho, Tsung-Yi |
| 臺大學術典藏 |
2018-09-10T14:58:25Z |
Thermal-aware Dynamic Buffer Allocation for Proactive routing algorithm on 3D Network-on-Chip systems
|
Lee, Y.-S.;Hsin, H.-K.;Chen, K.-C.;Chang, E.-J.;Wu, A.-Y.A.; Lee, Y.-S.; Hsin, H.-K.; Chen, K.-C.; Chang, E.-J.; Wu, A.-Y.A.; AN-YEU(ANDY) WU |
| 國立成功大學 |
2021-05 |
Thermal-Aware Fixed-Outline Floorplanning Using Analytical Models With Thermal-Force Modulation
|
Lin;Jai-Ming;Chen;Tai-Ting;Hsieh;Hao-Yuan;Shyu;Ya-Ting;Chang;Yeong-Jar;Lu;Juin-Ming |
| 國立成功大學 |
2021-09 |
Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC
|
Lin;Jai-Ming;Chang;Wei-Yi;Hsieh;Hao-Yuan;Shyu;Ya-Ting;Chang;Yeong-Jar;Lu;Juin-Ming |
| 元智大學 |
2014-10-07 |
Thermal-aware kernel mapping for three-dimensional multi-mode channel decoding
|
Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su |
| 國立交通大學 |
2014-12-08T15:23:05Z |
Thermal-Aware Logic Block Placement for 3D FPGAs Considering Lateral Heat Dissipation
|
Huang, Juinn-Dar; Huang, Ya-Shih; Hsu, Mi-Yu; Chang, Han-Yuan |
| 國立臺灣科技大學 |
2016 |
Thermal-aware MapReduce real-time scheduling in heterogeneous server systems
|
Tang, Tang T.-C;Chen, Y.-S. |
| 元智大學 |
2015-08-04 |
Thermal-aware Memory Mapping for Three-dimensional Block-based SRAM Architecture
|
Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su |
| 國立臺灣科技大學 |
2012 |
Thermal-aware real-time task scheduling for three-dimensional multicore chip
|
Tsai, T.-H.;Chen, Y.-S. |
| 臺大學術典藏 |
2020-06-16T06:36:16Z |
Thermal-aware router-sharing architecture for 3D network-on-chip designs
|
Huang, Y.-R.;Pan, J.-H.;Lu, Y.-C.; Huang, Y.-R.; Pan, J.-H.; Lu, Y.-C.; YI-CHANG LU |
| 國立臺灣科技大學 |
2012 |
Thermal-aware service rate adjustment for cyber-physical systems
|
Chu, H.-H.;Tsai, T.-H.;Chen, Y.-S. |
| 元智大學 |
2014-04-11 |
Thermal-aware task mapping for reconfigurable channel decoding
|
Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su |
| 元智大學 |
2014-08-05 |
Thermal-aware task mapping for three-dimensional reconfigurable channel decoding
|
Shu-Yen Lin; Cheng-Hung Lin; Ho-Yun Su |
| 臺大學術典藏 |
2018-09-10T09:25:31Z |
Thermal-aware Test Schedule and TAM Co-Optimization for Three Dimensional IC
|
C. J. Shih;C. Y. Hsu;C. Y. Kou;J. C. M. Li;J. C. Rau;K. Chakrabarty; C. J. Shih; C. Y. Hsu; C. Y. Kou; J. C. M. Li; J. C. Rau; K. Chakrabarty; CHIEN-MO LI |
| 淡江大學 |
2012-10-18 |
Thermal-Aware Test Schedule and TAM Co-Optimization for Three-Dimensional IC
|
Shih, Chi-Jih; Hsu, Chih-Yao; Kuo, Chun-Yi; Li, James; Rau, Jiann-Chyi; Krishnendu Chakrabarty |
| 臺大學術典藏 |
2018-09-10T08:47:25Z |
Thermal-aware Test scheduling for 3D ICs
|
CY Hsu; JCM Li; K. Chakrbarty; CHIEN-MO LI |
| 臺大學術典藏 |
2020-01-06T03:05:17Z |
Thermal-capillary analysis of floating-zone growth of tube crystals: steady-state and conduction dominated calculations
|
Lan, C.W.; CHUNG-WEN LAN |
| 中華大學 |
2003 |
Thermal-chemical polishing device and method thereof
|
馬廣仁; Ma, Kung-Jen |
| 淡江大學 |
2003-05-27 |
Thermal-chemical polishing devices and method thereof
|
趙崇禮; Chao, Choung-lii; Ma, Kung-jeng; Lin, Hung-yi |
| 元智大學 |
May-22 |
Thermal-constrained memory management for three-dimensional DRAM-PCM memory with deep neural network applications
|
Shu-Yen Lin; Shao-Cheng Wang |
| 國立交通大學 |
2015-12-02T02:59:38Z |
Thermal-Constrained Task Scheduling on 3-D Multicore Processors for Throughput-and-Energy Optimization
|
Liao, Chien-Hui; Wen, Charles H. -P. |
| 元智大學 |
Mar-17 |
Thermal-controlled Design Flow for the Three-dimensional Dual-mode Forward Error Correction Architecture
|
Shu-Yen Lin; Ho-Yun Su; Cheng-Hung Lin |
| 國立臺灣科技大學 |
2011 |
THERMAL-DIFFUSION AND DIFFUSION-THERMO EFFECTS ON NATURAL CONVECTION ALONG AN INCLINED STRETCHING SURFACE IN A POROUS MEDIUM WITH CHEMICAL REACTION
|
Huang, J.S.;Tsai, R.;Huang, K.H.;Huang, C.H. |
| 臺大學術典藏 |
2018-09-10T07:36:54Z |
Thermal-driven analog placement considering device matching
|
Lin, P.-H.;Zhang, H.;Wong, M.D.F.;Chang, Y.-W.; Lin, P.-H.; Zhang, H.; Wong, M.D.F.; Chang, Y.-W.; YAO-WEN CHANG |
| 臺大學術典藏 |
2018-09-10T08:42:36Z |
Thermal-driven analog placement considering device matching
|
YAO-WEN CHANG; Chang, Y.-W.; Wong, M.D.F.; Lin, M.P.-H.; Zhang, H.; Lin, M.P.-H.;Zhang, H.;Wong, M.D.F.;Chang, Y.-W. |
