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Institution Date Title Author
國立政治大學 2015 Thermoelectric properties optimization of Fe2VGa by tuning electronic density of states via titanium doping Wei, Pai-Chun;Huang, Ta-Sung;Lin, Shu-Wei;Guo, Guang-Yu;Chen, Yang-Yuan; 黃大頌;陳洋元
臺大學術典藏 2018-09-10T15:22:05Z Thermoelectric properties optimization of Fe2VGa by tuning electronic density of states via titanium doping Wei, P.-C.; Huang, T.-S.; Lin, S.-W.; Guo, G.-Y.; Chen, Y.-Y.; GUANG-YU GUO
國立交通大學 2016-03-28T00:04:23Z Thermoelectric property and x-ray absorption near edge structure studies on Si-doped CaMnO3-delta Liu, Chia-Jyi; Bhaskar, Ankam; Yuan, J. J.; Yang, Zong-Ren; Chen, Shih-Show; Chen, Huang-Chin; Liao, Fan-Wei; Lin, Yu Ting; Yeh, Ping Hung; Lai, Chun-Yen; Chang, Ching-Lin
淡江大學 2015/11/22 Thermoelectric property and x-ray absorption near edge structure studies on Si-doped CaMnO3−δ Liu, Chia-Jyi;Bhaskar, Ankam;Yuan, J.J.;Yang, Zong-Ren;Chen, Shih-Show;Chen, Huang-Chin;Liao, Fan-Wei;Lin, Yu Ting;Yeh, Ping Hung;Lai, Chun-Yen;Chang, Ching-Lin
臺大學術典藏 2018-09-10T06:27:05Z Thermoelectric signature of the excitation spectrum of a quantum dot Dzurak, A.S.;Smith, C.G.;Barnes, C.H.W.;Pepper, M.;Mart{\\'i; Dzurak, A.S.; Smith, C.G.; Barnes, C.H.W.; Pepper, M.; Mart{\\'i; CHI-TE LIANG
臺大學術典藏 2021-09-02T00:04:00Z Thermoelectric transport of the half-filled lowest Landau level in a p-type Ge/SiGe heterostructure Liu X;Lu T.-M;Harris C.T;Lu F.-L;Liu C.-Y;Li J.-Y;Liu C.W;Du R.-R.; Liu X; Lu T.-M; Harris C.T; Lu F.-L; Liu C.-Y; Li J.-Y; Liu C.W; Du R.-R.; CHEE-WEE LIU
國立臺灣大學 2009-12 Thermoelectric Water-Cooling Device Applied to Electronic Equipment Huang, H. S.; Weng, Y. C.; Chang, Y. W.; Chen, S. L.
國立臺灣大學 2010 Thermoelectric water-cooling device applied to electronic equipment Huang, Hsiang-Sheng; Weng, Ying-Che; Chang, Yu-Wei; Chen, Sih-Li; Ke, Ming-Tsun
國立臺灣大學 1995-03 THERMOELECTRIC-POWER STUDY ON HIGH-T-C BI-2212 AND BI-2223 OXIDES INTERCALATED WITH ORGANIC-MOLECULES ZINCPHTHALOCYANINE HUANG, ZJ; LIN, JG; LIN, JJ; et al.
國立臺灣海洋大學 2012-04 Thermoelectrics with earth abundant elements: high performance p-type PbS nanostructured with SrS and CaS. Zhao LD1; He J; Wu CI; Hogan TP; Zhou X; Uher C; Dravid VP; Kanatzidis MG
國立成功大學 2012-03 Thermogelling polymers composed of poly(cyclohexylenedimethylene adipate) and poly(ethylene glycol) Tsai, Yuhsin; Jheng, Li-Cheng; Hsu, Steve Lien-Chung
中國醫藥大學 2012-03 Thermogelling polymers composed of poly(cyclohexylenedimethylene adipate) and poly(ethylene glycol) 蔡育勳(Yuhsin Tsai)*;(Li-Cheng Jheng);(Lien-Chung Hsu)
國立臺灣大學 2000-06 Thermographic study of palmar and facial skin temperature of hyperhidrosis patients before and after thoracic sympathectomy Tsai, JC; Lim, KB; Lin, SY; Kao, MC
臺大學術典藏 2018-09-10T03:31:46Z Thermographic study of palmar and facial, skin temperature of hyperhidrosis patients before and after thoracic sympathectomy Tsai, J.-C. and Lim, K.-B. and Lin, S.-Y. and Kao, M.-C.; JUI-CHANG TSAI
臺大學術典藏 2020-02-27T03:47:05Z Thermographic study of palmar and facial, skin temperature of hyperhidrosis patients before and after thoracic sympathectomy Jui-Chang Tsai;Lim K.-B.;Lin S.-Y.;Kao M.-C.; JUI-CHANG TSAI; Lim K.-B.; Lin S.-Y.; Kao M.-C.
國立臺灣大學 1993-09 Thermography in Pain Clinic 林慶美; 吳宗正; 林仙養; 劉健強; Lim, K. B.; Wu, T. J.; Lin, Shian-Yeang; Liu, Chien-Chiang
國立成功大學 2013-05 Thermogravimetric analysis and kinetics of co-pyrolysis of raw/torrefied wood and coal blends Lu, Ke-Miao; Lee, Wen-Jhy; Chen, Wei-Hsin; Lin, Ta-Chang
國立臺灣大學 2000-02 Thermogravimetric Analysis of Activated Sludge Flocculated with Polyelectrolyte. Chu, C.P.; Chang, C.Y.; Lee, D.J.
國立臺灣大學 2001-02 Thermogravimetric Analysis of Corn Cob Impregnated with Zinc Chloride for Preparation of Activated Carbon. Tsai, W.T.; Chang, C.Y.; Wang, S.Y.; Lee, S.L.
國立成功大學 2017 Thermogravimetric analysis of sludge pyrolysis oil mixed with heavy fuel oil Chatelier, S.;Kuan, Y.H.;Chen, G.-B.;Lin, H.-T.;Lin, T.-H.
國家衛生研究院 2004-06-07 Thermoinactivaion analysis of vacuolar H+-pyrophosphatase Yang, SH; Jiang, SS; Hsiao, YY; Van, RC; Pan, YJ; Pan, RL
亞洲大學 2011-06 Thermokinetic parameters and thermal hazard evaluation for three organic peroxides by DSC and TAM III Shang-Hao Liu;Chun-Ping Lin;Chi-Min Shu
義守大學 2015-11 Thermolability, enzymatic degradation and aminolysis of solution-grown single crystals of novel poly(ethylene succinate-co-5mol% trimethylene succinate)s Wen-Chuan Hsieh;Guan-Cheng Chen;Chun-Che Sung;Ken-Ichi Kasuya;Yuya Tachibana;Chi-he Chen;Ming Chen;Tzong-Rong Ling;Chih-Pong Chang
國立交通大學 2014-12-08T15:06:01Z THERMOLUMINESCENT RESPONSE OF THULIUM ACTIVATED CALCIUM FLUORIDES TO COPPER K-ALPHA X-RADIATION CHIOU, BS; LIU, JI; HSU, PC; WENG, PS
臺大學術典藏 2018-09-10T06:57:17Z Thermolysis of tert-butyl cubanepercarboxylate. The cubyl radical Luh, T.-Y.;Stock, L.M.; Luh, T.-Y.; Stock, L.M.; TIEN-YAU LUH
國立成功大學 2013-03 Thermomagnetic characterization in AISI 316L austenitic stainless steel fibers with various true strains Yang, Shun-Tung; Shyr, Tien-Wei; Hwang, Weng-Sing; Ko, Cheng-Nan
國立臺灣大學 1996 Thermomagnetic effect in ferrofluids with weakly coupled particles Jang, I. J.; Yao, Y. D.; Klik, I.; Horng, H. E.; Yang, H. C.
東海大學 2010 Thermomagnetic irreversibility and magnetic short range ordering in Mn2.5Co0.5O4 tetragonal spinel thin films 王昌仁; Kuo, K.M., Chern, G., Li, Y.Y. and Wang, C.R.
國立交通大學 2020-10-05T02:00:30Z THERMOMAGNETIC MICRO-TRACKS-GUIDED MAGNETIC BEAD MANIPULATION: A DEMONSTRATION OF MOVING BEAD ACROSS DIFFERENT TRACKS ENABLED BY NOVEL EMBEDDED ON-CHIP MICRO HEATING WIRES Fang, Lin-Huei; Duan, Hao; Chen, Chin-Chung; Cheng, Chin-Cheng; Chung, Tien-Kan
國立臺灣大學 1993-11 Thermomagnetic Properties of Hysteresis, Coercivity and Dynamic Switching Field Distribution in Micromagnets 黃暉理; Huang, Huei-Li
國立臺灣大學 1995 Thermomagnetics of reversible transverse susceptibility Yang, Jyh-Shinn; Chang, Ching-Ray; Klik, Ivo
臺大學術典藏 2019-12-20T01:17:41Z Thermomagnetics of Reversible Transverse Susceptibility Yang, Js;Chang, Cr;Klik, I.; Yang, Js; Chang, Cr; Klik, I.; CHING-RAY CHANG
國立成功大學 2008-05-15 Thermomechanical and optical characteristics of stretched polyvinylidene fluoride Chang, Wen-Yang; Fang, Te-Hua; Lin, Yu-Cheng
國立高雄第一科技大學 2004.04 Thermomechanical Behavior of Underfill/Solder Mask/Substrate Interface UnderThermal Cycling C.-H.Chien;Y.-C.Chen, C.-C;Hsieh, Y.-T.;Chiou;Y.-D.Wu;Chen, T.-R; 謝其昌
臺大學術典藏 2018-09-10T05:58:00Z Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits Gleskova, H.; Cheng, I.-C.; Wagner, S.; Suo, Z.; I-CHUN CHENG
義守大學 2005-07 Thermomechanical effects on adsorbed water in clays around a heat source Chenmin Ma;Tomasz Hueckel
國立臺灣大學 2010 Thermomechanical models for the dynamics and melting processes in the Mariana subduction system Lin, Shu-Chuan; Kuo, Ban-Yuan; Chung, Sun-Lin
國立成功大學 2022-03-25 Thermomechanical properties of cold-sprayed copper coatings from differently fabricated powders Wei;Jun, Fu;chou;Yen, Bang;Fung;Zhong, Kuan;Tsai;Yi, Shu
國立中山大學 2007 Thermomechanical Properties of Nanosilica Reinforced PEEK Composites Y.H. Lai;M.C. Kuo;J.C. Huang;M. Chen
國立中山大學 2007 Thermomechanical Properties of Nanosilica Reinforced PEEK Composites Y.H. Lai;M.C. Kuo;J.C. Huang;M. Chen
國立中山大學 2006-10-22 Thermomechanical Properties of Nanosilica Reinforced PEEK Composites Y.H. Lai;M.C. Kuo;J.C. Huang;M. Chen
國立臺灣海洋大學 1995 Thermomechanical Response Analysis of Lithographic Mask Structure Using FEM D. C. Li;S. W. Chyuan;J. T. Chen;C. Y. Sun
國立中山大學 2000 Thermomechanical Treatment in Processing High Strain Rate Superplastic 6061 Al with 1% SiO2?nano-Particles T.D. Wang;J.C. Huang
中華大學 2005 Thermometer Code Current Mode 8-bits Digital-to-Analog Converter Design 林君明; Lin, Jium-Ming
臺大學術典藏 2018-09-10T15:21:01Z Thermometry for Dirac fermions in graphene Hsu, C.-S.; Lo, S.-T.; Chuang, C.; Huang, L.-I.; Woo, T.-P.; Liang, C.-T.; Fukuyama, Y.; Yang, Y.; Elmquist, R.E.; Wang, P.; Lin, X.; Liu, F.-H.; CHI-TE LIANG et al.
臺大學術典藏 2019-12-27T01:16:42Z Thermometry for Dirac fermions in graphene Liu, F.-H.; Hsu, C.-S.; Lo, S.-T.; Chuang, C.; Huang, L.-I.; Woo, T.-P.; Liang, C.-T.; Fukuyama, Y.; Yang, Y.; Elmquist, R.E.; Wang, P.; Lin, X.; TAK-PONG WOO
國立交通大學 2014-12-08T15:30:49Z Thermomigration in eutectic-SnPb solder with Cu UBM at the room temperature Lin, Jie An; Chen, Chih
國立交通大學 2014-12-08T15:14:17Z Thermomigration in flip-chip SnPb solder joints under alternating current stressing Hsiao, Hsiang-Yao; Chen, Chih
國立交通大學 2014-12-08T15:09:48Z Thermomigration in Pb-free SnAg solder joint under alternating current stressing Hsiao, Hsiang-Yao; Chen, Chih
國立交通大學 2014-12-08T15:29:18Z Thermomigration in solder joints Chen, Chih; Hsiao, Hsiang-Yao; Chang, Yuan-Wei; Ouyang, Fanyi; Tu, K. N.

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